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Etching Mechanism of Vitreous Silicon Dioxide in HF-Based Solutions

Journal of the American Chemical Society, 2000-05, Vol.122 (18), p.4345-4351

Knotter, D. Martin

2000

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Cl-Containing Microplastics from the Environment

Solid state phenomena, 2021-02, Vol.314, p.29-33

2021

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Etching Mechanism of Silicon Nitride in HF-Based Solutions

Journal of the Electrochemical Society, 2001, Vol.148 (3), p.F43

2001

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Bond pad surface quality for reliable wire bonding

Microelectronic engineering, 2011-12, Vol.88 (12), p.3452-3458

2011

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Identification of foreign particles in packages of failed products by application of our modified failure analysis flow

Microelectronics and reliability, 2017-09, Vol.76-77, p.426-430

2017

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Silicon Surface Roughening Mechanisms in Ammonia Hydrogen Peroxide Mixtures

Journal of the Electrochemical Society, 2000-02, Vol.147 (2), p.736

2000

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Determination of Fluoride Concentration on Aluminum Bond Pads Using Liquid Phase Extraction Ion Chromatography

Solid state phenomena, 2013, Vol.195, p.139-142

2013

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Impact of particles in ultra pure water on random yield loss in IC production

Microelectronic engineering, 2009-02, Vol.86 (2), p.140-144

2009

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A new class of organocopper and organocuprate compounds derived from copper(I) arenethiolates

Journal of the American Chemical Society, 1992-04, Vol.114 (9), p.3400-3410

1992

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Particle Concentration Measurements in Process Liquids Using Light-Scattering Techniques

Particulate science and technology, 2007-09, Vol.25 (5), p.435-447

2007

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Synthesis and properties of trimeric ortho-chelated (arenethiolato)copper(I) complexes

Inorganic chemistry, 1991-08, Vol.30 (17), p.3309-3317

1991

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Ozone-Gas Concentration Measurements for Photoresist Stripping

Solid state phenomena, 2003-05, Vol.92, p.223-226

2003

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Luminescence of copper(I) arenethiolates and its relation to copper(I) luminescence in other complexes

Inorganic chemistry, 1992-05, Vol.31 (11), p.2196-2201

1992

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Impact of Organic Contamination on Thin Gate Oxide Quality

Japanese Journal of Applied Physics, 1998-09, Vol.37 (9R), p.4649

1998

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A Novel Resist and Post-Etch Residue Removal Process Using Ozonated Chemistry

Solid state phenomena, 1999-01, Vol.65-66, p.165-168

1999

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New aspects of chiral heteroorganocuprates and an x-ray crystal structure with unprecedented magnesium-sulfur bonds

Journal of the American Chemical Society, 1990-07, Vol.112 (15), p.5895-5896

1990

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Synthetic studies towards gelsemine, I The importance of the antiperiplanar effect in the highly regioselective reduction of non-symmetrical cis-hexahydrophthalimides

Tetrahedron, 1987, Vol.43 (21), p.5019-5030

1987

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Impact of Metal-Ion Contaminated Silica Particles on Gate Oxide Integrity

Solid state phenomena, 2009, Vol.145-146, p.131-134

2009

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Reduced Particle Removal Efficiency Upon Wafer Storage

Solid state phenomena, 2009, Vol.145-146, p.61-64

2009

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Local Distribution of Particles Deposited on Patterned Surfaces

Solid state phenomena, 2009, Vol.145-146, p.65-68

2009

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Bis-ortho-chelated arylcopper compounds. Synthesis and x-ray crystal structure of Cu4Br2[C6H3(CH2NMe2)2-o,o']2

Organometallics, 1989-01, Vol.8 (1), p.94-99

1989

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Yield Impact of Backside Metal-Ion Contamination

Solid state phenomena, 2012, Vol.187, p.287-290

2012

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In Situ Particle Removal Studies Using an Optical Particle Counter

Solid state phenomena, 2008, Vol.134, p.189-192

2008

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Particles in Semiconductor Processing

Developments in Surface Contamination and Cleaning - Particle Deposition, Control and Removal, 2010, p.1-1

2010

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The Chemistry of Wet Surface Preparation: Cleaning, Etching and Drying

Chemistry in Microelectronics, 2013

2013

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Etching Mechanism of Vitreous Silicon Dioxide in HF-Based Solutions

Cl-Containing Microplastics from the Environment

Etching Mechanism of Silicon Nitride in HF-Based Solutions

Bond pad surface quality for reliable wire bonding

Identification of foreign particles in packages of failed products by application of our modified failure analysis flow

Silicon Surface Roughening Mechanisms in Ammonia Hydrogen Peroxide Mixtures

Determination of Fluoride Concentration on Aluminum Bond Pads Using Liquid Phase Extraction Ion Chromatography

Impact of particles in ultra pure water on random yield loss in IC production

A new class of organocopper and organocuprate compounds derived from copper(I) arenethiolates

Particle Concentration Measurements in Process Liquids Using Light-Scattering Techniques

Synthesis and properties of trimeric ortho-chelated (arenethiolato)copper(I) complexes

Ozone-Gas Concentration Measurements for Photoresist Stripping

Luminescence of copper(I) arenethiolates and its relation to copper(I) luminescence in other complexes

Impact of Organic Contamination on Thin Gate Oxide Quality

A Novel Resist and Post-Etch Residue Removal Process Using Ozonated Chemistry

New aspects of chiral heteroorganocuprates and an x-ray crystal structure with unprecedented magnesium-sulfur bonds

Synthetic studies towards gelsemine, I The importance of the antiperiplanar effect in the highly regioselective reduction of non-symmetrical cis-hexahydrophthalimides

Impact of Metal-Ion Contaminated Silica Particles on Gate Oxide Integrity

Reduced Particle Removal Efficiency Upon Wafer Storage

Local Distribution of Particles Deposited on Patterned Surfaces

Bis-ortho-chelated arylcopper compounds. Synthesis and x-ray crystal structure of Cu4Br2[C6H3(CH2NMe2)2-o,o']2

Yield Impact of Backside Metal-Ion Contamination

In Situ Particle Removal Studies Using an Optical Particle Counter

Particles in Semiconductor Processing

The Chemistry of Wet Surface Preparation: Cleaning, Etching and Drying

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