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Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-02, Vol.1 (2), p.220-233

2011

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Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel

IEEE transactions on electromagnetic compatibility, 2016-12, Vol.58 (6), p.1747-1759

2016

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PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-02, Vol.1 (2), p.208-219

2011

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Quantifying Radiation and Physics From Edge-Coupled Signal Connectors

IEEE transactions on electromagnetic compatibility, 2015-08, Vol.57 (4), p.780-787

2015

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Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-11, Vol.3 (11), p.1891-1906

2013

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Measurement and Analysis of a High-Speed TSV Channel

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-10, Vol.2 (10), p.1672-1685

2012

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Analysis of Power Distribution Network in glass, silicon interposer and PCB

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2014, p.470-474

2014

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Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-12, Vol.2 (12), p.2057-2070

2012

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A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission

IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-01, Vol.5 (1), p.28-39

2015

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Modeling electromagnetic radiation at high-density PCB/connector interfaces

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2014, p.97-102

2014

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Electrical characterization of bump-less high speed channel on silicon, organic and glass interposer

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2014, p.850-854

2014

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Analysis and Solution for RF Interference Caused by PMIC Noise in Mobile Platforms

IEEE transactions on electromagnetic compatibility, 2020-06, Vol.62 (3), p.682-690

2020

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Protection of a delay-locked loop from simultaneous switching noise coupling using an on-chip electromagnetic bandgap structure

2012 IEEE International Symposium on Electromagnetic Compatibility, 2012, p.544-548

2012

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SMPS Ringing Noise Modeling and Managing Methodology for RFI Solutions in Mobile Platforms

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-04, Vol.8 (4), p.554-561

2018

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Signal and power integrity analysis in 2.5D integrated circuits (ICs) with glass, silicon and organic interposer

2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.738-743

2015

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Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.2139-2144

2017

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SMPS noise modeling and analysis in mobiles at 3-level buck converter-based fast charging mode

2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2017, p.232-234

2017

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Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method

IEEE transactions on advanced packaging, 2010-08, Vol.33 (3), p.647-659

2010

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A slope and amplitude controllable triangular-current generator for the injection of a broad-band PDN noise

IEEE electromagnetic compatibility magazine, 2016-01, Vol.5 (4), p.112-116

2016

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SMPS noise managing methodology for RFI solution in mobile platforms

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2016, p.21-23

2016

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A fast and accurate statistical eye-diagram estimation method for high-speed channel including non-linear receiver buffer circuit

2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 2015, p.94-97

2015

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Power distribution network design and optimization based on frequency dependent target impedance

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015, p.89-92

2015

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Analysis and optimization of a power distribution network in 2.5D IC with glass interposer

2014 International 3D Systems Integration Conference (3DIC), 2014, p.1-4

2014

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Statistical estimation of characteristic impedance distribution caused by PCB manufacturing process variation in high-speed mobile channels

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015, p.193-196

2015

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Effects of on-chip decoupling capacitors and silicon substrate on power distribution networks in TSV-based 3D-ICs

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.690-697

2012

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Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

Quantifying Radiation and Physics From Edge-Coupled Signal Connectors

Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs

Measurement and Analysis of a High-Speed TSV Channel

Analysis of Power Distribution Network in glass, silicon interposer and PCB

Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission

Modeling electromagnetic radiation at high-density PCB/connector interfaces

Electrical characterization of bump-less high speed channel on silicon, organic and glass interposer

Analysis and Solution for RF Interference Caused by PMIC Noise in Mobile Platforms

Protection of a delay-locked loop from simultaneous switching noise coupling using an on-chip electromagnetic bandgap structure

SMPS Ringing Noise Modeling and Managing Methodology for RFI Solutions in Mobile Platforms

Signal and power integrity analysis in 2.5D integrated circuits (ICs) with glass, silicon and organic interposer

Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects

SMPS noise modeling and analysis in mobiles at 3-level buck converter-based fast charging mode

Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method

A slope and amplitude controllable triangular-current generator for the injection of a broad-band PDN noise

SMPS noise managing methodology for RFI solution in mobile platforms

A fast and accurate statistical eye-diagram estimation method for high-speed channel including non-linear receiver buffer circuit

Power distribution network design and optimization based on frequency dependent target impedance

Analysis and optimization of a power distribution network in 2.5D IC with glass interposer

Statistical estimation of characteristic impedance distribution caused by PCB manufacturing process variation in high-speed mobile channels

Effects of on-chip decoupling capacitors and silicon substrate on power distribution networks in TSV-based 3D-ICs

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