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The Effects of Growth Temperature and Substrate Tilt Angle on GaInP/GaAs Tandem Solar Cells

JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, 2009, 9(2), , pp.91-97

2009

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Packaging effects on Q factor of MEMS resonator

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017, p.1-4

2017

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The Study on Developer Containing Surfactant for ArF Lithography Process

Journal of photopolymer science and technology, 2004, Vol.17 (4), p.549-555

2004

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Fabrication and damping capacity of CuZnAl matrix composites processed by powder metallurgy route

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 1993-06, Vol.165 (1), p.35-43

1993

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Sub-50 nm high density direct electron beam patterning on insulating substrate

10th IEEE International Conference on Nanotechnology, 2010, p.394-397

2010

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IEEE_Xplore

Enhanced light extraction of GaN-based LEDs with various shape and geometric lattice photonic crystal structures

10th IEEE International Conference on Nanotechnology, 2010, p.308-311

2010

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IEEE_Xplore

Observations of grain boundary structure in zinc

Philosophical magazine. A, Physics of condensed matter. Defects and mechanical properties, 1991-05, Vol.63 (5), p.1023-1033

1991

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The Study on Dcvel.oper Containing Surfactant for ArF Lihtography Process

Journal of Photopolymer Science and Technology, 2004, Vol.17(4), pp.549-555

2004

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Thermal effects on grain boundary structure in HCP crystals

Shin, Kisoo

1990

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ProQuest

On the Applicability of Continuity of Structure Ideas to Grain Boundaries in Hcp Metals

MRS proceedings, 1988, Vol.122, Article 121

1988

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Dry post-etch treatment using SF6 chemistry for O.2μm contact hole

Japanese journal of applied physics, 1995, Vol.34 (9A), p.5001-5005

1995

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Dislocation structures in large-angle grain boundaries in hexagonal close-packed materials

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 1989-07, Vol.113 (1-2), p.121-127

1989

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Dry Post-Etch Treatment using SF 6 Chemistry for 0.2 µm Contact Hole

Japanese Journal of Applied Physics, 1995-09, Vol.34 (9R), p.5001

1995

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A 0.08 /spl mu/m/sup 2/-sized 8F/sup 2/ stack DRAM cell for multi-gigabit DRAM

2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303), 2002, p.56-57

2002

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IEEE_Xplore

A 0.08μm2-sized 8F2 Stack DRAM cell for multi-gigabit DRAM

2002

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Vehicular level battery modeling and its application to battery electric vehicle simulation

Journal of power sources, 2023-02, Vol.556, p.232531, Article 232531

2023

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NMF-Based Speech Enhancement Using Bases Update

IEEE signal processing letters, 2015-04, Vol.22 (4), p.450-454

2015

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IEEE_Xplore

NMF-based Target Source Separation Using Deep Neural Network

IEEE signal processing letters, 2015-02, Vol.22 (2), p.229-233

2015

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IEEE_Xplore

Robust graphene wet transfer process through low molecular weight polymethylmethacrylate

Carbon (New York), 2016-03, Vol.98, p.352-357

2016

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Boiling Histotripsy-induced Partial Mechanical Ablation Modulates Tumour Microenvironment by Promoting Immunogenic Cell Death of Cancers

Scientific reports, 2019-06, Vol.9 (1), p.9050-12, Article 9050

2019

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One-pot simple and highly thermally stable PI-film separators for Li-ion batteries

Materials letters, 2024-06, Vol.364, p.136358, Article 136358

2024

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ER stress attenuation by Aloe-derived polysaccharides in the protection of pancreatic β-cells from free fatty acid-induced lipotoxicity

Biochemical and biophysical research communications, 2018-06, Vol.500 (3), p.797-803

2018

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String-Based Molecule Generation Via Multi-Decoder VAE

ICASSP 2023 - 2023 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP), 2023, p.1-5

2023

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IEEE_Xplore

Low-energy spin dynamics of orthoferrites AFeO3 (A = Y, La, Bi)

Journal of physics. Condensed matter, 2018-05, Vol.30 (23), p.235802-235802

2018

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Effects of Cooling Conditions on Tensile and Charpy Impact Properties of API X80 Linepipe Steels

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2010-02, Vol.41 (2), p.329-340

2010

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The Effects of Growth Temperature and Substrate Tilt Angle on GaInP/GaAs Tandem Solar Cells

Packaging effects on Q factor of MEMS resonator

The Study on Developer Containing Surfactant for ArF Lithography Process

Fabrication and damping capacity of CuZnAl matrix composites processed by powder metallurgy route

Sub-50 nm high density direct electron beam patterning on insulating substrate

Enhanced light extraction of GaN-based LEDs with various shape and geometric lattice photonic crystal structures

Observations of grain boundary structure in zinc

The Study on Dcvel.oper Containing Surfactant for ArF Lihtography Process

Thermal effects on grain boundary structure in HCP crystals

On the Applicability of Continuity of Structure Ideas to Grain Boundaries in Hcp Metals

Dry post-etch treatment using SF6 chemistry for O.2μm contact hole

Dislocation structures in large-angle grain boundaries in hexagonal close-packed materials

Dry Post-Etch Treatment using SF 6 Chemistry for 0.2 µm Contact Hole

A 0.08 /spl mu/m/sup 2/-sized 8F/sup 2/ stack DRAM cell for multi-gigabit DRAM

A 0.08μm2-sized 8F2 Stack DRAM cell for multi-gigabit DRAM

Vehicular level battery modeling and its application to battery electric vehicle simulation

NMF-Based Speech Enhancement Using Bases Update

NMF-based Target Source Separation Using Deep Neural Network

Robust graphene wet transfer process through low molecular weight polymethylmethacrylate

Boiling Histotripsy-induced Partial Mechanical Ablation Modulates Tumour Microenvironment by Promoting Immunogenic Cell Death of Cancers

One-pot simple and highly thermally stable PI-film separators for Li-ion batteries

ER stress attenuation by Aloe-derived polysaccharides in the protection of pancreatic β-cells from free fatty acid-induced lipotoxicity

String-Based Molecule Generation Via Multi-Decoder VAE

Low-energy spin dynamics of orthoferrites AFeO3 (A = Y, La, Bi)

Effects of Cooling Conditions on Tensile and Charpy Impact Properties of API X80 Linepipe Steels

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