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Fourier transform infrared spectroscopy investigation of chemical bonding in low-k a-SiC:H thin films

Journal of non-crystalline solids, 2011-07, Vol.357 (15), p.2970-2983

2011

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Defect-induced bandgap narrowing in low-k dielectrics

Applied physics letters, 2015-08, Vol.107 (8)

2015

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Fracture properties of hydrogenated amorphous silicon carbide thin films

Acta materialia, 2012, Vol.60 (2), p.682-691

2012

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Thermal Conductivity Measurement of Low-k Dielectric Films: Effect of Porosity and Density

Journal of electronic materials, 2014-03, Vol.43 (3), p.746-754

2014

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Back-end-of-line a-SiOxCy:H dielectrics for resistive memory

AIP advances, 2018-09, Vol.8 (9), p.095215-095215-8

2018

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Thermal conductivity and sound velocity measurements of plasma enhanced chemical vapor deposited a-SiC:H thin films

Thin solid films, 2011-09, Vol.519 (22), p.7895-7898

2011

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Hydrogen desorption kinetics and band bending for 6H–SiC(0 0 0 1) surfaces

Surface science, 2009-10, Vol.603 (20), p.3104-3118

2009

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Laboratory Load Tests and Analysis of Bailey Bridge Segments

Journal of bridge engineering, 2013-10, Vol.18 (10), p.957-968

2013

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Detection of defect states in low-k dielectrics using reflection electron energy loss spectroscopy

Journal of applied physics, 2013-01, Vol.113 (4)

2013

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Risk Factors for Revision of Polished Taper-Slip Cemented Stems for Periprosthetic Femoral Fracture After Primary Total Hip Replacement: A Registry-Based Cohort Study from the National Joint Registry for England, Wales, Northern Ireland and the Isle of Man

Journal of bone and joint surgery. American volume, 2020-09, Vol.102 (18), p.1600-1608

2020

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Cleaning of AlN and GaN surfaces

Journal of applied physics, 1998-11, Vol.84 (9), p.5248-5260

1998

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Up-regulation of endoglin on vascular endothelial cells in human solid tumors: implications for diagnosis and therapy

Clinical cancer research, 1995-12, Vol.1 (12), p.1623-1634

1995

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Kinetics of Ga and In desorption from (7 × 7) Si(1 1 1) and (3 × 3) 6H-SiC(0 0 0 1) surfaces

Surface science, 2008-01, Vol.602 (2), p.405-415

2008

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Mass and bond density measurements for PECVD a-SiCx:H thin films using Fourier transform-infrared spectroscopy

Journal of non-crystalline solids, 2011-11, Vol.357 (21), p.3602-3615

2011

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Vascular endothelial growth factor as a marker of tumor endothelium

Cancer research (Chicago, Ill.), 1998-05, Vol.58 (9), p.1952-1959

1998

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Atomic scale trap state characterization by dynamic tunneling force microscopy

Applied physics letters, 2014-08, Vol.105 (5)

2014

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Defect structure and electronic properties of SiOC:H films used for back end of line dielectrics

Journal of applied physics, 2014-06, Vol.115 (23)

2014

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Nuclear reaction analysis for H, Li, Be, B, C, N, O and F with an RBS check

Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms, 2016-03, Vol.371, p.211-215

2016

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Articular spacers in two-stage revision arthroplasty for prosthetic joint infection of the hip and the knee

EFORT Open Reviews, 2022-02, Vol.7 (2), p.137-152

2022

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Effects of vacuum-ultraviolet irradiation on copper penetration into low-k dielectrics under bias-temperature stress

Applied physics letters, 2015-01, Vol.106 (1)

2015

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Defects and electronic transport in hydrogenated amorphous SiC films of interest for low dielectric constant back end of the line dielectric systems

Journal of applied physics, 2013-08, Vol.114 (7)

2013

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Bandgap measurements of low-k porous organosilicate dielectrics using vacuum ultraviolet irradiation

Applied physics letters, 2014-02, Vol.104 (6)

2014

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Intrinsic stress fracture energy measurements for PECVD thin films in the SioxCyNz:H system

Microelectronics and reliability, 2009-07, Vol.49 (7), p.721-726

2009

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The Effect of Edge Compliance on the Contact between a Spherical Indenter and a High-Aspect-Ratio Rectangular Fin

Experimental mechanics, 2018, Vol.58 (7), p.1157-1167

2018

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Effects of cesium ion-implantation on mechanical and electrical properties of organosilicate low-k films

Applied physics letters, 2016-05, Vol.108 (20)

2016

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Fourier transform infrared spectroscopy investigation of chemical bonding in low-k a-SiC:H thin films

Defect-induced bandgap narrowing in low-k dielectrics

Fracture properties of hydrogenated amorphous silicon carbide thin films

Thermal Conductivity Measurement of Low-k Dielectric Films: Effect of Porosity and Density

Back-end-of-line a-SiOxCy:H dielectrics for resistive memory

Thermal conductivity and sound velocity measurements of plasma enhanced chemical vapor deposited a-SiC:H thin films

Hydrogen desorption kinetics and band bending for 6H–SiC(0 0 0 1) surfaces

Laboratory Load Tests and Analysis of Bailey Bridge Segments

Detection of defect states in low-k dielectrics using reflection electron energy loss spectroscopy

Risk Factors for Revision of Polished Taper-Slip Cemented Stems for Periprosthetic Femoral Fracture After Primary Total Hip Replacement: A Registry-Based Cohort Study from the National Joint Registry for England, Wales, Northern Ireland and the Isle of Man

Cleaning of AlN and GaN surfaces

Up-regulation of endoglin on vascular endothelial cells in human solid tumors: implications for diagnosis and therapy

Kinetics of Ga and In desorption from (7 × 7) Si(1 1 1) and (3 × 3) 6H-SiC(0 0 0 1) surfaces

Mass and bond density measurements for PECVD a-SiCx:H thin films using Fourier transform-infrared spectroscopy

Vascular endothelial growth factor as a marker of tumor endothelium

Atomic scale trap state characterization by dynamic tunneling force microscopy

Defect structure and electronic properties of SiOC:H films used for back end of line dielectrics

Nuclear reaction analysis for H, Li, Be, B, C, N, O and F with an RBS check

Articular spacers in two-stage revision arthroplasty for prosthetic joint infection of the hip and the knee

Effects of vacuum-ultraviolet irradiation on copper penetration into low-k dielectrics under bias-temperature stress

Defects and electronic transport in hydrogenated amorphous SiC films of interest for low dielectric constant back end of the line dielectric systems

Bandgap measurements of low-k porous organosilicate dielectrics using vacuum ultraviolet irradiation

Intrinsic stress fracture energy measurements for PECVD thin films in the SioxCyNz:H system

The Effect of Edge Compliance on the Contact between a Spherical Indenter and a High-Aspect-Ratio Rectangular Fin

Effects of cesium ion-implantation on mechanical and electrical properties of organosilicate low-k films

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