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Photo-oxidative degradation of polyacids derived ceria nanoparticle modulation for chemical mechanical polishing

Scientific reports, 2022-01, Vol.12 (1), p.1613-1613, Article 1613

2022

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Shape classification of fumed silica abrasive and its effects on chemical mechanical polishing

Powder technology, 2021-03, Vol.381, p.451-458

2021

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Free-standing two-dimensional ferro-ionic memristor

Nature communications, 2024-06, Vol.15 (1), p.5162-11, Article 5162

2024

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Stretchable optical fiber strain sensor comprising zinc oxide and PDMS for human motion monitoring

Journal of Mechanical Science and Technology, 2023, 37(6), , pp.3205-3212

2023

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Activation of nitrogen species mixed with Ar and H2S plasma for directly N-doped TMD films synthesis

Scientific reports, 2022-06, Vol.12 (1), p.10335-10335, Article 10335

2022

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Highly penetrant organic solvent-resistant layer-by-layer assembled ultra-thin barrier coating for confined microchannel devices

Composites. Part B, Engineering, 2022-02, Vol.230, p.109537, Article 109537

2022

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Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments

Friction, 2023-09, Vol.11 (9), p.1624-1640

2023

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Diamond structure-dependent pad and wafer polishing performance during chemical mechanical polishing

International journal of advanced manufacturing technology, 2018-07, Vol.97 (1-4), p.563-571

2018

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Remote‐Controllable Interfacial Electron Tunneling at Heterogeneous Molecular Junctions via Tip‐Induced Optoelectrical Engineering

Advanced science, 2024-02, Vol.11 (5), p.e2305512-n/a

2024

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Effects of trivalent lanthanide (La and Nd) doped ceria abrasives on chemical mechanical polishing

Powder technology, 2022-01, Vol.397, p.117025, Article 117025

2022

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Energy‐Band Engineering by Remote Doping of Self‐Assembled Monolayers Leads to High‐Performance IGZO/p‐Si Heterostructure Photodetectors

Advanced materials (Weinheim), 2022-02, Vol.34 (6), p.e2107364-n/a

2022

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High‐Temperature Skin Softening Materials Overcoming the Trade‐Off between Thermal Conductivity and Thermal Contact Resistance

Small (Weinheim an der Bergstrasse, Germany), 2021-09, Vol.17 (38), p.e2102128-n/a

2021

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Selective Nanoscale Fabrication with Roughness Reduction of Polycrystalline Silicon by Physically Induced Fluorine Bonds Using Atomic Force Microscope

Advanced engineering materials, 2023-08, Vol.25 (16), p.n/a

2023

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Selective Nanoscale Fabrication with Roughness Reduction of Polycrystalline Silicon by Physically Induced Fluorine Bonds Using Atomic Force Microscope

Advanced engineering materials, 2023-08, Vol.25 (16), p.n/a

2023

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Improvement of oxide removal rate in chemical mechanical polishing by forming oxygen vacancy in ceria abrasives via ultraviolet irradiation

Materials chemistry and physics, 2021-11, Vol.273, p.124967, Article 124967

2021

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Improvement of oxide chemical mechanical polishing performance by increasing Ce3+/Ce4+ ratio in ceria slurry via hydrogen reduction

Materials science in semiconductor processing, 2023-06, Vol.159, p.107349, Article 107349

2023

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Effect of ionic strength on amorphous carbon during chemical mechanical planarization

Diamond and related materials, 2022-08, Vol.127, p.109124, Article 109124

2022

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The mechanical effect of soft pad on copper chemical mechanical polishing

Materials science in semiconductor processing, 2023-03, Vol.155, p.107256, Article 107256

2023

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Development of novel multi-selective slurry with mechanically driven etching for through silicon via chemical mechanical polishing

Materials science in semiconductor processing, 2022-12, Vol.152, p.107025, Article 107025

2022

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Polishing of zirconia ceramics by chemically-induced micro-nano bubbles

Ceramics international, 2022-06, Vol.48 (12), p.17185-17195

2022

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An eddy current sensor for end-point detection in chemical mechanical planarization using composition signal filtration and a digital potentiometer

Materials science in semiconductor processing, 2024-10, Vol.181, p.108614, Article 108614

2024

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Synthesis of vertically aligned wafer-scale tantalum disulfide using high-Ar/H2S ratio plasma

Nanotechnology, 2022-01, Vol.33 (2)

2022

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Auxiliary mechanism of in-situ micro-nano bubbles in oxide chemical mechanical polishing

Precision engineering, 2022-03, Vol.74, p.20-35

2022

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Synthesis of vertically aligned wafer-scale tantalum disulfide using high-Ar/H 2 S ratio plasma

Nanotechnology, 2022-01, Vol.33 (2), p.25603

2022

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Tailoring Polymorphic Heterostructures of MoS2–WS2 (1T/1T, 2H/2H) for Efficient Hydrogen Evolution Reaction

ACS sustainable chemistry & engineering, 2023-01, Vol.11 (2), p.568-577

2023

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Photo-oxidative degradation of polyacids derived ceria nanoparticle modulation for chemical mechanical polishing

Shape classification of fumed silica abrasive and its effects on chemical mechanical polishing

Free-standing two-dimensional ferro-ionic memristor

Stretchable optical fiber strain sensor comprising zinc oxide and PDMS for human motion monitoring

Activation of nitrogen species mixed with Ar and H2S plasma for directly N-doped TMD films synthesis

Highly penetrant organic solvent-resistant layer-by-layer assembled ultra-thin barrier coating for confined microchannel devices

Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments

Diamond structure-dependent pad and wafer polishing performance during chemical mechanical polishing

Remote‐Controllable Interfacial Electron Tunneling at Heterogeneous Molecular Junctions via Tip‐Induced Optoelectrical Engineering

Effects of trivalent lanthanide (La and Nd) doped ceria abrasives on chemical mechanical polishing

Energy‐Band Engineering by Remote Doping of Self‐Assembled Monolayers Leads to High‐Performance IGZO/p‐Si Heterostructure Photodetectors

High‐Temperature Skin Softening Materials Overcoming the Trade‐Off between Thermal Conductivity and Thermal Contact Resistance

Selective Nanoscale Fabrication with Roughness Reduction of Polycrystalline Silicon by Physically Induced Fluorine Bonds Using Atomic Force Microscope

Selective Nanoscale Fabrication with Roughness Reduction of Polycrystalline Silicon by Physically Induced Fluorine Bonds Using Atomic Force Microscope

Improvement of oxide removal rate in chemical mechanical polishing by forming oxygen vacancy in ceria abrasives via ultraviolet irradiation

Improvement of oxide chemical mechanical polishing performance by increasing Ce3+/Ce4+ ratio in ceria slurry via hydrogen reduction

Effect of ionic strength on amorphous carbon during chemical mechanical planarization

The mechanical effect of soft pad on copper chemical mechanical polishing

Development of novel multi-selective slurry with mechanically driven etching for through silicon via chemical mechanical polishing

Polishing of zirconia ceramics by chemically-induced micro-nano bubbles

An eddy current sensor for end-point detection in chemical mechanical planarization using composition signal filtration and a digital potentiometer

Synthesis of vertically aligned wafer-scale tantalum disulfide using high-Ar/H2S ratio plasma

Auxiliary mechanism of in-situ micro-nano bubbles in oxide chemical mechanical polishing

Synthesis of vertically aligned wafer-scale tantalum disulfide using high-Ar/H 2 S ratio plasma

Tailoring Polymorphic Heterostructures of MoS2–WS2 (1T/1T, 2H/2H) for Efficient Hydrogen Evolution Reaction

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