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All‐Solid‐State Ion Synaptic Transistor for Wafer‐Scale Integration with Electrolyte of a Nanoscale Thickness

Advanced functional materials, 2021-06, Vol.31 (23), p.n/a

2021

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Curing of 1-Transistor-DRAM by Joule Heat From Punch-Through Current

IEEE electron device letters, 2022-03, Vol.43 (3), p.370-373

2022

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Multilayer Graphene with a Rippled Structure as a Spacer for Improving Plasmonic Coupling

Advanced functional materials, 2016-07, Vol.26 (28), p.5093-5101

2016

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A Steep-Slope Phenomenon by Gate Charge Pumping in a MOSFET

IEEE electron device letters, 2022-04, Vol.43 (4), p.521-524

2022

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Electrothermal Annealing to Enhance the Electrical Performance of an Exfoliated MoS2 Field-Effect Transistor

IEEE electron device letters, 2018-10, Vol.39 (10), p.1532-1535

2018

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Gateless and Capacitorless Germanium Biristor with a Vertical Pillar Structure

Micromachines (Basel), 2021-07, Vol.12 (8), p.899

2021

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Reconfigurable Yagi-Uda antenna based on a silicon reflector with a solid-state plasma

Scientific reports, 2017-12, Vol.7 (1), p.17232-8, Article 17232

2017

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A Poly‐Crystalline Silicon Nanowire Transistor with Independently Controlled Double‐Gate for Physically Unclonable Function by Multi‐States and Self‐Destruction

Advanced electronic materials, 2021-05, Vol.7 (5), p.n/a

2021

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On-Chip Curing by Microwave for Long Term Usage of Electronic Devices in Harsh Environments

Scientific reports, 2018-10, Vol.8 (1), p.14953-8, Article 14953

2018

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Reconfigurable Beamforming Silicon Plasma Antenna with Vertical PIN Diode Array

Advanced electronic materials, 2020-12, Vol.6 (12), p.n/a

2020

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Author Correction: A frequency reconfigurable dipole antenna with solid-state plasma in silicon

Scientific reports, 2019-05, Vol.9 (1), p.7120-7120, Article 7120

2019

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Synaptic Segmented Transistor with Improved Linearity by Schottky Junctions and Accelerated Speed by Double-Layered Nitride

ACS applied materials & interfaces, 2022-07, Vol.14 (28), p.32261-32269

2022

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A frequency reconfigurable slot dipole antenna using surface PIN diodes

2017 International Symposium on Antennas and Propagation (ISAP), 2017, p.1-2

2017

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Dynamic Response of 100 m, 200 m, 300 m Lattice Domes with LRB Seismic Isolator

Tu mu gong cheng yu jian zhu, 2019-08, Vol.13 (8)

2019

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Optimization of the intrinsic length of a PIN diode for a reconfigurable antenna

2016 International Conference on Electronics, Information, and Communications (ICEIC), 2016, p.1-4

2016

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Silicon‐Based Antennae: Reconfigurable Beamforming Silicon Plasma Antenna with Vertical PIN Diode Array (Adv. Electron. Mater. 12/2020)

Advanced electronic materials, 2020-12, Vol.6 (12), p.n/a

2020

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Effects of Wind Fences on the Wind Environment around Jang Bogo Antarctic Research Station

Advances in atmospheric sciences, 2017-12, Vol.34 (12), p.1404-1414

2017

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Method to Evaluate Fabric Contamination Due to Fine Dust

Journal of the Korean Society of Manufacturing Process Engineers, 2021-11, Vol.20 (11), p.86-91

2021

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Exploring 21st Century Capitalisms and Asia : The Impact of Financialization

Asia Review, 2016-02, Vol.5 (2), p.39

2016

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Comparing Capitalisms, East and West

Asia Review, 2016-08, Vol.6 (1), p.97

2016

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Mechanical Characteristics of Shell Members Considering the Geometrical and Material Nonlinearity

Journal of The korean Association For Spatial Structures, 2018-12, Vol.18 (4), p.31-39

2018

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Nutritional Components and Oxidative Stability of Plant Seed Oils

Emirates journal of food and agriculture, 2019-09, Vol.31 (9), p.666-673

2019

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Insect community structures along elevation gradients on Mt. Seongak-san, South Korea

Journal of forestry research, 2015-12, Vol.26 (4), p.1013-1018

2015

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The Effect of the CFRP/GFRP Composite Thickness on AE Characteristics and Mixed Mode Crack Behavior

Journal of the Korean Society of Safety, 2014-12, Vol.29 (6), p.9-14

2014

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Causal Relationship between Firms' R&D Collaboration and Performance in Contents Industry

The Journal of the Korea Contents Association, 2010-04, Vol.10 (4), p.306-316

2010

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All‐Solid‐State Ion Synaptic Transistor for Wafer‐Scale Integration with Electrolyte of a Nanoscale Thickness

Curing of 1-Transistor-DRAM by Joule Heat From Punch-Through Current

Multilayer Graphene with a Rippled Structure as a Spacer for Improving Plasmonic Coupling

A Steep-Slope Phenomenon by Gate Charge Pumping in a MOSFET

Electrothermal Annealing to Enhance the Electrical Performance of an Exfoliated MoS2 Field-Effect Transistor

Gateless and Capacitorless Germanium Biristor with a Vertical Pillar Structure

Reconfigurable Yagi-Uda antenna based on a silicon reflector with a solid-state plasma

A Poly‐Crystalline Silicon Nanowire Transistor with Independently Controlled Double‐Gate for Physically Unclonable Function by Multi‐States and Self‐Destruction

On-Chip Curing by Microwave for Long Term Usage of Electronic Devices in Harsh Environments

Reconfigurable Beamforming Silicon Plasma Antenna with Vertical PIN Diode Array

Author Correction: A frequency reconfigurable dipole antenna with solid-state plasma in silicon

Synaptic Segmented Transistor with Improved Linearity by Schottky Junctions and Accelerated Speed by Double-Layered Nitride

A frequency reconfigurable slot dipole antenna using surface PIN diodes

Dynamic Response of 100 m, 200 m, 300 m Lattice Domes with LRB Seismic Isolator

Optimization of the intrinsic length of a PIN diode for a reconfigurable antenna

Silicon‐Based Antennae: Reconfigurable Beamforming Silicon Plasma Antenna with Vertical PIN Diode Array (Adv. Electron. Mater. 12/2020)

Effects of Wind Fences on the Wind Environment around Jang Bogo Antarctic Research Station

Method to Evaluate Fabric Contamination Due to Fine Dust

Exploring 21st Century Capitalisms and Asia : The Impact of Financialization

Comparing Capitalisms, East and West

Mechanical Characteristics of Shell Members Considering the Geometrical and Material Nonlinearity

Nutritional Components and Oxidative Stability of Plant Seed Oils

Insect community structures along elevation gradients on Mt. Seongak-san, South Korea

The Effect of the CFRP/GFRP Composite Thickness on AE Characteristics and Mixed Mode Crack Behavior

Causal Relationship between Firms' R&D Collaboration and Performance in Contents Industry

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