UB Paderborn / Katalog / Suche / in CDI

1 – 25 von 391

Sortiert nach

Novel Bumping and Underfill Technologies for 3D IC Integration

ETRI journal, 2012-10, Vol.34 (5), p.706-712

Sung, Ki-Jun

2012

Link zum Volltext

Verfügbarkeit prüfen

Novel Bumping and Underfill Technologies for 3D IC Integration

ETRI Journal, 2012, 34(5), , pp.706-712

2012

Link zum Volltext

Verfügbarkeit prüfen

Novel Bumping Material for Solder‐on‐Pad Technology

ETRI Journal, 2011, 33(4), , pp.637-640

2011

Link zum Volltext

Verfügbarkeit prüfen

Novel Maskless Bumping for 3D Integration

ETRI Journal, 2010, 32(2), , pp.342-344

2010

Link zum Volltext

Verfügbarkeit prüfen

Reversed halo sign on high-resolution CT of cryptogenic organizing pneumonia: diagnostic implications

American journal of roentgenology (1976), 2003-05, Vol.180 (5), p.1251

2003

Link zum Volltext

Verfügbarkeit prüfen

A noble VFO(Vertical wire Fan Out) technology for small form factor and high performance memory applications

2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2023, p.1-4

2023

Link zum Volltext

Verfügbarkeit prüfen

Fan-out Wafer Level Package for Memory Applications

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.1349-1354

2022

Link zum Volltext
IEEE_Xplore

Vertical Fan Out(VFO) package with enhanced form factor and performances for mobile applications

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.34-39

2024

Link zum Volltext
IEEE_Xplore

Analysis of electromigration for Cu pillar bump in flip chip package

2010 12th Electronics Packaging Technology Conference, 2010, p.129-133

2010

Link zum Volltext
IEEE_Xplore

Bumping and stacking processes for 3D IC using fluxfree polymer

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.1746-1751

2011

Link zum Volltext
IEEE_Xplore

Optimized TSV process using bottom-up electroplating without wafer cracks

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.1642-1646

2010

Link zum Volltext
IEEE_Xplore

3D SiP module using TSV and novel solder bump maker

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.1637-1641

2010

Link zum Volltext
IEEE_Xplore

Solder Bump Maker with coining process on TSV chips for 3D packages

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, 2010, p.185-189

2010

Link zum Volltext
IEEE_Xplore

Novel solder-on-pad (SoP) technology for fine-pitch flip chip bonding

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, 2010, p.805-809

2010

Link zum Volltext
IEEE_Xplore

Novel bumping material for stacking silicon chips

2009 11th Electronics Packaging Technology Conference, 2009, p.579-583

2009

Link zum Volltext
IEEE_Xplore

A case of medullomyoblastoma of cerebellopontine angle mimicking acoustic neuroma

Yonsei medical journal, 2004-08, Vol.45 (4), p.719-722

2004

Link zum Volltext

Verfügbarkeit prüfen

Who are Susceptible to Pseudomembranous Colitis Among Patients with Presumed Antibiotic-Associated Diarrhea?

Diseases of the colon & rectum, 2006-10, Vol.49 (10), p.1552-1558

2006

Link zum Volltext

Verfügbarkeit prüfen

Novel Bumping Material for Solder-on-Pad Technology

ETRI journal, 2011-08, Vol.33 (4), p.637-640

2011

Link zum Volltext

Verfügbarkeit prüfen

Novel Maskless Bumping for 3D Integration

ETRI journal, 2010-04, Vol.32 (2), p.342-344

2010

Link zum Volltext

Verfügbarkeit prüfen

Relative importance of potential risk factors for dementia in patients with hypertension

PloS one, 2023-03, Vol.18 (3), p.e0281532-e0281532

2023

Link zum Volltext

Verfügbarkeit prüfen

Improved efficacy and in vivo cellular properties of human embryonic stem cell derivative in a preclinical model of bladder pain syndrome

Scientific reports, 2017-08, Vol.7 (1), p.8872-16, Article 8872

2017

Link zum Volltext

Verfügbarkeit prüfen

Revolutionizing hardness via nanoparticle flux in welding of high-hardness armor steel

Materials & design, 2024-06, Vol.242, p.113001, Article 113001

2024

Link zum Volltext

Verfügbarkeit prüfen

MicroRNA let-7a suppresses breast cancer cell migration and invasion through downregulation of C-C chemokine receptor type 7

Breast cancer research : BCR, 2012-01, Vol.14 (1), p.R14-R14, Article R14

2012

Link zum Volltext

Verfügbarkeit prüfen

Lack of the association between height and cardiovascular prognosis in hypertensive men and women: analysis of national real-world database

Scientific reports, 2022-11, Vol.12 (1), p.18953-18953, Article 18953

2022

Link zum Volltext

Verfügbarkeit prüfen

1 – 25 von 391

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(342)
Mit Volltextzugriff
(362)

Publikationsform

Sprache

Erscheinungsjahr

n.n

Thema

Science & Technology
(267)
Life Sciences & Biomedicine
(200)
Humans
(106)
Female
(75)
Male
(75)
Physical Sciences
(58)
Technology
(48)
Engineering
(40)
Animals
(39)
Middle Aged
(38)
Adult
(37)
Pharmacology & Pharmacy
(36)
Chemistry
(35)
Original
(32)
Adolescent
(25)
Biochemistry & Molecular Biology
(24)
Chemistry, Medicinal
(24)
Child
(24)
Engineering, Electrical & Electronic
(24)
Retrospective Studies
(24)

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 30 Tagen
(1)
... seit 90 Tagen
(5)

Menü

Weitere Dienste

Einstellungen

Novel Bumping and Underfill Technologies for 3D IC Integration

Novel Bumping and Underfill Technologies for 3D IC Integration

Novel Bumping Material for Solder‐on‐Pad Technology

Novel Maskless Bumping for 3D Integration

Reversed halo sign on high-resolution CT of cryptogenic organizing pneumonia: diagnostic implications

A noble VFO(Vertical wire Fan Out) technology for small form factor and high performance memory applications

Fan-out Wafer Level Package for Memory Applications

Vertical Fan Out(VFO) package with enhanced form factor and performances for mobile applications

Analysis of electromigration for Cu pillar bump in flip chip package

Bumping and stacking processes for 3D IC using fluxfree polymer

Optimized TSV process using bottom-up electroplating without wafer cracks

3D SiP module using TSV and novel solder bump maker

Solder Bump Maker with coining process on TSV chips for 3D packages

Novel solder-on-pad (SoP) technology for fine-pitch flip chip bonding

Novel bumping material for stacking silicon chips

A case of medullomyoblastoma of cerebellopontine angle mimicking acoustic neuroma

Who are Susceptible to Pseudomembranous Colitis Among Patients with Presumed Antibiotic-Associated Diarrhea?

A therapeutic neutralizing antibody targeting receptor binding domain of SARS-CoV-2 spike protein

Novel Bumping Material for Solder-on-Pad Technology

Novel Maskless Bumping for 3D Integration

Relative importance of potential risk factors for dementia in patients with hypertension

Improved efficacy and in vivo cellular properties of human embryonic stem cell derivative in a preclinical model of bladder pain syndrome

Revolutionizing hardness via nanoparticle flux in welding of high-hardness armor steel

MicroRNA let-7a suppresses breast cancer cell migration and invasion through downregulation of C-C chemokine receptor type 7

Lack of the association between height and cardiovascular prognosis in hypertensive men and women: analysis of national real-world database

Suchergebnisse filtern