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The Effect of Different Khaya Senegalensis Raw Feedstock Particle Sizes On Solid Fuel Pellet Quality

IOP conference series. Materials Science and Engineering, 2020-05, Vol.864 (1), p.12101

2020

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Fluid/Structure Interaction Analysis of the Effects of Solder Bump Shapes and Input/Output Counts on Moulded Packaging

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-04, Vol.2 (4), p.604-616

2012

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Physical properties of Sn-3.0Ag-0.5Cu lead-free solder with the additional of SiC particles

IOP conference series. Materials Science and Engineering, 2019-12, Vol.701 (1), p.12030

2019

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Antioxidant and Total Phenolic Content of Breadfruit ( Artocarpus altilis ) Leaves

MATEC Web of Conferences, 2018, Vol.150, p.6007

2018

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Biomass Fuel Characteristics of Malaysian Khaya senegalensis Wood-Derived Energy Pellets: Effects of Densification at Varied Processing Temperatures

Journal of Manufacturing and Materials Processing, 2024-04, Vol.8 (2), p.62

2024

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Chip Morphology and Surface Integrity in Turning AZ31 Magnesium Alloy under Dry Machining and Submerged Convective Cooling

Metals (Basel ), 2023-03, Vol.13 (3), p.619

2023

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Design, Modelling and Optimization of a Novel Concentrated Solar Powered (CSP) Flash Desalination System Involving Direct Heating and Pressure Modulation Using Response Surface Methodology (RSM)

Sustainability, 2022-09, Vol.14 (18), p.11558

2022

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Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

Materials, 2021-02, Vol.14 (4), p.738

2021

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Study on the fluid-structure interaction of flexible printed circuit board motherboard in personal computer casings

Microelectronics international, 2013-01, Vol.30 (3), p.138-150

2013

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Evaluating the performance of the Anwaralardh photovoltaic power generation plant in Jordan: Comparative analysis using artificial neural networks and multiple linear regression modeling

International journal of renewable energy development, 2024-07, Vol.13 (4), p.608-617

2024

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Preliminary study on the effect of Ni addition on tin (Sn) whisker growth from lead-free solder coating

IOP conference series. Materials Science and Engineering, 2020-10, Vol.957 (1), p.12062

2020

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Simulation-based optimization of plastic transfer molding parameter for thin small outline package via response surface methodology

International journal of advanced manufacturing technology, 2024-02, Vol.130 (9-10), p.5055-5073

2024

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Influence of PTH offset angle in wave soldering with thermal-coupling method

Soldering & surface mount technology, 2014-05, Vol.26 (3), p.97-109

2014

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Modelling and analysis of the effect of stacking chips with TSVs in 3D IC package encapsulation process

Maejo international journal of science and technology, 2012-05, Vol.6 (2), p.159-159

2012

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Blade Wrap Angle Impact on Centrifugal Pump Performance: Entropy Generation and Fluid-Structure Interaction Analysis

Computer modeling in engineering & sciences, 2024, Vol.140 (1), p.109-137

2024

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Visualization of Fluid/Structure Interaction in IC Encapsulation

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-08, Vol.2 (8), p.1239-1246

2012

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Study on the Fluid-Structure Interaction of Flexible Printed Circuit Board Electronics in the Flow Environment

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-08, Vol.2 (8), p.1335-1345

2012

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A review on numerical approach of reflow soldering process for copper pillar technology

International journal of advanced manufacturing technology, 2022-08, Vol.121 (7-8), p.4325-4353

2022

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Pelletization Temperature and Pressure Effects on the Mechanical Properties of IKhaya senegalensis/I Biomass Energy Pellets

Sustainability, 2023-05, Vol.15 (9)

2023

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Biomass Fuel Characteristics of Malaysian IKhaya senegalensis/I Wood-Derived Energy Pellets: Effects of Densification at Varied Processing Temperatures

Journal of Manufacturing and Materials Processing, 2024-04, Vol.8 (2)

2024

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Pelletization Temperature and Pressure Effects on the Mechanical Properties of Khaya senegalensis Biomass Energy Pellets

Sustainability, 2023-05, Vol.15 (9), p.7501

2023

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Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction

Journal of electronic materials, 2024-03, Vol.53 (3), p.1201-1213

2024

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Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material

Journal of electronic materials, 2024-03, Vol.53 (3), p.1169-1182

2024

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The Effect of Different Waste Material Binders in Relation to Khaya Senegalensis Solid Fuel Pellet Quality

Journal of Advanced Research in Applied Sciences and Engineering Technology, 2023-11, Vol.32 (3), p.151-164

2023

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A study on the effect of the number of fin valleys on the thermal performance of a bus duct conductor

Numerical heat transfer. Part A, Applications, 2023-10, Vol.84 (7), p.781-800

2023

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The Effect of Different Khaya Senegalensis Raw Feedstock Particle Sizes On Solid Fuel Pellet Quality

Fluid/Structure Interaction Analysis of the Effects of Solder Bump Shapes and Input/Output Counts on Moulded Packaging

Physical properties of Sn-3.0Ag-0.5Cu lead-free solder with the additional of SiC particles

Antioxidant and Total Phenolic Content of Breadfruit ( Artocarpus altilis ) Leaves

Biomass Fuel Characteristics of Malaysian Khaya senegalensis Wood-Derived Energy Pellets: Effects of Densification at Varied Processing Temperatures

Chip Morphology and Surface Integrity in Turning AZ31 Magnesium Alloy under Dry Machining and Submerged Convective Cooling

Design, Modelling and Optimization of a Novel Concentrated Solar Powered (CSP) Flash Desalination System Involving Direct Heating and Pressure Modulation Using Response Surface Methodology (RSM)

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

Study on the fluid-structure interaction of flexible printed circuit board motherboard in personal computer casings

Evaluating the performance of the Anwaralardh photovoltaic power generation plant in Jordan: Comparative analysis using artificial neural networks and multiple linear regression modeling

Preliminary study on the effect of Ni addition on tin (Sn) whisker growth from lead-free solder coating

Simulation-based optimization of plastic transfer molding parameter for thin small outline package via response surface methodology

Influence of PTH offset angle in wave soldering with thermal-coupling method

Modelling and analysis of the effect of stacking chips with TSVs in 3D IC package encapsulation process

Blade Wrap Angle Impact on Centrifugal Pump Performance: Entropy Generation and Fluid-Structure Interaction Analysis

Visualization of Fluid/Structure Interaction in IC Encapsulation

Study on the Fluid-Structure Interaction of Flexible Printed Circuit Board Electronics in the Flow Environment

A review on numerical approach of reflow soldering process for copper pillar technology

Pelletization Temperature and Pressure Effects on the Mechanical Properties of IKhaya senegalensis/I Biomass Energy Pellets

Biomass Fuel Characteristics of Malaysian IKhaya senegalensis/I Wood-Derived Energy Pellets: Effects of Densification at Varied Processing Temperatures

Pelletization Temperature and Pressure Effects on the Mechanical Properties of Khaya senegalensis Biomass Energy Pellets

Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction

Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material

The Effect of Different Waste Material Binders in Relation to Khaya Senegalensis Solid Fuel Pellet Quality

A study on the effect of the number of fin valleys on the thermal performance of a bus duct conductor

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