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Micro thermal management of high-power diode laser bars

IEEE transactions on industrial electronics (1982), 2001-04, Vol.48 (2), p.286-297

2001

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Modular parametric finite element modelling for reliability-studies in electronic and mems packaging

Microsystem technologies : sensors, actuators, systems integration, 2004-08, Vol.10 (5), p.375-381

2004

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Thermo-Mechanical Reliability of 3D-integrated Microstructures in Stacked Silicon

MRS proceedings, 2006, Vol.970, Article 0970-Y02-04

2006

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Microdeformation analysis of packages and interconnects to improve finite element models for reliability assessments

IEEE transactions on electronics packaging manufacturing, 2003-07, Vol.26 (3), p.239-244

2003

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Quantitative strain analysis in AlGaAs-based devices

Applied physics letters, 2003-06, Vol.82 (23), p.4193-4195

2003

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Computer aided optimization of advanced materials for liquid cooled printed circuit boards and their use in telecommunications

IECON '98. Proceedings of the 24th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.98CH36200), 1998, Vol.4, p.2321-2326 vol.4

1998

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Future aspects of MEMS in Germany [microelectromechanical systems]

IECON '98. Proceedings of the 24th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.98CH36200), 1998, Vol.4, p.2331-2335 vol.4

1998

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Packaging and microcooling of high power diode laser bars

IECON '98. Proceedings of the 24th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.98CH36200), 1998, Vol.4, p.2342-2347 vol.4

1998

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Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003, 2003, p.335-340

2003

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Measurement of thermally induced strains on flip chip and chip scale packages

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069), 2000, Vol.2, p.232-239 vol. 2

2000

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Reliability investigations on stacked chip on MEMS

2011 Semiconductor Conference Dresden, 2011, p.1-4

2011

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Thermo-mechanical FE analysis and micro deformation measurements-basis for reliability assessment of microelectronic components

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208), 1998, p.159-165

1998

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Mechanical characterisation of thin metal layers by modelling of the nanoindentation experiment

2008 2nd Electronics System-Integration Technology Conference, 2008, p.995-998

2008

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Dynamic mechanical behavior of SnAgCu BGA solder joints determined by fast shear tests and FEM simulations

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007, 2007, p.1-4

2007

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FEA based reliability prediction for different Sn-based solders subjected to fast shear and fatigue loadings

2008 International Conference on Electronic Packaging Technology & High Density Packaging, 2008, p.1-7

2008

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Integrated Thermo-Electro-Mechanical Modeling of 3D e-Cubes Structures

2007 14th International Conference on Mixed Design of Integrated Circuits and Systems, 2007, p.297-300

2007

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Design, simulation and technological realization of a reliable packaging concept for high power laser bars

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 1998, p.1395-1401

1998

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Thermal management and thermomechanical optimization at higher temperatures

HITEN 99. Third European Conference on High Temperature Electronics. (IEEE Cat. No.99EX372), 1999, p.139

1999

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Design and technology for fluxless die bonding of high power laser bars using Au(80)Sn(20)-solder

Conference Proceedings. LEOS '97. 10th Annual Meeting IEEE Lasers and Electro-Optics Society 1997 Annual Meeting, 1997, Vol.2, p.281-282 vol.2

1997

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Schulmedizin und Homöopathie bei krebskranken Kindern – (k)ein Widerspruch?: 20 Jahre homöopathische Ambulanz am Klinikum Klagenfurt

Monatsschrift Kinderheilkunde, 2019-09, Vol.167 (9), p.788-795

2019

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A severe case of haemodynamic instability during anidulafungin administration

Journal of clinical pharmacy and therapeutics, 2013-06, Vol.38 (3), p.241-242

2013

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Pulmonary Involvement in Pediatric-Onset Multisystem Langerhans Cell Histiocytosis: Effect on Course and Outcome

The Journal of pediatrics, 2012-07, Vol.161 (1), p.129-133.e3

2012

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The inferior prognosis of adolescents with acute lymphoblastic leukaemia (ALL) is caused by a higher rate of treatment‐related mortality and not an increased relapse rate – a population‐based analysis of 25 years of the Austrian ALL‐BFM (Berlin‐Frankfurt‐Münster) Study Group

British journal of haematology, 2013-05, Vol.161 (4), p.556-565

2013

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Induction death and treatment-related mortality in first remission of children with acute lymphoblastic leukemia: a population-based analysis of the Austrian Berlin-Frankfurt-Münster study group

Leukemia, 2009-07, Vol.23 (7), p.1264-1269

2009

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Micro thermal management of high-power diode laser bars

Modular parametric finite element modelling for reliability-studies in electronic and mems packaging

Thermo-Mechanical Reliability of 3D-integrated Microstructures in Stacked Silicon

Microdeformation analysis of packages and interconnects to improve finite element models for reliability assessments

Quantitative strain analysis in AlGaAs-based devices

Computer aided optimization of advanced materials for liquid cooled printed circuit boards and their use in telecommunications

Future aspects of MEMS in Germany [microelectromechanical systems]

Packaging and microcooling of high power diode laser bars

Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging

Measurement of thermally induced strains on flip chip and chip scale packages

Reliability investigations on stacked chip on MEMS

Thermo-mechanical FE analysis and micro deformation measurements-basis for reliability assessment of microelectronic components

Mechanical characterisation of thin metal layers by modelling of the nanoindentation experiment

Dynamic mechanical behavior of SnAgCu BGA solder joints determined by fast shear tests and FEM simulations

FEA based reliability prediction for different Sn-based solders subjected to fast shear and fatigue loadings

Integrated Thermo-Electro-Mechanical Modeling of 3D e-Cubes Structures

Design, simulation and technological realization of a reliable packaging concept for high power laser bars

Thermal management and thermomechanical optimization at higher temperatures

Design and technology for fluxless die bonding of high power laser bars using Au(80)Sn(20)-solder

Schulmedizin und Homöopathie bei krebskranken Kindern – (k)ein Widerspruch?: 20 Jahre homöopathische Ambulanz am Klinikum Klagenfurt

Risk-adjusted therapy of acute lymphoblastic leukemia can decrease treatment burden and improve survival: treatment results of 2169 unselected pediatric and adolescent patients enrolled in the trial ALL-BFM 95

A severe case of haemodynamic instability during anidulafungin administration

Pulmonary Involvement in Pediatric-Onset Multisystem Langerhans Cell Histiocytosis: Effect on Course and Outcome

The inferior prognosis of adolescents with acute lymphoblastic leukaemia (ALL) is caused by a higher rate of treatment‐related mortality and not an increased relapse rate – a population‐based analysis of 25 years of the Austrian ALL‐BFM (Berlin‐Frankfurt‐Münster) Study Group

Induction death and treatment-related mortality in first remission of children with acute lymphoblastic leukemia: a population-based analysis of the Austrian Berlin-Frankfurt-Münster study group

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