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Controlling intermetallic compound growth in SnAgCu/Ni-P solder joints by nanosized Cu6Sn5 addition

Journal of electronic materials, 2006-03, Vol.35 (3), p.486-493

2006

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Interfacial reactions and compound formation of Sn-Ag-Cu solders by mechanical alloying on electroless Ni-P/Cu under bump metallization

Journal of electronic materials, 2005-08, Vol.34 (8), p.1129-1134

2005

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Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying

Journal of electronic materials, 2004-12, Vol.33 (12), p.1445-1451

2004

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Characterizing metallurgical reaction of Sn3.0Ag0.5Cu composite solder by mechanical alloying with electroless Ni-P/Cu under-bump metallization after various reflow cycles

Journal of electronic materials, 2006-01, Vol.35 (1), p.81-88

2006

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Controlling Intermetallic Compound Growth in SnAgCu/Ni-P Solder Joints by Nanosized Cu^sub 6^Sn^sub 5^ Addition

Journal of electronic materials, 2006-03, Vol.35 (3), p.486

2006

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Characterizing metallurgical reaction of Sn3.0Ag0.5Cu composite solder by mechanical alloying with electroless Ni-P/Cu under-bump metallization after various reflow cycles : Phase stability, formation and transformation of electronic materials

Journal of electronic materials, 2006, Vol.35 (1), p.81-88

2006

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Controlling intermetallic compound growth in SnAgCu/Ni-P solder joints by nanosized Cu6Sn5 addition

Interfacial reactions and compound formation of Sn-Ag-Cu solders by mechanical alloying on electroless Ni-P/Cu under bump metallization

Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying

Characterizing metallurgical reaction of Sn3.0Ag0.5Cu composite solder by mechanical alloying with electroless Ni-P/Cu under-bump metallization after various reflow cycles

Controlling Intermetallic Compound Growth in SnAgCu/Ni-P Solder Joints by Nanosized Cu^sub 6^Sn^sub 5^ Addition

Characterizing metallurgical reaction of Sn3.0Ag0.5Cu composite solder by mechanical alloying with electroless Ni-P/Cu under-bump metallization after various reflow cycles : Phase stability, formation and transformation of electronic materials

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