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Effect of Sn grain orientation and strain distribution in 20-μm-diameter microbumps on crack formation under thermal cycling tests

Electronic Materials Letters, 2017, 13(6), , pp.457-462

2017

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Optimal design and experimental verification of a magnetically actuated optical image stabilization system for cameras in mobile phones

Journal of applied physics, 2008-04, Vol.103 (7), p.07F136-07F136-3

2008

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Intelligent actuation strategy via image feedbacks for a magnetically actuated autofocusing module in mobile phones

Journal of applied physics, 2008-04, Vol.103 (7), p.07F123-07F123-3, Article 07F123

2008

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Effect of Sn Grain Orientation and Strain Distribution in 20-μm-Diameter Microbumps on Crack Formation Under Thermal Cycling Tests

2017-11

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Warpage characterization of panel Fan-out (P-FO) package

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.1750-1754

2014

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IEEE_Xplore

Alternative 3D Small form Factor Methodology of System in Package for IoT and Wearable Devices Application

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.1541-1546

2017

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IEEE_Xplore

High Thermal Solution for 3D Integration Package

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 2023, p.1026-1029

2023

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FCCSP(MUF) Mold-flow Void Risk Prediction with Different Substrate Surface and Bump Height Design

2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021, p.1-5

2021

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Enhance Larger FCBGA Package Evaluation and Characterization

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 2019, p.491-494

2019

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Innovative Fan-Out Embedded Bridge Structure for Co-Packaged Optics

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.228-232

2023

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IEEE_Xplore

High performance FCBGA Package Evaluation and Characterization for the Networking Application

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.2140-2144

2021

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IEEE_Xplore

Fan-Out Embedded Bridge Solution in HPC Application

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 2021, p.222-225

2021

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3DIC Stacking Process Investigation by Soldering Bonding Technology

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.1121-1125

2022

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IEEE_Xplore

Large Size Multilayered Fan-Out RDL Packaging for Heterogeneous Integration

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 2021, p.239-243

2021

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3D Micro Bump Interface Enabling Top Die Interconnect to True Circuit Through Silicon Via Wafer

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1888-1893

2020

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IEEE_Xplore

Trend Plots for Different Mold-Thick Selection on Warpage Design of MUF FCCSP with 4L ETS

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.255-266

2018

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IEEE_Xplore

Processing Models Based on Stress Conservation Law Utilized for Temperature-Dependent Warpage Prediction of MUF FCCSP with 3L ETS

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018, p.367-377

2018

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Larger FCBGA package with thin and normal core evaluation and characterization

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017, p.1-4

2017

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IEEE_Xplore

Mold-flow study for different bump height, bump pitch and die size in FCCSP with molded underfill technology

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-6

2015

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Different conservation laws utilized for warpage prediction of MUF FCCSP with 4L ETS

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016, p.313-319

2016

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Trend plots for compound selection utilized for warpage design of MUF FCCSP with 4L ETS

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017, p.1-10

2017

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IEEE_Xplore

Package with high thermal conductivity of graphite attached onto die surface to solve hot spot issue

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016, p.32-37

2016

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Challenge and warpage optimization of thermal compression bonding technology on coreless substrates

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017, p.1-7

2017

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IEEE_Xplore

Molded wafer level package evaluation and characterization

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016, p.492-496

2016

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MoldFlow simulation study on void risk prediction for FCCSP with molded underfill technology

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.817-821

2014

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Effect of Sn grain orientation and strain distribution in 20-μm-diameter microbumps on crack formation under thermal cycling tests

Optimal design and experimental verification of a magnetically actuated optical image stabilization system for cameras in mobile phones

Intelligent actuation strategy via image feedbacks for a magnetically actuated autofocusing module in mobile phones

Effect of Sn Grain Orientation and Strain Distribution in 20-μm-Diameter Microbumps on Crack Formation Under Thermal Cycling Tests

Warpage characterization of panel Fan-out (P-FO) package

Alternative 3D Small form Factor Methodology of System in Package for IoT and Wearable Devices Application

High Thermal Solution for 3D Integration Package

FCCSP(MUF) Mold-flow Void Risk Prediction with Different Substrate Surface and Bump Height Design

Enhance Larger FCBGA Package Evaluation and Characterization

Innovative Fan-Out Embedded Bridge Structure for Co-Packaged Optics

High performance FCBGA Package Evaluation and Characterization for the Networking Application

Fan-Out Embedded Bridge Solution in HPC Application

3DIC Stacking Process Investigation by Soldering Bonding Technology

Large Size Multilayered Fan-Out RDL Packaging for Heterogeneous Integration

3D Micro Bump Interface Enabling Top Die Interconnect to True Circuit Through Silicon Via Wafer

Trend Plots for Different Mold-Thick Selection on Warpage Design of MUF FCCSP with 4L ETS

Processing Models Based on Stress Conservation Law Utilized for Temperature-Dependent Warpage Prediction of MUF FCCSP with 3L ETS

Larger FCBGA package with thin and normal core evaluation and characterization

Mold-flow study for different bump height, bump pitch and die size in FCCSP with molded underfill technology

Different conservation laws utilized for warpage prediction of MUF FCCSP with 4L ETS

Trend plots for compound selection utilized for warpage design of MUF FCCSP with 4L ETS

Package with high thermal conductivity of graphite attached onto die surface to solve hot spot issue

Challenge and warpage optimization of thermal compression bonding technology on coreless substrates

Molded wafer level package evaluation and characterization

MoldFlow simulation study on void risk prediction for FCCSP with molded underfill technology

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