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Microelectronics and reliability, 2012-09, Vol.52 (9-10), p.2336-2341
2012
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Microelectronics and reliability, 2014-09, Vol.54 (9-10), p.1648-1654
2014
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Microelectronics and reliability, 2008-08, Vol.48 (8), p.1490-1493
2008
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Microelectronics and reliability, 2006-09, Vol.46 (9), p.1648-1651
2006
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2009 IEEE International Reliability Physics Symposium, 2009, p.409-415
2009

2012 IEEE International Reliability Physics Symposium (IRPS), 2012, p.5C.4.1-5C.4.5
2012

Microelectronics and reliability, 2003-09, Vol.43 (9), p.1839-1846
2003
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HCI vs. BTI? - Neither one's out
2012 IEEE International Reliability Physics Symposium (IRPS), 2012, p.2F.4.1-2F.4.6
2012

The vertical concept of power MOSFETs
Materials science & engineering. B, Solid-state materials for advanced technology, 2002-02, Vol.89 (1), p.439-443
2002
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Elektrotechnik und Informationstechnik, 2011-10, Vol.128 (10), p.371-374
2011
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2012 24th International Symposium on Power Semiconductor Devices and ICs, 2012, p.113-115
2012

2009 IEEE International Reliability Physics Symposium, 2009, p.913-916
2009

Annals of otology, rhinology & laryngology, 2000-12, Vol.109 (12_suppl), p.58-60
2000
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2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2011, p.1/6-6/6
2011

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.187-193
2012

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2011, p.1/5-5/5
2011



Proceedings of the 13th International Symposium on Power Semiconductor Devices & ICs. IPSD '01 (IEEE Cat. No.01CH37216), 2001, p.303-306
2001

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2011, p.1/5-5/5
2011



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