UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Enjoy My Second Prime in the U.S. Semiconductor Industry

Journal of The Japan Institute of Electronics Packaging, 2023-09, Vol.26 (6), p.534-537

Kodera, Masako

2023

Volltextzugriff (PDF)

Characterization technique for detection of atom-size crystalline defects and strains using two-dimensional fast-Fourier-transform sampling Moiré method

Japanese Journal of Applied Physics, 2018-04, Vol.57 (4S), p.4

2018

Volltextzugriff (PDF)

Impact of Plasma‐Damaged‐Layer Removal on GaN HEMT Devices

Physica status solidi. A, Applications and materials science, 2018-05, Vol.215 (9), p.n/a

2018

Volltextzugriff (PDF)

Potential Characterization of Interconnect Corrosion by Kelvin Probe and Electrostatic Force Microscopies

Japanese Journal of Applied Physics, 2012-04, Vol.51 (4), p.04DB05-04DB05-4

2012

Volltextzugriff (PDF)

Potential Characterization of Interconnect Corrosion by Kelvin Probe and Electrostatic Force Microscopies

Japanese Journal of Applied Physics, 2012-04, Vol.51 (4S), p.4

2012

Volltextzugriff (PDF)

Evaluation of Dielectric Constant through Direct Chemical Mechanical Planarization of Porous Low-$k$ Film

Japanese Journal of Applied Physics, 2010-04, Vol.49 (4), p.04DB07-04DB07-6

2010

Volltextzugriff (PDF)

Nanoscale Stress Field Evaluation with Shallow Trench Isolation Structure Assessed by Cathodoluminescence Spectroscopy, Raman Spectroscopy, and Finite Element Method Analyses

Japanese Journal of Applied Physics, 2008-04, Vol.47 (4S), p.2506

2008

Volltextzugriff (PDF)

Visualization and automatic detection of defect distribution in GaN atomic structure from sampling Moiré phase

Nanotechnology, 2017-11, Vol.28 (45), p.455704-455704

2017

Volltextzugriff (PDF)

Shear Stress Analyses in Chemical Mechanical Planarization with Cu/Porous Low-k Structure

Japanese Journal of Applied Physics, 2007-04, Vol.46 (4S), p.1974

2007

Volltextzugriff (PDF)

Localized Oxidation of the Cu Surface after Chemical Mechanical Planarization Processing

Japanese Journal of Applied Physics, 2005-12, Vol.44 (12R), p.8396

2005

Volltextzugriff (PDF)

Stress Analyses during Chemical Mechanical Planarization Processing with Cu/Porous Low-k Structures of LSI Devices

Japanese Journal of Applied Physics, 2005-12, Vol.44 (12R), p.8401

2005

Volltextzugriff (PDF)

Development of Dishing-less Slurry for Polysilicon Chemical-Mechanical Polishing Process

Japanese Journal of Applied Physics, 2003, Vol.42 (Part 1, No. 9A), p.5433-5437

2003

Volltextzugriff (PDF)

Development of post-CMP cleanup processing for Cu/low-k devices

Electronics & communications in Japan. Part 2, Electronics, 2006-11, Vol.89 (11), p.19-30

2006

Volltextzugriff (PDF)

A New Cleaning Technique for Corrosion Protection in Aluminum Metallization

MRS proceedings, 2003, Vol.767, Article F7.2

2003

Volltextzugriff (PDF)

Application of pseudo-dynamic test method in centrifugal field for soil-foundation-structure interaction

Journal of Structural Engineering, A, 2010, Vol.56A, pp.334-341

2010

Volltextzugriff (PDF)

Stress Corrosion Cracking of Cu Interconnects during CMP with a Cu/Porous Low-k Structure

Journal of the Electrochemical Society, 2005, Vol.152 (6), p.G506

2005

Volltextzugriff (PDF)

Noble gas elemental and isotopic abundances in deep-sea trenches in the western Pacific

Earth and planetary science letters, 1987-11, Vol.86 (1), p.77-84

1987

Volltextzugriff (PDF)

Copper Surface Analyses after Cu CMP Processing

Electrochemistry, 2004/08/05, Vol.72(8), pp.569-576

2004

Volltextzugriff (PDF)

Copper Surface Analyses after Cu CMP Processing

Denki kagaku oyobi kōgyō butsuri kagaku, 2004-08, Vol.72 (8), p.569-576

2004

Volltextzugriff (PDF)

Cu CMP後のCu表面解析

Electrochemistry, 2004/08/05, Vol.72(8), pp.569-576

2004

Volltextzugriff (PDF)

The characteristics of the Electrolyzed D.I.water with chemicals and the outline of the supply system

MRS proceedings, 2000, Vol.613, Article E5.4.1

2000

Volltextzugriff (PDF)

Technique of surface control with the Electrolyzed D.I.water for post CMP cleaning

MRS proceedings, 2000, Vol.613, Article E8.3.1

2000

Volltextzugriff (PDF)

Technique of surface control with the Electrolyzed D.I.water for post CMP cleaning

MRS proceedings, 2000, Vol.612, Article D11.2.1

2000

Volltextzugriff (PDF)

The Competitive Reaction Between Slurry and Cleaning Solution

Meeting abstracts (Electrochemical Society), 2006-02, Vol.MA2005-01 (6), p.321-321

2006

Volltextzugriff (PDF)

Noble gases in hydrothermal plumes of Loihi Seamount

Earth and planetary science letters, 1988-02, Vol.87 (3), p.266-272

1988

Volltextzugriff (PDF)

1 – 25 von 38

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(28)
Mit Volltextzugriff
(29)

Publikationsform

Artikel
(37)
Tagungsberichte
(1)

Sprache

Erscheinungsjahr

n.n

Thema

15 weitere anzeigen...

Weniger anzeigen...

Menü

Weitere Dienste

Einstellungen

Enjoy My Second Prime in the U.S. Semiconductor Industry

Characterization technique for detection of atom-size crystalline defects and strains using two-dimensional fast-Fourier-transform sampling Moiré method

Impact of Plasma‐Damaged‐Layer Removal on GaN HEMT Devices

Potential Characterization of Interconnect Corrosion by Kelvin Probe and Electrostatic Force Microscopies

Potential Characterization of Interconnect Corrosion by Kelvin Probe and Electrostatic Force Microscopies

Evaluation of Dielectric Constant through Direct Chemical Mechanical Planarization of Porous Low-$k$ Film

Nanoscale Stress Field Evaluation with Shallow Trench Isolation Structure Assessed by Cathodoluminescence Spectroscopy, Raman Spectroscopy, and Finite Element Method Analyses

Visualization and automatic detection of defect distribution in GaN atomic structure from sampling Moiré phase

Shear Stress Analyses in Chemical Mechanical Planarization with Cu/Porous Low-k Structure

Localized Oxidation of the Cu Surface after Chemical Mechanical Planarization Processing

Stress Analyses during Chemical Mechanical Planarization Processing with Cu/Porous Low-k Structures of LSI Devices

Development of Dishing-less Slurry for Polysilicon Chemical-Mechanical Polishing Process

Development of post-CMP cleanup processing for Cu/low-k devices

A New Cleaning Technique for Corrosion Protection in Aluminum Metallization

Application of pseudo-dynamic test method in centrifugal field for soil-foundation-structure interaction

Stress Corrosion Cracking of Cu Interconnects during CMP with a Cu/Porous Low-k Structure

Noble gas elemental and isotopic abundances in deep-sea trenches in the western Pacific

Copper Surface Analyses after Cu CMP Processing

Copper Surface Analyses after Cu CMP Processing

Cu CMP後のCu表面解析

The characteristics of the Electrolyzed D.I.water with chemicals and the outline of the supply system

Technique of surface control with the Electrolyzed D.I.water for post CMP cleaning

Technique of surface control with the Electrolyzed D.I.water for post CMP cleaning

The Competitive Reaction Between Slurry and Cleaning Solution

Noble gases in hydrothermal plumes of Loihi Seamount

Suchergebnisse filtern