UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Characterization of TiN films sputter-deposited at low temperatures for Cu-through-silicon via

Japanese Journal of Applied Physics, 2019-04, Vol.58 (SB), p.SBBC03

2019

Volltextzugriff (PDF)

Advanced wafer thinning technology and feasibility test for 3D integration

Microelectronic engineering, 2013-07, Vol.107, p.65-71

2013

Volltextzugriff (PDF)

Comparison of endoscopic submucosal resection with ligation and endoscopic submucosal dissection for small rectal neuroendocrine tumors: A multicenter retrospective study

DEN open, 2023-04, Vol.3 (1), p.e163-n/a

2023

Volltextzugriff (PDF)

PROSPECTIVE STUDY OF THE EVALUATION OF THE USEFULNESS OF TUMOR TYPING BY NARROW BAND IMAGING FOR THE DIFFERENTIAL DIAGNOSIS OF GASTRIC ADENOMA AND WELL-DIFFERENTIATED ADENOCARCINOMA

Digestive endoscopy, 2011-04, Vol.23 (2), p.146-152

2011

Volltextzugriff (PDF)

Novel Through Silicon Vias Leakage Current Evaluation Using Infrared-Optical Beam Irradiation

Japanese Journal of Applied Physics, 2012-05, Vol.51 (5), p.05EE03-05EE03-4

2012

Volltextzugriff (PDF)

Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology

Japanese Journal of Applied Physics, 2011-05, Vol.50 (5), p.05ED02-05ED02-4

2011

Volltextzugriff (PDF)

Characterization of Local Strain around Through-Silicon Via Interconnects by Using X-ray Microdiffraction

Japanese Journal of Applied Physics, 2011-05, Vol.50 (5), p.05ED03-05ED03-4

2011

Volltextzugriff (PDF)

Impact of Thermomechanical Stresses on Bumpless Chip in Stacked Wafer Structure

Japanese Journal of Applied Physics, 2013-05, Vol.52 (5), p.05FE01-05FE01-5

2013

Volltextzugriff (PDF)

Influence of Titanium Liner on Resistivity of Copper Interconnects

Japanese Journal of Applied Physics, 2009-04, Vol.48 (4S), p.4

2009

Volltextzugriff (PDF)

Observation of lattice spacing fluctuation and strain undulation around through-Si vias in wafer-on-wafer structures using X-ray microbeam diffraction

Japanese Journal of Applied Physics, 2014-05, Vol.53 (5S2), p.5-1-05GE03-6

2014

Volltextzugriff (PDF)

Direct Depth Measurement Tool of High Aspect Ratio Via-Hole for Three-Dimensional Stacked Devices

Journal of surface analysis, 2014, Vol.20 (3), p.182-186

2014

Volltextzugriff (PDF)

Novel Through Silicon Vias Leakage Current Evaluation Using Infrared-Optical Beam Irradiation

Japanese Journal of Applied Physics, 2012-05, Vol.51 (5S), p.5

2012

Volltextzugriff (PDF)

Hybrid Electrochemical Mechanical Planarization Process for Cu Dual-Damascene Through-Silicon Via Using Noncontact Electrode Pad

Japanese Journal of Applied Physics, 2010-05, Vol.49 (5), p.05FG01-05FG01-5

2010

Volltextzugriff (PDF)

Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology

Japanese Journal of Applied Physics, 2011-05, Vol.50 (5S1), p.5

2011

Volltextzugriff (PDF)

Characterization of Local Strain around Through-Silicon Via Interconnects by Using X-ray Microdiffraction

Japanese Journal of Applied Physics, 2011-05, Vol.50 (5S1), p.5

2011

Volltextzugriff (PDF)

Usefulness of the DL in ME with NBI for determining the expanded area of early-stage differentiated gastric carcinoma

World journal of gastrointestinal endoscopy, 2012-08, Vol.4 (8), p.362-367

2012

Volltextzugriff (PDF)

Thinned wafer multi-stack 3DI technology

Microelectronic engineering, 2010-03, Vol.87 (3), p.485-490

2010

Volltextzugriff (PDF)

Clinical characteristics of immunoglobulin IgG4-related sclerosing cholangitis: Comparison of cases with and without autoimmune pancreatitis in a large cohort

Digestive and liver disease, 2021-10, Vol.53 (10), p.1308-1314

2021

Volltextzugriff (PDF)

Reducing relapse through maintenance steroid treatment can decrease the cancer risk in patients with IgG4‐sclerosing cholangitis: Based on a Japanese nationwide study

Journal of gastroenterology and hepatology, 2023-04, Vol.38 (4), p.556-564

2023

Volltextzugriff (PDF)

Analyzing and modeling methods for warpages of thin and large dies with redistribution layer

Japanese Journal of Applied Physics, 2016-06, Vol.55 (6S3), p.6-06JC03

2016

Volltextzugriff (PDF)

Study of Chip Stacking Process and Electrical Characteristic Evaluation of Cu Pillar Joint Between Chips Including TSV

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1827-1833

2016

Volltextzugriff (PDF)

Mo1575 Comparison of the Outcome of Endoscopic Submucosal Dissection (ESD) Using Sodium Hyaluronate and Needle-Knife Versus Endoscopic Aspiration Mucosectomy (EAM) for Esophageal Squamous Cell Neoplasm

Gastrointestinal endoscopy, 2011-04, Vol.73 (4), p.AB391-AB392

2011

Volltextzugriff (PDF)

Impact of 3D stacking on the TSV-induced stress and the CMOS characteristics

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017, p.1-5

2017

Volltextzugriff (PDF)

Thermal stress destruction analysis in low-k layer by via-last TSV structure

2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.1840-1845

2015

Volltextzugriff (PDF)

Thermal stress reliability of copper through silicon via interconnects for 3D logic devices

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016, p.115-119

2016

Volltextzugriff (PDF)

1 – 25 von 174

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(115)
Mit Volltextzugriff
(152)

Publikationsform

Artikel
(157)
Tagungsberichte
(17)

Sprache

Englisch
(143)
Japanisch
(38)

Erscheinungsjahr

n.n

Thema

Science & Technology
(86)
Life Sciences & Biomedicine
(50)
Humans
(35)
Male
(26)
Physical Sciences
(25)
Physics
(22)
Physics, Applied
(20)
Female
(18)
Animals
(17)
Biological And Medical Sciences
(14)
Technology
(14)
Medical Sciences
(13)
Middle Aged
(13)
Aged
(12)
Engineering
(11)
Engineering, Electrical & Electronic
(11)
Through-Silicon Vias
(10)
Exact Sciences And Technology
(9)
Gastroenterology And Hepatology
(9)
Science & Technology - Other Topics
(9)

15 weitere anzeigen...

Weniger anzeigen...

Menü

Weitere Dienste

Einstellungen

Characterization of TiN films sputter-deposited at low temperatures for Cu-through-silicon via

Advanced wafer thinning technology and feasibility test for 3D integration

Comparison of endoscopic submucosal resection with ligation and endoscopic submucosal dissection for small rectal neuroendocrine tumors: A multicenter retrospective study

PROSPECTIVE STUDY OF THE EVALUATION OF THE USEFULNESS OF TUMOR TYPING BY NARROW BAND IMAGING FOR THE DIFFERENTIAL DIAGNOSIS OF GASTRIC ADENOMA AND WELL-DIFFERENTIATED ADENOCARCINOMA

Novel Through Silicon Vias Leakage Current Evaluation Using Infrared-Optical Beam Irradiation

Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology

Characterization of Local Strain around Through-Silicon Via Interconnects by Using X-ray Microdiffraction

Impact of Thermomechanical Stresses on Bumpless Chip in Stacked Wafer Structure

Influence of Titanium Liner on Resistivity of Copper Interconnects

Observation of lattice spacing fluctuation and strain undulation around through-Si vias in wafer-on-wafer structures using X-ray microbeam diffraction

Direct Depth Measurement Tool of High Aspect Ratio Via-Hole for Three-Dimensional Stacked Devices

Novel Through Silicon Vias Leakage Current Evaluation Using Infrared-Optical Beam Irradiation

Hybrid Electrochemical Mechanical Planarization Process for Cu Dual-Damascene Through-Silicon Via Using Noncontact Electrode Pad

Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology

Characterization of Local Strain around Through-Silicon Via Interconnects by Using X-ray Microdiffraction

Usefulness of the DL in ME with NBI for determining the expanded area of early-stage differentiated gastric carcinoma

Thinned wafer multi-stack 3DI technology

Clinical characteristics of immunoglobulin IgG4-related sclerosing cholangitis: Comparison of cases with and without autoimmune pancreatitis in a large cohort

Reducing relapse through maintenance steroid treatment can decrease the cancer risk in patients with IgG4‐sclerosing cholangitis: Based on a Japanese nationwide study

Analyzing and modeling methods for warpages of thin and large dies with redistribution layer

Study of Chip Stacking Process and Electrical Characteristic Evaluation of Cu Pillar Joint Between Chips Including TSV

Mo1575 Comparison of the Outcome of Endoscopic Submucosal Dissection (ESD) Using Sodium Hyaluronate and Needle-Knife Versus Endoscopic Aspiration Mucosectomy (EAM) for Esophageal Squamous Cell Neoplasm

Impact of 3D stacking on the TSV-induced stress and the CMOS characteristics

Thermal stress destruction analysis in low-k layer by via-last TSV structure

Thermal stress reliability of copper through silicon via interconnects for 3D logic devices

Suchergebnisse filtern