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EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger Using Tightly Coupled Three-Phase Resonant Magnetic Field

IEEE transactions on industrial electronics (1982), 2018-09, Vol.65 (9), p.6839-6849

2018

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Coil Design and Measurements of Automotive Magnetic Resonant Wireless Charging System for High-Efficiency and Low Magnetic Field Leakage

IEEE transactions on microwave theory and techniques, 2016-02, Vol.64 (2), p.383-400

2016

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Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System

Proceedings of the IEEE, 2013-06, Vol.101 (6), p.1332-1342

2013

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Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems

IEEE transactions on very large scale integration (VLSI) systems, 2017-06, Vol.25 (6), p.1856-1865

2017

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Wideband Power/Ground Noise Suppression in Low-Loss Glass Interposers Using a Double-Sided Electromagnetic Bandgap Structure

IEEE transactions on microwave theory and techniques, 2020-12, Vol.68 (12), p.5055-5064

2020

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Thin PCB-Type Metamaterials for Improved Efficiency and Reduced EMF Leakage in Wireless Power Transfer Systems

IEEE transactions on microwave theory and techniques, 2016-02, Vol.64 (2), p.353-364

2016

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An Investigation of Electromagnetic Radiated Emission and Interference From Multi-Coil Wireless Power Transfer Systems Using Resonant Magnetic Field Coupling

IEEE transactions on microwave theory and techniques, 2015-03, Vol.63 (3), p.833-846

2015

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Statistical Eye-Diagram Estimation Method Considering Power/Ground Noise Induced by Simultaneous Switching Output (SSO) Buffers

IEEE transactions on electromagnetic compatibility, 2020-12, Vol.62 (6), p.2547-2557

2020

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High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-02, Vol.1 (2), p.181-195

2011

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Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-09, Vol.8 (9), p.1658-1671

2018

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Towards Gigahertz Operation: Ultrafast Low Turn-on Organic Diodes and Rectifiers Based on C60 and Tungsten Oxide

Advanced materials (Weinheim), 2011-02, Vol.23 (5), p.644-648

2011

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Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

IEEE Transactions on Electromagnetic Compatibility, 2010-05, Vol.52 (2), p.248-265

2010

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High-Resolution Synthesized Magnetic Field Focusing for RF Barcode Applications

IEEE transactions on industrial electronics (1982), 2018-01, Vol.65 (1), p.597-607

2018

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Circuital Modeling and Measurement of Shielding Effectiveness Against Oblique Incident Plane Wave on Apertures in Multiple Sides of Rectangular Enclosure

IEEE transactions on electromagnetic compatibility, 2010-08, Vol.52 (3), p.566-577

2010

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A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels

IEEE transactions on electromagnetic compatibility, 2018-10, Vol.60 (5), p.1510-1519

2018

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30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via

IEEE microwave and wireless components letters, 2014-11, Vol.24 (11), p.814-816

2014

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Special Issue on PCB Level Signal Integrity, Power Integrity, and EMC

IEEE transactions on electromagnetic compatibility, 2010-05, Vol.52 (2), p.246-247

2010

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Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-01, Vol.7 (1), p.138-152

2017

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Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-02, Vol.1 (2), p.220-233

2011

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A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs

IEEE transactions on electromagnetic compatibility, 2012-06, Vol.54 (3), p.689-695

2012

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Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory)

IEEE transactions on computers, 2015-01, Vol.64 (1), p.112-125

2015

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High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-04, Vol.4 (4), p.697-707

2014

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Suppression of leakage magnetic field from a wireless power transfer system using ferrimagnetic material and metallic shielding

2012 IEEE International Symposium on Electromagnetic Compatibility, 2012, p.640-645

2012

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An Efficient Crosstalk-Included Eye-Diagram Estimation Method for High-Speed Interposer Channel on 2.5-D and 3-D IC

IEEE transactions on electromagnetic compatibility, 2017-06, Vol.59 (3), p.927-939

2017

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Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel

IEEE transactions on electromagnetic compatibility, 2016-12, Vol.58 (6), p.1747-1759

2016

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EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger Using Tightly Coupled Three-Phase Resonant Magnetic Field

Coil Design and Measurements of Automotive Magnetic Resonant Wireless Charging System for High-Efficiency and Low Magnetic Field Leakage

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System

Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems

Wideband Power/Ground Noise Suppression in Low-Loss Glass Interposers Using a Double-Sided Electromagnetic Bandgap Structure

Thin PCB-Type Metamaterials for Improved Efficiency and Reduced EMF Leakage in Wireless Power Transfer Systems

An Investigation of Electromagnetic Radiated Emission and Interference From Multi-Coil Wireless Power Transfer Systems Using Resonant Magnetic Field Coupling

Statistical Eye-Diagram Estimation Method Considering Power/Ground Noise Induced by Simultaneous Switching Output (SSO) Buffers

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface

Towards Gigahertz Operation: Ultrafast Low Turn-on Organic Diodes and Rectifiers Based on C60 and Tungsten Oxide

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

High-Resolution Synthesized Magnetic Field Focusing for RF Barcode Applications

Circuital Modeling and Measurement of Shielding Effectiveness Against Oblique Incident Plane Wave on Apertures in Multiple Sides of Rectangular Enclosure

A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels

30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via

Special Issue on PCB Level Signal Integrity, Power Integrity, and EMC

Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs

Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory)

High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via

Suppression of leakage magnetic field from a wireless power transfer system using ferrimagnetic material and metallic shielding

An Efficient Crosstalk-Included Eye-Diagram Estimation Method for High-Speed Interposer Channel on 2.5-D and 3-D IC

Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel

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