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Correlation between voltage holding capability and light emission in a 500 keV electrostatic accelerator utilized for fusion application

IEEE transactions on dielectrics and electrical insulation, 2007-06, Vol.14 (3), p.572-576

2007

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IEEE_Xplore

Warpage Mechanism of Thin Embedded LSI Packages

Transactions of The Japan Institute of Electronics Packaging, 2010, Vol.3(1), pp.47-56

2010

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Classification System with Capability to Reject Unknowns

2019 IEEE International Conference on Imaging Systems and Techniques (IST), 2019, p.1-6

2019

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Recent R&D Activities of Negative-Ion-Based Ion Source for JT-60SA

IEEE transactions on plasma science, 2008-08, Vol.36 (4), p.1519-1529

2008

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IEEE_Xplore

Anomaly Detection Combining Discriminative and Generative Models

2019 IEEE International Conference on Imaging Systems and Techniques (IST), 2019, p.1-6

2019

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Electrical Design and Techniques for an Embedded High-Pin-Count LSI Chip Package

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-10, Vol.1 (10), p.1543-1552

2011

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IEEE_Xplore

Embedded Active Packaging Technology for High-Pin-Count LSI With Cu Plate

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-01, Vol.1 (1), p.60-68

2011

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IEEE_Xplore

A novel ultra-thin package for embedded high-pin-count LSI supported by Cu plate

2009 59th Electronic Components and Technology Conference, 2009, p.1447-1452

2009

Link zum Volltext
IEEE_Xplore

Recent R&D Activities of Negative-Ion-Based Ion Source for JT-60SA: Ion Sources, Fundamendals and Applications

IEEE transactions on plasma science, 2008, Vol.36 (4), p.1519-1529

2008

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High-performance FCBGA based on multi-layer thin-substrate packaging technology

Microelectronics and reliability, 2004-03, Vol.44 (3), p.515-520

2004

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Fir and IIR SC decimation filters using parallel cyclic-type circuit for high frequency and low power consumption

Electronics & communications in Japan. Part 3, Fundamental electronic science, 1994, Vol.77 (6), p.11-24

1994

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Breakdown Phenomena in the Negative Ion Source of 500 keV Negative-Ion Based NBI System on JT-60U

2006 International Symposium on Discharges and Electrical Insulation in Vacuum, 2006, Vol.2, p.718-721

2006

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IEEE_Xplore

Reliability of thin seamless package with embedded high-pin-count LSI chip

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.36-39

2010

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IEEE_Xplore

A 5-μm-width multi-layer wafer-level Cu wiring technology with resin CMP for highly-reliable FCBGA

2007 Proceedings 57th Electronic Components and Technology Conference, 2007, p.593-599

2007

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IEEE_Xplore

A novel "SMAFTI" package for inter-chip wide-band data transfer

56th Electronic Components and Technology Conference 2006, 2006, p.9 pp.

2006

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IEEE_Xplore

A Double thick-polymer technology to realize low signal pad capacitance suitable for high-speed data transmission

2009 IEEE International Interconnect Technology Conference, 2009, p.89-91

2009

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IEEE_Xplore

Helical Wiring Type Stress Relaxation Structures for LSI Packages

IEEE transactions on advanced packaging, 2009-11, Vol.32 (4), p.768-772

2009

Link zum Volltext
IEEE_Xplore

Electrical design and demonstration of an embedded high-pin-count LSI chip package

2009 59th Electronic Components and Technology Conference, 2009, p.482-488

2009

Link zum Volltext
IEEE_Xplore

Chip-level and package-level seamless interconnect technologies for advanced packaging

2009 IEEE International Electron Devices Meeting (IEDM), 2009, p.1-4

2009

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IEEE_Xplore

New high-density multilayer technology on PCB

IEEE transactions on advanced packaging, 1999-05, Vol.22 (2), p.116-122

1999

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IEEE_Xplore

Molecular Cloning and Characterization of a cDNA Encoding the Retinal Arylalkylamine N-Acetyltransferase of the Rainbow Trout, Oncorhynchus mykiss

Zoological Science, 1998-06, Vol.15 (3), p.345-351

1998

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Helium Pumping by a Cryosorption Pump with Condensed SF6 Gas Layer as a Sorbent in JT-60 NBI System

Shinku, 1990/03/20, Vol.33(3), pp.307-310

1990

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Emission color control from blue to red with nanocolumn diameter of InGaN/GaN nanocolumn arrays grown on same substrate

Applied physics letters, 2010-06, Vol.96 (23)

2010

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Improved Ti-mask selective-area growth (SAG) by rf-plasma-assisted molecular beam epitaxy demonstrating extremely uniform GaN nanocolumn arrays

Journal of crystal growth, 2009-03, Vol.311 (7), p.2063-2068

2009

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The Dickkopf1‐cytoskeleton‐associated protein 4 axis creates a novel signalling pathway and may represent a molecular target for cancer therapy

British journal of pharmacology, 2017-12, Vol.174 (24), p.4651-4665

2017

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Correlation between voltage holding capability and light emission in a 500 keV electrostatic accelerator utilized for fusion application

Warpage Mechanism of Thin Embedded LSI Packages

Classification System with Capability to Reject Unknowns

Recent R&D Activities of Negative-Ion-Based Ion Source for JT-60SA

Anomaly Detection Combining Discriminative and Generative Models

Electrical Design and Techniques for an Embedded High-Pin-Count LSI Chip Package

Embedded Active Packaging Technology for High-Pin-Count LSI With Cu Plate

A novel ultra-thin package for embedded high-pin-count LSI supported by Cu plate

Recent R&D Activities of Negative-Ion-Based Ion Source for JT-60SA: Ion Sources, Fundamendals and Applications

High-performance FCBGA based on multi-layer thin-substrate packaging technology

Fir and IIR SC decimation filters using parallel cyclic-type circuit for high frequency and low power consumption

Breakdown Phenomena in the Negative Ion Source of 500 keV Negative-Ion Based NBI System on JT-60U

Reliability of thin seamless package with embedded high-pin-count LSI chip

A 5-μm-width multi-layer wafer-level Cu wiring technology with resin CMP for highly-reliable FCBGA

A novel "SMAFTI" package for inter-chip wide-band data transfer

A Double thick-polymer technology to realize low signal pad capacitance suitable for high-speed data transmission

Helical Wiring Type Stress Relaxation Structures for LSI Packages

Electrical design and demonstration of an embedded high-pin-count LSI chip package

Chip-level and package-level seamless interconnect technologies for advanced packaging

New high-density multilayer technology on PCB

Molecular Cloning and Characterization of a cDNA Encoding the Retinal Arylalkylamine N-Acetyltransferase of the Rainbow Trout, Oncorhynchus mykiss

Helium Pumping by a Cryosorption Pump with Condensed SF6 Gas Layer as a Sorbent in JT-60 NBI System

Emission color control from blue to red with nanocolumn diameter of InGaN/GaN nanocolumn arrays grown on same substrate

Improved Ti-mask selective-area growth (SAG) by rf-plasma-assisted molecular beam epitaxy demonstrating extremely uniform GaN nanocolumn arrays

The Dickkopf1‐cytoskeleton‐associated protein 4 axis creates a novel signalling pathway and may represent a molecular target for cancer therapy

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