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The comparative efficacy of angiosome‐directed and indirect revascularisation strategies to aid healing of chronic foot wounds in patients with co‐morbid diabetes mellitus and critical limb ischaemia: a literature review

Journal of foot and ankle research, 2017-06, Vol.10 (1), p.26-n/a, Article 26

2017

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INFLUENCE OF ULTRASOUND-ASSISTED OSMOTIC DEHYDRATION PRE-TREATMENT ON TOTAL PHENOLIC CONTENT, ANTIOXIDANT CAPACITY AND P-CYMENE CONTENT OF EUCALYPTUS DEGLUPTA

Journal of tropical forest science, 2021-04, Vol.33 (2), p.149-159

2021

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Computational Fluid Dynamics Analysis of Varied Cross-Sectional Areas in Sleep Apnea Individuals across Diverse Situations

Computation, 2024-01, Vol.12 (1), p.16

2024

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Computational Analysis of Airflow in Upper Airway under Light and Heavy Breathing Conditions for a Realistic Patient Having Obstructive Sleep Apnea

Computer modeling in engineering & sciences, 2021, Vol.128 (2), p.583-604

2021

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Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach

International communications in heat and mass transfer, 2013-11, Vol.48, p.116-123

2013

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Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance

Microelectronics and reliability, 2012-04, Vol.52 (4), p.744-756

2012

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Computational fluid dynamics modelling of human upper airway: A review

Computer methods and programs in biomedicine, 2020-11, Vol.196, p.105627-105627, Article 105627

2020

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Influence of solder bump arrangements on molded IC encapsulation

Microelectronics and reliability, 2014-04, Vol.54 (4), p.796-807

2014

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Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging

Microelectronics and reliability, 2013-02, Vol.53 (2), p.334-347

2013

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Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology

Microelectronics and reliability, 2013-12, Vol.53 (12), p.1996-2004

2013

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Three-dimensional numerical and experimental investigations on polymer rheology in meso-scale injection molding

International communications in heat and mass transfer, 2010-02, Vol.37 (2), p.131-139

2010

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Study on the fluid/structure interaction at different inlet pressures in molded packaging

Microelectronic engineering, 2011-10, Vol.88 (10), p.3182-3194

2011

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Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey-based Taguchi method

Microelectronics international, 2013-01, Vol.30 (3), p.151-168

2013

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Recent fluid–structure interaction modeling challenges in IC encapsulation – A review

Microelectronics and reliability, 2014-08, Vol.54 (8), p.1511-1526

2014

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Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package

International communications in heat and mass transfer, 2012-05, Vol.39 (5), p.670-680

2012

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Numerical study on the effect of fin length variation on the thermal performance of a bus duct conductor

Numerical heat transfer. Part A, Applications, 2023-01, Vol.83 (2), p.116-133

2023

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Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

TheScientificWorld, 2014-01, Vol.2014 (2014), p.1-13

2014

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Investigation of the fluid/structure interaction phenomenon in IC packaging

Microelectronics and reliability, 2012, Vol.52 (1), p.241-252

2012

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Finite volume-based simulation of the wave soldering process: Influence of the conveyor angle on pin-through-hole capillary flow

Numerical heat transfer. Part A, Applications, 2016-02, Vol.69 (3), p.295-310

2016

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Analysis of encapsulation process in 3D stacked chips with different microbump array

International communications in heat and mass transfer, 2012-12, Vol.39 (10), p.1616-1623

2012

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Numerical analysis on the effects of different inlet gates and gap heights in TQFP encapsulation process

International journal of heat and mass transfer, 2011-04, Vol.54 (9), p.1861-1870

2011

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Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering

Advances in mechanical engineering, 2014-01, Vol.6, p.275735

2014

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FVM based numerical study on the effect of solder bump arrangement on capillary driven flip chip underfill process

International communications in heat and mass transfer, 2010-03, Vol.37 (3), p.281-286

2010

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Effect of Blade number on the Energy Dissipation and Centrifugal Pump Performance Based on the Entropy Generation Theory and Fluid–Structure Interaction

Arabian journal for science and engineering (2011), 2024-08, Vol.49 (8), p.11031-11052

2024

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Underfill process for two parallel plates and flip chip packaging

International communications in heat and mass transfer, 2012-10, Vol.39 (8), p.1205-1212

2012

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The comparative efficacy of angiosome‐directed and indirect revascularisation strategies to aid healing of chronic foot wounds in patients with co‐morbid diabetes mellitus and critical limb ischaemia: a literature review

INFLUENCE OF ULTRASOUND-ASSISTED OSMOTIC DEHYDRATION PRE-TREATMENT ON TOTAL PHENOLIC CONTENT, ANTIOXIDANT CAPACITY AND P-CYMENE CONTENT OF EUCALYPTUS DEGLUPTA

Computational Fluid Dynamics Analysis of Varied Cross-Sectional Areas in Sleep Apnea Individuals across Diverse Situations

Computational Analysis of Airflow in Upper Airway under Light and Heavy Breathing Conditions for a Realistic Patient Having Obstructive Sleep Apnea

Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach

Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance

Computational fluid dynamics modelling of human upper airway: A review

Influence of solder bump arrangements on molded IC encapsulation

Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging

Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology

Three-dimensional numerical and experimental investigations on polymer rheology in meso-scale injection molding

Study on the fluid/structure interaction at different inlet pressures in molded packaging

Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey-based Taguchi method

Recent fluid–structure interaction modeling challenges in IC encapsulation – A review

Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package

Numerical study on the effect of fin length variation on the thermal performance of a bus duct conductor

Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

Investigation of the fluid/structure interaction phenomenon in IC packaging

Finite volume-based simulation of the wave soldering process: Influence of the conveyor angle on pin-through-hole capillary flow

Analysis of encapsulation process in 3D stacked chips with different microbump array

Numerical analysis on the effects of different inlet gates and gap heights in TQFP encapsulation process

Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering

FVM based numerical study on the effect of solder bump arrangement on capillary driven flip chip underfill process

Effect of Blade number on the Energy Dissipation and Centrifugal Pump Performance Based on the Entropy Generation Theory and Fluid–Structure Interaction

Underfill process for two parallel plates and flip chip packaging

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