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Water‐Triggered Self‐Healing of Ti3C2Tx MXene Standalone Electrodes: Systematic Examination of Factors Affecting the Healing Process

Small (Weinheim an der Bergstrasse, Germany), 2024-05, Vol.20 (20), p.e2306434-n/a

2024

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Electronic textiles: New age of wearable technology for healthcare and fitness solutions

Materials today bio, 2023-04, Vol.19, p.100565, Article 100565

2023

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Low-melting metal thermal interface material for high-power package application

Journal of the Korean Physical Society, 2023-09, Vol.83 (6), p.444-454

2023

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Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications

Applied surface science, 2020-06, Vol.515, p.146060, Article 146060

2020

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Synergistic effect of Indium and Gallium co-doping on growth behavior and physical properties of hydrothermally grown ZnO nanorods

Scientific reports, 2017-02, Vol.7 (1), p.41992-41992, Article 41992

2017

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Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Applied surface science, 2019-11, Vol.495, p.143487, Article 143487

2019

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Fast formation of Ni–Sn intermetallic joints using Ni–Sn paste for high-temperature bonding applications

Journal of materials science. Materials in electronics, 2020-09, Vol.31 (18), p.15048-15060

2020

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Effect of surface finish metallization on mechanical strength of Ag sintered joint

Microelectronic engineering, 2018-10, Vol.198, p.15-21

2018

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Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn–58Bi solder joints during aging

Journal of materials science. Materials in electronics, 2020-11, Vol.31 (22), p.19852-19874

2020

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Interfacial reaction and intermetallic compound formation of Sn–1Ag/ENIG and Sn–1Ag/ENEPIG solder joints

Journal of alloys and compounds, 2015-04, Vol.627, p.276-280

2015

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Advances in Silver Nanowires‐Based Composite Electrodes: Materials Processing, Fabrication, and Applications

Advanced materials technologies, 2023-10, Vol.8 (19)

2023

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Stretchable Piezoresistive Pressure Sensor Array with Sophisticated Sensitivity, Strain‐Insensitivity, and Reproducibility

Advanced science, 2024-09, Vol.11 (35), p.e2405374-n/a

2024

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A UV-responsive pressure sensitive adhesive for damage-free fabrication of an ultrathin imperceptible mechanical sensor with ultrahigh optical transparency

Journal of materials chemistry. A, Materials for energy and sustainability, 2019, Vol.7 (39), p.22588-22595

2019

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Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation

Crystals (Basel), 2024-05, Vol.14 (5), p.465

2024

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Design and fabrication of screen-printed silver circuits for stretchable electronics

Microelectronic engineering, 2014-05, Vol.120, p.216-220

2014

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Hydrothermally Grown In-doped ZnO Nanorods on p-GaN Films for Color-tunable Heterojunction Light-emitting-diodes

Scientific reports, 2015-05, Vol.5 (1), p.10410, Article 10410

2015

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Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes

Surface and interface analysis, 2018-11, Vol.50 (11), p.1046-1050

2018

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Interfacial reaction in steel–aluminum joints made by friction stir welding

Scripta materialia, 2006-08, Vol.55 (4), p.355-358

2006

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Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding

Journal of materials science. Materials in electronics, 2020-12, Vol.31 (24), p.22926-22932

2020

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Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints

Journal of materials science. Materials in electronics, 2018-03, Vol.29 (6), p.4724-4731

2018

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Microstructures and Mechanical Properties of the Sn58wt.%Bi Composite Solders with Sn Decorated MWCNT Particles

Journal of electronic materials, 2019-03, Vol.48 (3), p.1746-1753

2019

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Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing

Journal of alloys and compounds, 2005-03, Vol.390 (1), p.212-219

2005

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Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package

Journal of materials science. Materials in electronics, 2020-07, Vol.31 (13), p.10170-10176

2020

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Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85°C/85% Relative Humidity Environmental Conditions

Journal of electronic materials, 2020-02, Vol.49 (2), p.1527-1533

2020

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Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish

Journal of electronic materials, 2020-10, Vol.49 (10), p.6073-6079

2020

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Water‐Triggered Self‐Healing of Ti3C2Tx MXene Standalone Electrodes: Systematic Examination of Factors Affecting the Healing Process

Electronic textiles: New age of wearable technology for healthcare and fitness solutions

Low-melting metal thermal interface material for high-power package application

Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications

Synergistic effect of Indium and Gallium co-doping on growth behavior and physical properties of hydrothermally grown ZnO nanorods

Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Fast formation of Ni–Sn intermetallic joints using Ni–Sn paste for high-temperature bonding applications

Effect of surface finish metallization on mechanical strength of Ag sintered joint

Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn–58Bi solder joints during aging

Interfacial reaction and intermetallic compound formation of Sn–1Ag/ENIG and Sn–1Ag/ENEPIG solder joints

Advances in Silver Nanowires‐Based Composite Electrodes: Materials Processing, Fabrication, and Applications

Stretchable Piezoresistive Pressure Sensor Array with Sophisticated Sensitivity, Strain‐Insensitivity, and Reproducibility

A UV-responsive pressure sensitive adhesive for damage-free fabrication of an ultrathin imperceptible mechanical sensor with ultrahigh optical transparency

Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation

Design and fabrication of screen-printed silver circuits for stretchable electronics

Hydrothermally Grown In-doped ZnO Nanorods on p-GaN Films for Color-tunable Heterojunction Light-emitting-diodes

Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes

Interfacial reaction in steel–aluminum joints made by friction stir welding

Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding

Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints

Microstructures and Mechanical Properties of the Sn58wt.%Bi Composite Solders with Sn Decorated MWCNT Particles

Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing

Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package

Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85°C/85% Relative Humidity Environmental Conditions

Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish

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