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Lab on a chip, 2020-11, Vol.2 (23), p.4474-4485
2020
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Sensors (Basel, Switzerland), 2019-04, Vol.19 (8), p.1801
2019
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Micromachines (Basel), 2018-12, Vol.9 (12), p.639
2018
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Micro and nano systems letters, 2021-12, Vol.9 (1), p.1-8, Article 16
2021
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Micro and nano systems letters, 2019-10, Vol.7 (1), p.1-7, Article 15
2019
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Journal of Electrical Engineering & Technology, 2022, 17(2), , pp.1469-1473
2022
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International Neurourology Journal, 2015, 19(3), , pp.133-141
2015
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Transactions on Electrical and Electronic Materials, 2016, 17(3), , pp.150-154
2016
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Thin solid films, 2015-07, Vol.587, p.160-162
2015
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Thin solid films, 2011-08, Vol.519 (20), p.6654-6657
2011
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IEEE transactions on components and packaging technologies, 2007-03, Vol.30 (1), p.15-23
2007
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Materials science forum, 2017-08, Vol.904, p.115-119
2017
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Transactions on electrical and electronic materials, 2016-06, Vol.17 (3), p.150-154
2016
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Japanese Journal of Applied Physics, 2014-05, Vol.53 (5S1), p.5-1-05FD09-6
2014
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Electric power systems research, 2011-08, Vol.81 (8), p.1672-1680
2011
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Transactions on Electrical and Electronic Materials, 2015, 16(1), , pp.16-19
2015
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Electronic Materials Letters, 2013, 9(4), , pp.463-465
2013
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Nanoscale research letters, 2012-01, Vol.7 (1), p.55-55, Article 55
2012
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Journal of the Korean Physical Society, 2013, 63(2), , pp.246-250
2013
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Transactions on Electrical and Electronic Materials, 2015, 16(1), , pp.42-45
2015
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Journal of micromechanics and microengineering, 2008-04, Vol.18 (4), p.045020-045020 (12)
2008
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2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278), 2002, Vol.3, p.1409-1412 vol.3
2002
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IEEE transactions on advanced packaging, 2008-05, Vol.31 (2), p.357-366
2008
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IEEE transactions on components and packaging technologies, 2002-03, Vol.25 (1), p.106-111
2002
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Transactions on electrical and electronic materials, 2015-02, Vol.16 (1), p.16
2015
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