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Extreme Bottom-Up Superfilling of Through-Silicon-Vias by Damascene Processing: Suppressor Disruption, Positive Feedback and Turing Patterns

Journal of the Electrochemical Society, 2012-01, Vol.159 (4), p.D208-D216

2012

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Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown

Journal of the Electrochemical Society, 2018-01, Vol.165 (2), p.D23-D30

2018

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Survey of P-Block Metal Additives for Superconformal Cu Deposition in an Alkaline Electrolyte

Journal of the Electrochemical Society, 2022-09, Vol.169 (9), p.92505

2022

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Additives for Superconformal Gold Feature Filling

Journal of the Electrochemical Society, 2021-05, Vol.168 (5), p.52502

2021

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Bottom-up Filling of Damascene Trenches with Gold in a Sulfite Electrolyte

Journal of the Electrochemical Society, 2019, Vol.166 (1), p.D3022-D3034

2019

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Mechanism of Bismuth Stimulated Bottom-up Gold Feature Filling

Journal of the Electrochemical Society, 2022-12, Vol.169 (12), p.122507

2022

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Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias

Journal of the Electrochemical Society, 2016, Vol.163 (7), p.D322-D331

2016

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Robust Bottom-Up Gold Filling of Deep Trenches and Gratings

Journal of the Electrochemical Society, 2022-03, Vol.169 (3), p.32509

2022

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Spatial-Temporal Modeling of Extreme Bottom-up Filling of Through-Silicon-Vias

Journal of the Electrochemical Society, 2013, Vol.160 (12), p.D3260-D3265

2013

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Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias

Journal of the Electrochemical Society, 2017, Vol.164 (6), p.D327-D334

2017

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Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias

Journal of the Electrochemical Society, 2019, Vol.166 (1), p.D3259-D3271

2019

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Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction

Journal of the Electrochemical Society, 2018, Vol.165 (7), p.D291-D300

2018

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Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias

Journal of the Electrochemical Society, 2019, Vol.166 (1), p.D3254-D3258

2019

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Bottom-Up Gold Filling in New Geometries and Yet Higher Aspect Ratio Gratings for Hard X-ray Interferometry

Journal of the Electrochemical Society, 2021-08, Vol.168 (8), p.82508

2021

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Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias

Journal of the Electrochemical Society, 2021-11, Vol.168 (11), p.112501

2021

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Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias

Journal of the Electrochemical Society, 2022-03, Vol.169 (3), p.32508

2022

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Accelerated Bottom-Up Gold Filling of Metallized Trenches

Journal of the Electrochemical Society, 2019, Vol.166 (12), p.D487-D495

2019

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Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology

Journal of the Electrochemical Society, 2018-11, Vol.166 (1), p.D3066-D3071

2018

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Exploring the Limits of Bottom-Up Gold Filling to Fabricate Diffraction Gratings

Journal of the Electrochemical Society, 2019, Vol.166 (16), p.D898-D907

2019

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Superconformal film growth: Mechanism and quantification

IBM journal of research and development, 2005-01, Vol.49 (1), p.19-36

2005

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Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing

Electrochimica acta, 2007-11, Vol.53 (1), p.145-154

2007

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Superconformal Electrodeposition of Copper in 500–90 nm Features

Journal of the Electrochemical Society, 2000, Vol.147 (12), p.4524

2000

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Emission Ghost Imaging: reconstruction with data augmentation

Physical review. A, 2024-02, Vol.109 (2), Article 023501

2024

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Cationic Surfactants for the Control of Overfill Bumps in Cu Superfilling

Journal of the Electrochemical Society, 2006, Vol.153 (12), p.C826

2006

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The Impact of Adsorbates on Metal Deposition through the Curvature Enhanced Accelerator Coverage Mechanism and Beyond

ECS transactions, 2018, Vol.85 (12), p.25-30

2018

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Extreme Bottom-Up Superfilling of Through-Silicon-Vias by Damascene Processing: Suppressor Disruption, Positive Feedback and Turing Patterns

Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown

Survey of P-Block Metal Additives for Superconformal Cu Deposition in an Alkaline Electrolyte

Additives for Superconformal Gold Feature Filling

Bottom-up Filling of Damascene Trenches with Gold in a Sulfite Electrolyte

Mechanism of Bismuth Stimulated Bottom-up Gold Feature Filling

Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias

Robust Bottom-Up Gold Filling of Deep Trenches and Gratings

Spatial-Temporal Modeling of Extreme Bottom-up Filling of Through-Silicon-Vias

Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias

Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias

Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction

Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias

Bottom-Up Gold Filling in New Geometries and Yet Higher Aspect Ratio Gratings for Hard X-ray Interferometry

Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias

Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias

Accelerated Bottom-Up Gold Filling of Metallized Trenches

Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology

Exploring the Limits of Bottom-Up Gold Filling to Fabricate Diffraction Gratings

Superconformal film growth: Mechanism and quantification

Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing

Superconformal Electrodeposition of Copper in 500–90 nm Features

Emission Ghost Imaging: reconstruction with data augmentation

Cationic Surfactants for the Control of Overfill Bumps in Cu Superfilling

The Impact of Adsorbates on Metal Deposition through the Curvature Enhanced Accelerator Coverage Mechanism and Beyond

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