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Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

Microelectronics and reliability, 2012-03, Vol.52 (3), p.530-533

2012

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Te-centric view of the phase change mechanism in Ge-Sb-Te alloys

Physical review letters, 2012-05, Vol.108 (19), p.195506-195506, Article 195506

2012

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Effect of saccharin addition on the microstructure of electrodeposited Fe–36 wt.% Ni alloy

Surface & coatings technology, 2005-09, Vol.199 (1), p.43-48

2005

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On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology

Procedia engineering, 2016, Vol.139, p.101-111

2016

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Influence of dopants on atomic migration and void formation in molten Ge2Sb2Te5 under high-amplitude electrical pulse

Acta materialia, 2012-03, Vol.60 (5), p.2021-2030

2012

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Electromigration-Induced Plasticity: Texture Correlation and Implications for Reliability Assessment

Journal of electronic materials, 2009-03, Vol.38 (3), p.379-391

2009

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Characteristics of microstructure and electrical resistivity of inkjet-printed nanoparticle silver films annealed under ambient air

Philosophical magazine (Abingdon, England), 2008-01, Vol.88 (3), p.339-359

2008

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Observation of polyamorphism in the phase change alloy Ge1Sb2Te4

Applied physics letters, 2012-10, Vol.101 (15)

2012

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Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board

Thin solid films, 2006-05, Vol.504 (1), p.294-297

2006

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Electromigration proximity effects of two neighboring fast-diffusion segments in single-crystal aluminum lines

Journal of applied physics, 1999-02, Vol.85 (4), p.2108-2113

1999

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Structural Instability in Amorphous In-Ga-Zn-O Films Investigated by Mechanical Stress Analysis

ECS solid state letters, 2014-04, Vol.3 (6), p.P73-P76

2014

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Electromigration in single-crystal aluminum lines with fast diffusion paths made by nanoindentation

Acta materialia, 1998-03, Vol.46 (6), p.1969-1979

1998

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Stress-induced surface damage and grain boundary characteristics of sputtered and electroplated copper thin films

Acta materialia, 2004-05, Vol.52 (8), p.2435-2440

2004

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Impurity redistributions in electroplated Cu films during self-annealing

Thin solid films, 2002-04, Vol.408 (1), p.230-235

2002

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Microstructural Evidence of Abnormal Grain Growth by Solid-State Wetting in Fe-3%Si Steel

Materials science forum, 2004-01, Vol.467-470, p.917-922

2004

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Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low- k interconnects for ULSI

Thin solid films, 2006-05, Vol.504 (1), p.284-287

2006

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Electromigration damage in mechanically deformed Al conductor lines: dislocations as fast diffusion paths

Acta materialia, 2000-05, Vol.48 (9), p.2199-2208

2000

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Anisotropy of grain boundary energies as cause of abnormal grain growth in electroplated copper films

Scripta materialia, 2003-03, Vol.48 (6), p.683-688

2003

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A new technique to measure through film thickness fracture toughness

Thin solid films, 2001-12, Vol.401 (1), p.203-210

2001

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Relationship between grain structures and texture of damascene Cu lines

Journal of electronic materials, 2004, Vol.33 (1), p.48-52

2004

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Comparison of mechanical stresses of Cu Through-Silicon Via (TSV) samples fabricated by Hynix vs. SEMATECH using synchrotron X-ray microdiffraction for 3-D integration and reliability

2012 IEEE International Interconnect Technology Conference, 2012, p.1-3

2012

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Modeling of the Structure and Reliability of Near-Bamboo Interconnects

MRS proceedings, 1995, Vol.391, p.163-176, Article 163

1995

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Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding

Journal of electronic packaging, 2004-03, Vol.126 (1), p.120-123

2004

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A model for hillock growth in Al thin films controlled by plastic deformation

Acta materialia, 2007-09, Vol.55 (15), p.5297-5301

2007

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Plasticity-Amplified Diffusivity: Dislocation Cores as Fast Diffusion Paths in CU Interconnects

2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual, 2007, p.122-127

2007

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Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

Te-centric view of the phase change mechanism in Ge-Sb-Te alloys

Effect of saccharin addition on the microstructure of electrodeposited Fe–36 wt.% Ni alloy

On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology

Influence of dopants on atomic migration and void formation in molten Ge2Sb2Te5 under high-amplitude electrical pulse

Electromigration-Induced Plasticity: Texture Correlation and Implications for Reliability Assessment

Characteristics of microstructure and electrical resistivity of inkjet-printed nanoparticle silver films annealed under ambient air

Observation of polyamorphism in the phase change alloy Ge1Sb2Te4

Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board

Electromigration proximity effects of two neighboring fast-diffusion segments in single-crystal aluminum lines

Structural Instability in Amorphous In-Ga-Zn-O Films Investigated by Mechanical Stress Analysis

Electromigration in single-crystal aluminum lines with fast diffusion paths made by nanoindentation

Stress-induced surface damage and grain boundary characteristics of sputtered and electroplated copper thin films

Impurity redistributions in electroplated Cu films during self-annealing

Microstructural Evidence of Abnormal Grain Growth by Solid-State Wetting in Fe-3%Si Steel

Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low- k interconnects for ULSI

Electromigration damage in mechanically deformed Al conductor lines: dislocations as fast diffusion paths

Anisotropy of grain boundary energies as cause of abnormal grain growth in electroplated copper films

A new technique to measure through film thickness fracture toughness

Relationship between grain structures and texture of damascene Cu lines

Comparison of mechanical stresses of Cu Through-Silicon Via (TSV) samples fabricated by Hynix vs. SEMATECH using synchrotron X-ray microdiffraction for 3-D integration and reliability

Modeling of the Structure and Reliability of Near-Bamboo Interconnects

Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding

A model for hillock growth in Al thin films controlled by plastic deformation

Plasticity-Amplified Diffusivity: Dislocation Cores as Fast Diffusion Paths in CU Interconnects

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