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A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System

IEEE transactions on electromagnetic compatibility, 2021-06, Vol.63 (3), p.935-946

2021

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Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-09, Vol.8 (9), p.1658-1671

2018

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Active Silicon Interposer Design for Interposer-Level Wireless Power Transfer Technology for High-Density 2.5-D and 3-D ICs

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-08, Vol.6 (8), p.1148-1161

2016

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analysis of power inverter parasitic inductances effect on switching characteristics for accurate electromagnetic interference (EMI) estimation

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017, p.277-282

2017

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Smartwatch Strap Wireless Power Transfer System With Flexible PCB Coil and Shielding Material

IEEE transactions on industrial electronics (1982), 2019-05, Vol.66 (5), p.4054-4064

2019

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Inverter modeling including non-ideal IGBT characteristics in Hybrid Electric Vehicle for accurate EMI noise prediction

2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2015, p.691-695

2015

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Multi-layer probe card design with signal/power integrity for wafer-level AP test in LPDDR4 channel

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2016, p.547-552

2016

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Low Leakage Electromagnetic Field Level and High Efficiency Using a Novel Hybrid Loop-Array Design for Wireless High Power Transfer System

IEEE transactions on industrial electronics (1982), 2019-06, Vol.66 (6), p.4356-4367

2019

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Design and Measurement of a Novel On-Interposer Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in 2.5-D/3-D IC

IEEE transactions on components, packaging, and manufacturing technology (2011), 2019-02, Vol.9 (2), p.317-328

2019

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A Frequency-Selective EMI Reduction Method for Tightly Coupled Wireless Power Transfer Systems Using Resonant Frequency Control of a Shielding Coil in Smartphone Application

IEEE transactions on electromagnetic compatibility, 2019-12, Vol.61 (6), p.2031-2039

2019

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Channel Characteristic-Based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer

IEEE transactions on electromagnetic compatibility, 2022-02, Vol.64 (1), p.196-208

2022

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Bayesian Exploration Imitation Learning-Based Contextual via Design Optimization Method of PAM-4-Based High-Speed Serial Link

IEEE transactions on electromagnetic compatibility, 2023-12, Vol.65 (6), p.1751-1762

2023

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Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module

IEEE transactions on components, packaging, and manufacturing technology (2011), 2023-11, Vol.13 (11), p.1804-1816

2023

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Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via

IEEE transactions on components, packaging, and manufacturing technology (2011), 2019-01, Vol.9 (1), p.107-121

2019

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A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an n th Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System

IEEE transactions on electromagnetic compatibility, 2021-06, Vol.63 (3), p.935-946

2021

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Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-04, Vol.8 (4), p.1-12

2018

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Novel Target-Impedance Extraction Method-Based Optimal PDN Design for High-Performance SSD Using Deep Reinforcement Learning

IEEE transactions on signal and power integrity, 2023-01, Vol.2, p.1-13

2023

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Design and analysis of magnetically coupled coil structures for PCB-to-active interposer wireless power transfer in 2.5D/3D-IC

2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2014, p.1-4

2014

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Design and analysis of on-interposer active power distribution network for an efficient simultaneous switching noise suppression in 2.5D IC

2016 IEEE International 3D Systems Integration Conference (3DIC), 2016, p.1-5

2016

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Audio frequency ground integrity modeling and measurement for a TDMA smartphone system

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2016, p.3-5

2016

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Chip-level wireless power transfer scheme design for next generation wireless interconnected three-dimensional integrated circuits

2017 IEEE Wireless Power Transfer Conference (WPTC), 2017, p.1-4

2017

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Hybrid metamaterial with zero and negative permeability to enhance efficiency in wireless power transfer system

2016 IEEE Wireless Power Transfer Conference (WPTC), 2016, p.1-3

2016

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PCB-package to chip wireless power transfer scheme using magnetic-field resonance coupling for high-density 3-D IC

2016 IEEE Wireless Power Transfer Conference (WPTC), 2016, p.1-4

2016

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Dual-directional near field communication tag antenna with effective magnetic field isolation from wireless power transfer system

2017 IEEE Wireless Power Transfer Conference (WPTC), 2017, p.1-3

2017

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Electromagnetic Bandgap Design for Power Distribution Network Noise Isolation in the Glass Interposer

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1856-1861

2016

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A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System

Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface

Active Silicon Interposer Design for Interposer-Level Wireless Power Transfer Technology for High-Density 2.5-D and 3-D ICs

analysis of power inverter parasitic inductances effect on switching characteristics for accurate electromagnetic interference (EMI) estimation

Smartwatch Strap Wireless Power Transfer System With Flexible PCB Coil and Shielding Material

Inverter modeling including non-ideal IGBT characteristics in Hybrid Electric Vehicle for accurate EMI noise prediction

Multi-layer probe card design with signal/power integrity for wafer-level AP test in LPDDR4 channel

Low Leakage Electromagnetic Field Level and High Efficiency Using a Novel Hybrid Loop-Array Design for Wireless High Power Transfer System

Design and Measurement of a Novel On-Interposer Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in 2.5-D/3-D IC

A Frequency-Selective EMI Reduction Method for Tightly Coupled Wireless Power Transfer Systems Using Resonant Frequency Control of a Shielding Coil in Smartphone Application

Channel Characteristic-Based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer

Bayesian Exploration Imitation Learning-Based Contextual via Design Optimization Method of PAM-4-Based High-Speed Serial Link

Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module

Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via

A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an n th Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System

Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System

Novel Target-Impedance Extraction Method-Based Optimal PDN Design for High-Performance SSD Using Deep Reinforcement Learning

Design and analysis of magnetically coupled coil structures for PCB-to-active interposer wireless power transfer in 2.5D/3D-IC

Design and analysis of on-interposer active power distribution network for an efficient simultaneous switching noise suppression in 2.5D IC

Audio frequency ground integrity modeling and measurement for a TDMA smartphone system

Chip-level wireless power transfer scheme design for next generation wireless interconnected three-dimensional integrated circuits

Hybrid metamaterial with zero and negative permeability to enhance efficiency in wireless power transfer system

PCB-package to chip wireless power transfer scheme using magnetic-field resonance coupling for high-density 3-D IC

Dual-directional near field communication tag antenna with effective magnetic field isolation from wireless power transfer system

Electromagnetic Bandgap Design for Power Distribution Network Noise Isolation in the Glass Interposer

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