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Multilayer Substrate Integrated Waveguide Four-Way Out-of-Phase Power Divider

IEEE transactions on microwave theory and techniques, 2009-12, Vol.57 (12), p.3469-3476

2009

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Signal Integrity Improvements of a MEMS Probe Card Using Back-Drilling and Equalizing Techniques

IEEE transactions on instrumentation and measurement, 2011-03, Vol.60 (3), p.872-879

2011

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Multi-layer four-way out-of-phase power divider for substrate integrated waveguide applications

2009 IEEE MTT-S International Microwave Symposium Digest, 2009, p.477-480

2009

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A 3.2-12.8Gb/s Duty-Cycle Compensating Quadrature Error Corrector for DRAM Interfaces, With Fast Locking and Low Power Characteristics

ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC), 2021, p.463-466

2021

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A 40-Gb/s/pin Low-Voltage POD Single-Ended PAM-4 Transceiver with Timing Calibrated Reset-less Slicer and Bidirectional T-Coil for GDDR7 Application

2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2022, p.148-149

2022

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A 60-Gb/s/pin single-ended PAM-4 transmitter with timing skew training and low power data encoding in mimicked 10nm class DRAM process

2022 IEEE Custom Integrated Circuits Conference (CICC), 2022, p.1-2

2022

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A 1.2V 1.33Gb/s/pin 8Tb NAND flash memory multi-chip package employing F-chip for low power and high performance storage applications

2017 Symposium on VLSI Circuits, 2017, p.C194-C195

2017

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Multilayer Substrate Integrated Waveguide Four-Way Out-of-Phase Power Divider: SPECIAL ISSUE ON 2009 INTERNATIONAL MICROWAVE SYMPOSIUM

IEEE transactions on microwave theory and techniques, 2009, Vol.57 (12), p.3469-3476

2009

Volltextzugriff (PDF)

Compact ridged substrate integrated waveguide cavity backed slot antenna

2013 IEEE Antennas and Propagation Society International Symposium (APSURSI), 2013, p.57-58

2013

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SUBSTRATE INTEGRAGED WAVEGUIDE WILKINSON POWER DIVIDER WITH IMPROVED ISOLATION PERFORMANCE

Progress in electromagnetics research. Letters, 2010, Vol.19, p.41-48

2010

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13.4 A 512Gb 3-bit/Cell 3D 6th-Generation V-NAND Flash Memory with 82MB/s Write Throughput and 1.2Gb/s Interface

2019 IEEE International Solid- State Circuits Conference - (ISSCC), 2019, p.216-218

2019

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Compact LTCC band pass filter using high-Q bondwire inductor for RF system-in-package applications

Microwave and optical technology letters, 2009-06, Vol.51 (6), p.1424-1428

2009

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NEW COMPOSITE POWER PLANE USING SPIRAL EBG AND EXTERNAL MAGNETIC MATERIAL FOR SSN SUPPRESSION

Progress in electromagnetics research. Letters, 2010, Vol.15, p.69-77

2010

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Substrate integrate waveguide quasi Yagi antenna using SIW-to-CPS transition for low mutual coupling

2010 IEEE Antennas and Propagation Society International Symposium, 2010, p.1-4

2010

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An ultra low power CMOS transceiver having a short range wake-up for lR-WPAN applications

2009 European Microwave Integrated Circuits Conference (EuMIC), 2009, p.262-265

2009

Volltextzugriff (PDF)

A 24Gb/s/pin PAM-4 Built Out Tester chip enabling PAM-4 chips test with NRZ interface ATE

2021 IEEE Asian Solid-State Circuits Conference (A-SSCC), 2021, p.1-3

2021

Volltextzugriff (PDF)

Signal integrity and reliability of a new Multi-Stack Package using a Pressure Conductive Rubber

2008 Electrical Design of Advanced Packaging and Systems Symposium, 2008, p.214-217

2008

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Implementation of the SIW Klopfenstein taper using a comb-SIW

2011 41st European Microwave Conference, 2011, p.432-435

2011

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Analysis and improvement of electromagnetic susceptibility on high speed LVDS I/O system

2010 Asia-Pacific Microwave Conference, 2010, p.175-178

2010

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Super compact UWB bandpass filter using unit-cell CRLH-TL based on via-pin capacitor

2009 European Microwave Conference (EuMC), 2009, p.1389-1392

2009

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Multilayer Substrate Integrated Waveguide Four-Way Out-of-Phase Power Divider

Signal Integrity Improvements of a MEMS Probe Card Using Back-Drilling and Equalizing Techniques

Multi-layer four-way out-of-phase power divider for substrate integrated waveguide applications

A 3.2-12.8Gb/s Duty-Cycle Compensating Quadrature Error Corrector for DRAM Interfaces, With Fast Locking and Low Power Characteristics

A 40-Gb/s/pin Low-Voltage POD Single-Ended PAM-4 Transceiver with Timing Calibrated Reset-less Slicer and Bidirectional T-Coil for GDDR7 Application

A 60-Gb/s/pin single-ended PAM-4 transmitter with timing skew training and low power data encoding in mimicked 10nm class DRAM process

A 1.2V 1.33Gb/s/pin 8Tb NAND flash memory multi-chip package employing F-chip for low power and high performance storage applications

Multilayer Substrate Integrated Waveguide Four-Way Out-of-Phase Power Divider: SPECIAL ISSUE ON 2009 INTERNATIONAL MICROWAVE SYMPOSIUM

Compact ridged substrate integrated waveguide cavity backed slot antenna

SUBSTRATE INTEGRAGED WAVEGUIDE WILKINSON POWER DIVIDER WITH IMPROVED ISOLATION PERFORMANCE

13.4 A 512Gb 3-bit/Cell 3D 6th-Generation V-NAND Flash Memory with 82MB/s Write Throughput and 1.2Gb/s Interface

Compact LTCC band pass filter using high-Q bondwire inductor for RF system-in-package applications

NEW COMPOSITE POWER PLANE USING SPIRAL EBG AND EXTERNAL MAGNETIC MATERIAL FOR SSN SUPPRESSION

Substrate integrate waveguide quasi Yagi antenna using SIW-to-CPS transition for low mutual coupling

An ultra low power CMOS transceiver having a short range wake-up for lR-WPAN applications

A 24Gb/s/pin PAM-4 Built Out Tester chip enabling PAM-4 chips test with NRZ interface ATE

Signal integrity and reliability of a new Multi-Stack Package using a Pressure Conductive Rubber

Implementation of the SIW Klopfenstein taper using a comb-SIW

Analysis and improvement of electromagnetic susceptibility on high speed LVDS I/O system

Super compact UWB bandpass filter using unit-cell CRLH-TL based on via-pin capacitor

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