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Comparative transcriptome analysis and HPLC reveal candidate genes associated with synthesis of bioactive constituents in Rheum palmatum complex

Physiology and molecular biology of plants, 2024-08, Vol.30 (8), p.1239-1252

2024

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Tissue-specific transcriptome for Rheum tanguticum reveals candidate genes related to the anthraquinones biosynthesis

Physiology and molecular biology of plants, 2021-11, Vol.27 (11), p.2487-2501

2021

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Tourism Competitiveness Evaluation: Evidence From Mountain Tourism in China

Frontiers in psychology, 2022-03, Vol.13, p.809314-809314

2022

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Peimine promotes microglial polarization to the M2 phenotype to attenuate drug-resistant epilepsy through suppressing the TLR4/NF-κB/HIF-1α signaling pathway in a rat model and in BV-2 microglia

Heliyon, 2024-08, Vol.10 (15), p.e34987, Article e34987

2024

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Exploring the Construction Path of Characteristic Volunteer Service Teams in “Double First-Class” Universities under the Volunteer Service Framework

SHS web of conferences, 2024, Vol.187, p.3007

2024

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Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn–3.5Ag solder bumps

Microelectronics and reliability, 2013-02, Vol.53 (2), p.321-326

2013

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Model of the influencing factors of the withdrawal from rural homesteads in China: Application of grounded theory method

Land use policy, 2019-06, Vol.85, p.285

2019

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Retraction notice to “Model of the influencing factors of the withdrawal from rural homesteads in China: Application of grounded theory method” [Land Use Policy 85 (2019) 285–289]

Land use policy, 2022-10, Vol.121, p.106313, Article 106313

2022

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Transcriptome profiles of yellowish-white and fuchsia colored flowers in the Rheum palmatum complex reveal genes related to color polymorphism

Plant molecular biology, 2022-09, Vol.110 (1-2), p.187-197

2022

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RETRACTED: Model of the influencing factors of the withdrawal from rural homesteads in China: Application of grounded theory method

Land use policy, 2019-06, Vol.85, p.285-289

2019

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Development of Large Die Fine-Pitch Cu/Low- k FCBGA Package With Through Silicon via (TSV) Interposer

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-05, Vol.1 (5), p.660-672

2011

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Comparative Transcriptome Analyses of Different Rheum officinale Tissues Reveal Differentially Expressed Genes Associated with Anthraquinone, Catechin, and Gallic Acid Biosynthesis

Genes, 2022-09, Vol.13 (9), p.1592

2022

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Comparative Transcriptome Analyses of Different IRheum officinale/I Tissues Reveal Differentially Expressed Genes Associated with Anthraquinone, Catechin, and Gallic Acid Biosynthesis

Genes, 2022-09, Vol.13 (9)

2022

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An Improved k-Means Clustering Algorithm for the Community Discovery

Journal of Software Engineering, 2015-03, Vol.9 (2), p.242-253

Yan, Sun Jiang

2015

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Research on the Construction of Financial Shared Service Centers for Group Companies

International Journal of Global Economics and Management, 2024-03, Vol.2 (2), p.12-18

2024

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The Problems in Signal Detection of Multi-Band Spread Spectrum

Applied Mechanics and Materials, 2012-09, Vol.198-199, p.1768-1773

Sun, Jiang Yan

2012

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Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

2009 59th Electronic Components and Technology Conference, 2009, p.305-312

2009

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Effect of Ni-W alloy barrier layer on copper pillar/Sn IMCs evolution

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012, p.1294-1296

2012

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Effect of different pretreatments on through silicon via copper filling

2013 14th International Conference on Electronic Packaging Technology, 2013, p.169-172

2013

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Pure Bottom-up filling process for efficient TSV metallization

2013 14th International Conference on Electronic Packaging Technology, 2013, p.356-359

2013

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Investigation of competitive adsorption between accelerator and suppressor in TSV copper electroplating

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012, p.434-437

2012

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The study on the shaping of electroplated copper pillar bumping

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, 2011, p.1-4

2011

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Electrochemical analysis of cathode in TSV copper electroplating

2012 2nd IEEE CPMT Symposium Japan, 2012, p.1-4

2012

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Effect of deposit microstructure on the reflow discoloration of electroplating pure tin

2011 International Symposium on Advanced Packaging Materials (APM), 2011, p.158-162

2011

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Newly developed in-situ formation of SnAg and SnAgCu solder on copper pillar bump

2011 IEEE 13th Electronics Packaging Technology Conference, 2011, p.175-179

2011

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Comparative transcriptome analysis and HPLC reveal candidate genes associated with synthesis of bioactive constituents in Rheum palmatum complex

Tissue-specific transcriptome for Rheum tanguticum reveals candidate genes related to the anthraquinones biosynthesis

Tourism Competitiveness Evaluation: Evidence From Mountain Tourism in China

Peimine promotes microglial polarization to the M2 phenotype to attenuate drug-resistant epilepsy through suppressing the TLR4/NF-κB/HIF-1α signaling pathway in a rat model and in BV-2 microglia

Exploring the Construction Path of Characteristic Volunteer Service Teams in “Double First-Class” Universities under the Volunteer Service Framework

Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn–3.5Ag solder bumps

Model of the influencing factors of the withdrawal from rural homesteads in China: Application of grounded theory method

Retraction notice to “Model of the influencing factors of the withdrawal from rural homesteads in China: Application of grounded theory method” [Land Use Policy 85 (2019) 285–289]

Transcriptome profiles of yellowish-white and fuchsia colored flowers in the Rheum palmatum complex reveal genes related to color polymorphism

RETRACTED: Model of the influencing factors of the withdrawal from rural homesteads in China: Application of grounded theory method

Development of Large Die Fine-Pitch Cu/Low- k FCBGA Package With Through Silicon via (TSV) Interposer

Comparative Transcriptome Analyses of Different Rheum officinale Tissues Reveal Differentially Expressed Genes Associated with Anthraquinone, Catechin, and Gallic Acid Biosynthesis

Comparative Transcriptome Analyses of Different IRheum officinale/I Tissues Reveal Differentially Expressed Genes Associated with Anthraquinone, Catechin, and Gallic Acid Biosynthesis

An Improved k-Means Clustering Algorithm for the Community Discovery

Research on the Construction of Financial Shared Service Centers for Group Companies

The Problems in Signal Detection of Multi-Band Spread Spectrum

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

Effect of Ni-W alloy barrier layer on copper pillar/Sn IMCs evolution

Effect of different pretreatments on through silicon via copper filling

Pure Bottom-up filling process for efficient TSV metallization

Investigation of competitive adsorption between accelerator and suppressor in TSV copper electroplating

The study on the shaping of electroplated copper pillar bumping

Electrochemical analysis of cathode in TSV copper electroplating

Effect of deposit microstructure on the reflow discoloration of electroplating pure tin

Newly developed in-situ formation of SnAg and SnAgCu solder on copper pillar bump

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