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Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints

Materials characterization, 2020-05, Vol.163, p.110287, Article 110287

2020

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Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2019-01, Vol.50 (1), p.480-492

2019

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Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux

Journal of manufacturing processes, 2021-02, Vol.62, p.291-301

2021

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Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2016-09, Vol.673, p.167-177

2016

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Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux

Journal of materials science. Materials in electronics, 2021-10, Vol.32 (19), p.24507-24523

2021

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Effects of ultrasonic treatment on mechanical properties and microstructure evolution of the Cu/SAC305 solder joints

Journal of manufacturing processes, 2021-04, Vol.64, p.648-654

2021

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Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Applied physics. A, Materials science & processing, 2020-04, Vol.126 (4), Article 297

2020

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Form-stable phase change materials enhanced photothermic conversion and thermal conductivity by Ag-expanded graphite

Journal of energy storage, 2022-08, Vol.52, p.105060, Article 105060

2022

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Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn–30Sn–2Cu high temperature lead-free solder alloy

Journal of materials science. Materials in electronics, 2020-10, Vol.31 (19), p.16437-16447

2020

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Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints

Journal of materials science. Materials in electronics, 2020-02, Vol.31 (3), p.2320-2330

2020

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Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration

Journal of materials science. Materials in electronics, 2021-07, Vol.32 (13), p.17336-17348

2021

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Study on the performance of Cu foam with different porosity on SAC305 solder joints under ultrasonic-assisted soldering

Journal of materials science. Materials in electronics, 2021-12, Vol.32 (24), p.28108-28118

2021

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Interfacial microstructure evolution of solder joints by doping Cu nanoparticles into Ni(P) electroless plating

Journal of materials science. Materials in electronics, 2020-11, Vol.31 (22), p.20232-20244

2020

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Influence of CrFeCoNiCu high-entropy alloy and ultrasonic stirring on the thermal, electrochemical and mechanical properties of Zn-30Sn high-temperature solder alloy

Materials characterization, 2023-07, Vol.201, p.112977, Article 112977

2023

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MXene-decorated bio-based porous carbon composite phase change material for superior solar-thermal energy storage and thermal management of electronic components

Journal of materials research and technology, 2023-11, Vol.27, p.1857-1873

2023

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Effect of electroplating parameters on electroplated Cu film and microvoid formation of solder joints

Journal of materials science. Materials in electronics, 2018-11, Vol.29 (21), p.18404-18416

2018

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Interfacial IMC Growth and Nanomechanical Characterizations of Solder in Sn-16Sb/Cu Joints during Solid-state Aging

Journal of Wuhan University of Technology. Materials science edition, 2019-10, Vol.34 (5), p.1210-1219

2019

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Enhanced thermal performance of phase-change materials supported by mesoporous silica modified with polydopamine/nano-metal particles for thermal energy storage

Renewable energy, 2021-11, Vol.178, p.118-127

2021

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Fe doped Ni–Co alloy by electroplating as protective coating for solid oxide fuel cell interconnect application

International journal of hydrogen energy, 2021-11, Vol.46 (79), p.39457-39468

2021

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Form-stable phase change materials based on graphene-doped PVA aerogel achieving effective solar energy photothermal conversion and storage

Solar energy, 2023-05, Vol.255, p.146-156

2023

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A structured phase change material integrated by MXene/AgNWs modified dual-network and polyethylene glycol for energy storage and thermal management

Applied energy, 2023-11, Vol.349, p.121658, Article 121658

2023

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Lipophilic Modified Hierarchical Multiporous rGO Aerogel-Based Organic Phase Change Materials for Effective Thermal Energy Storage

ACS applied materials & interfaces, 2022-12, Vol.14 (49), p.55098-55108

2022

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Cu doped Ni–Co spinel protective coatings for solid oxide fuel cell interconnects application

International journal of hydrogen energy, 2021-09, Vol.46 (67), p.33580-33593

2021

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A polyurethane solid–solid phase change material for flexible use in thermal management

Chemical engineering journal (Lausanne, Switzerland : 1996), 2024-05, Vol.488, p.150930, Article 150930

2024

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Effect of Cu additions on mechanical properties of Ni3Sn4-based intermetallic compounds: First-principles calculations and nano-indentation measurements

Vacuum, 2019-06, Vol.164, p.7-14

2019

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Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints

Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints

Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux

Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints

Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux

Effects of ultrasonic treatment on mechanical properties and microstructure evolution of the Cu/SAC305 solder joints

Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Form-stable phase change materials enhanced photothermic conversion and thermal conductivity by Ag-expanded graphite

Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn–30Sn–2Cu high temperature lead-free solder alloy

Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints

Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration

Study on the performance of Cu foam with different porosity on SAC305 solder joints under ultrasonic-assisted soldering

Interfacial microstructure evolution of solder joints by doping Cu nanoparticles into Ni(P) electroless plating

Influence of CrFeCoNiCu high-entropy alloy and ultrasonic stirring on the thermal, electrochemical and mechanical properties of Zn-30Sn high-temperature solder alloy

MXene-decorated bio-based porous carbon composite phase change material for superior solar-thermal energy storage and thermal management of electronic components

Effect of electroplating parameters on electroplated Cu film and microvoid formation of solder joints

Interfacial IMC Growth and Nanomechanical Characterizations of Solder in Sn-16Sb/Cu Joints during Solid-state Aging

Enhanced thermal performance of phase-change materials supported by mesoporous silica modified with polydopamine/nano-metal particles for thermal energy storage

Fe doped Ni–Co alloy by electroplating as protective coating for solid oxide fuel cell interconnect application

Form-stable phase change materials based on graphene-doped PVA aerogel achieving effective solar energy photothermal conversion and storage

A structured phase change material integrated by MXene/AgNWs modified dual-network and polyethylene glycol for energy storage and thermal management

Lipophilic Modified Hierarchical Multiporous rGO Aerogel-Based Organic Phase Change Materials for Effective Thermal Energy Storage

Cu doped Ni–Co spinel protective coatings for solid oxide fuel cell interconnects application

A polyurethane solid–solid phase change material for flexible use in thermal management

Effect of Cu additions on mechanical properties of Ni3Sn4-based intermetallic compounds: First-principles calculations and nano-indentation measurements

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