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A Three-Dimensional Stacked-Chip Star-Wiring Interconnection for a Digital Noise-Free and Low-Jitter I/O Clock Distribution Network

IEEE microwave and wireless components letters, 2006-12, Vol.16 (12), p.651-653

2006

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Chip-package hybrid clock distribution network and DLL for low jitter clock delivery

IEEE journal of solid-state circuits, 2006-01, Vol.41 (1), p.274-286

2006

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SMPS noise managing methodology for RFI solution in mobile platforms

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2016, p.21-23

2016

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Fast insertion loss estimation method for meshed ground by shape conversion

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015, p.129-131

2015

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A chip-package hybrid DLL loop and clock distribution network for low-jitter clock delivery

ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005, 2005, p.514-614 Vol. 1

2005

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3D interconnection using butterfly via for high speed and RF package design

2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI), 2011, p.69-71

2011

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Advanced coreless flip-chip BGA package with high dielectric constant thin film embedded decoupling capacitor

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.595-600

2011

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Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array

IEEE design & test of computers, 2006-05, Vol.23 (3), p.212-219

2006

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Novel electrical modelling and measurement technique of hybrid package (FusionQuad) for characterization of RF and high speed signals

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2009, p.1-4

2009

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Electrical characterization of wafer level fan-out (WLFO) using film substrate for low cost millimeter wave application

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.1461-1467

2010

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Evaluation and verification of enhanced electrical performance of advanced coreless flip-chip BGA package with warpage measurement data

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.897-903

2012

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Electrical evaluation of wafer level fan out (WLFO) package using organic substrates for microwave applications

3rd Electronics System Integration Technology Conference ESTC, 2010, p.1-6

2010

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Design trade-off for resonance reduction of multiple power planes in Super Ball Grid Array (SBGA) package

2010 IEEE CPMT Symposium Japan, 2010, p.1-4

2010

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Implementation of low jitter clock distribution using chip-package hybrid interconnection

Electrical Performance of Electronic Packaging - 2004, 2004, p.291-294

2004

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Staleness aware semi-asynchronous federated learning

Journal of parallel and distributed computing, 2024-11, Vol.193, p.104950, Article 104950

2024

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Atomic Structure Modification of Fe‒N‒C Catalysts via Morphology Engineering of Graphene for Enhanced Conversion Kinetics of Lithium–Sulfur Batteries

Advanced functional materials, 2022-05, Vol.32 (19), p.n/a

2022

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Switched Oscillator With Quarter-Wave, Open-Circuited Stub for Generating Mesoband High-Power Microwave Pulses

IEEE transactions on microwave theory and techniques, 2020-08, Vol.68 (8), p.3471-3479

2020

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Reactive capture of CO2 via amino acid

Nature communications, 2024-09, Vol.15 (1), p.7849-10, Article 7849

2024

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Effect of trunk stabilization exercise on abdominal muscle thickness, balance and gait abilities of patients with hemiplegic stroke: A randomized controlled trial

NeuroRehabilitation (Reading, Mass.), 2020-01, Vol.47 (4), p.435-442

2020

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Effectiveness of Proprioceptive Neuromuscular Facilitation on Walking Speed, Discomfort, and Knee Extension in an Acute Stroke Patient: A Case Study

South Eastern European journal of public health, 2024-09, p.64-68

2024

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Effectiveness of Task-Oriented Training in Improving Gait in a Child with Ataxic Cerebral Palsy: A Case Report

International Journal of Religion, 2024-09, Vol.5 (11), p.9262-9265

2024

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Single-Switch-Based High-Power Bipolar Pulse Generator With Inverted U-Shaped Parallel-Plate Transmission Line

IEEE transactions on microwave theory and techniques, 2018-05, Vol.66 (5), p.2425-2432

2018

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Influence of the Hawthorne effect on spatiotemporal parameters, kinematics, ground reaction force, and the symmetry of the dominant and nondominant lower limbs during gait

Journal of biomechanics, 2023-05, Vol.152, p.111555-111555, Article 111555

2023

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The Effect of Augmented Reality-Based Proprioceptive Training Program on Balance, Positioning Sensation and Flexibility in Healthy Young Adults: A Randomized Controlled Trial

Healthcare (Basel), 2022-06, Vol.10 (7), p.1202

2022

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14‐1: Distinguished Paper: A Multi‐Unit Compensation for OLED Burn‐In in Mobile Displays

SID International Symposium Digest of technical papers, 2021-05, Vol.52 (1), p.165-168

2021

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A Three-Dimensional Stacked-Chip Star-Wiring Interconnection for a Digital Noise-Free and Low-Jitter I/O Clock Distribution Network

Chip-package hybrid clock distribution network and DLL for low jitter clock delivery

SMPS noise managing methodology for RFI solution in mobile platforms

Fast insertion loss estimation method for meshed ground by shape conversion

A chip-package hybrid DLL loop and clock distribution network for low-jitter clock delivery

3D interconnection using butterfly via for high speed and RF package design

Advanced coreless flip-chip BGA package with high dielectric constant thin film embedded decoupling capacitor

Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array

Novel electrical modelling and measurement technique of hybrid package (FusionQuad) for characterization of RF and high speed signals

Electrical characterization of wafer level fan-out (WLFO) using film substrate for low cost millimeter wave application

Evaluation and verification of enhanced electrical performance of advanced coreless flip-chip BGA package with warpage measurement data

Electrical evaluation of wafer level fan out (WLFO) package using organic substrates for microwave applications

Design trade-off for resonance reduction of multiple power planes in Super Ball Grid Array (SBGA) package

Implementation of low jitter clock distribution using chip-package hybrid interconnection

Staleness aware semi-asynchronous federated learning

Atomic Structure Modification of Fe‒N‒C Catalysts via Morphology Engineering of Graphene for Enhanced Conversion Kinetics of Lithium–Sulfur Batteries

Switched Oscillator With Quarter-Wave, Open-Circuited Stub for Generating Mesoband High-Power Microwave Pulses

Reactive capture of CO2 via amino acid

Effect of trunk stabilization exercise on abdominal muscle thickness, balance and gait abilities of patients with hemiplegic stroke: A randomized controlled trial

Effectiveness of Proprioceptive Neuromuscular Facilitation on Walking Speed, Discomfort, and Knee Extension in an Acute Stroke Patient: A Case Study

Effectiveness of Task-Oriented Training in Improving Gait in a Child with Ataxic Cerebral Palsy: A Case Report

Single-Switch-Based High-Power Bipolar Pulse Generator With Inverted U-Shaped Parallel-Plate Transmission Line

Influence of the Hawthorne effect on spatiotemporal parameters, kinematics, ground reaction force, and the symmetry of the dominant and nondominant lower limbs during gait

The Effect of Augmented Reality-Based Proprioceptive Training Program on Balance, Positioning Sensation and Flexibility in Healthy Young Adults: A Randomized Controlled Trial

14‐1: Distinguished Paper: A Multi‐Unit Compensation for OLED Burn‐In in Mobile Displays

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