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IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-09, Vol.8 (9), p.1561-1572
- Cheng-Ta Ko
- Yang, Henry
- Lau, John H.
- Ming Li
- Li, Margie
- Lin, Curry
- Lin, J. W.
- Chen, Tony
- Xu, Iris
- Chieh-Lin Chang
- Jhih-Yuan Pan
- Hsing-Hui Wu
- Qing Xiang Yong
- Fan, Nelson
- Kuah, Eric
- Zhang Li
- Kim Hwee Tan
- Yiu-Ming Cheung
- Ng, Eric
- Wu Kai
- Ji Hao
- Beica, Rozalia
- Lin, Marc
- Yu-Hua Chen
- Zhong Cheng
- Koh Sau Wee
- Jiang Ran
- Cao Xi
- Sze Pei Lim
- Lee, N. C.
- Mian Tao
- Lo, Jeffery
- Lee, Ricky S. W.
2018
- Link zum Volltext
International Symposium on Microelectronics, 2018-10, Vol.2018 (1), p.57-63
2018
Link zum Volltext
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.14-20
2019
- Link zum Volltext
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.355-363
- Ko, Cheng-Ta
- Chang, Chieh-Lin
- Pan, Jhih-Yuan
- Wu, Hsing-Hui
- Yong, Qing Xiang
- Fan, Nelson
- Kuah, Eric
- Li, Zhang
- Tan, Kim Hwee
- Cheung, Y. M.
- Ng, Eric
- Yang, Henry
- Kai, Wu
- Hao, Ji
- Beica, Rozalia
- Lin, Marc
- Chen, Y.H.
- Cheng, Zhong
- Wee, Koh Sau
- Ran, Jiang
- Xi, Cao
- Lim, Sze Pei
- Lau, John
- Lee, N.C.
- Tao, Mian
- Lo, Jeffery
- Lee, Ricky
- Li, Ming
- Li, Margie
- Lin, Curry
- Lin, J.W.
- Chen, Tony
- Xu, Iris
2018
- Link zum Volltext
Journal of microelectronics and electronic packaging, 2018-10, Vol.15 (4), p.141-147
2018
Link zum Volltext
Sensors and actuators. A. Physical., 2008-10, Vol.147 (2), p.649-655
2008
Link zum Volltext
Journal of optics. A, Pure and applied optics, 2009-01, Vol.11 (1), p.015503-015503 (8)
2009
Link zum Volltext
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Thema
- Science & Technology
- Engineering
- Engineering, Electrical & Electronic
- Technology
- Heterogeneous Integration
- Electromagnetic Compatibility
- Metals
- Packaging
- Plating
- Resists
- Substrates
- Capacitors
- Compression Molding
- Conductors
- Copper
- Dielectrics
- Display Devices, Liquid-Crystal Devices
- Drop Tests
- Drop-On-Demand
- Droplet Generator
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