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Novel Probability Density Function of Pad Asperity by Wear Effect over Time in Chemical Mechanical Planarization

Materials, 2024-04, Vol.17 (8), p.1817

2024

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Modeling of step height reduction with temperature function in copper CMP

Journal of Mechanical Science and Technology, 2023, 37(12), , pp.6213-6220

2023

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X-ray Diffraction Analysis of Damaged Layer During Polishing of Silicon Carbide

International journal of precision engineering and manufacturing, 2023, Vol.24 (1), p.25-32

2023

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Analysis of Correlation between Pad Temperature and Asperity Angle in Chemical Mechanical Planarization

Applied sciences, 2021-02, Vol.11 (4), p.1507

2021

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Effect of spray nozzle position on pad temperature distribution and wafer non-uniformity

Journal of Mechanical Science and Technology, 2019, 33(12), , pp.5677-5682

2019

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Chemical mechanical planarization of advanced package substrate by controlling selectivity of copper to polymer

Journal of Mechanical Science and Technology, 2018, 32(8), , pp.3843-3848

2018

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Deep ensemble learning for material removal rate prediction in chemical mechanical planarization with pad surface topography

Precision engineering, 2024-06, Vol.88, p.777-787

2024

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Planarization profile modeling using pad bulk deformation and real contact area analysis of macro-scale device pattern

Japanese Journal of Applied Physics, 2023-07, Vol.62 (SH), p.SH1003

2023

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Reduction of the Maximum Step Height on a Package Substrate by the Optimization of Slurry Chemical Additives

International journal of precision engineering and manufacturing, 2019-06, Vol.20 (6), p.905-913

2019

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Surface Activation by Electrolytically Ionized Slurry during Cu CMP

ECS journal of solid state science and technology, 2019, Vol.8 (5), p.P3053-P3057

2019

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Effect of Slurry Film Thickness Variation according to Spray Range Using Ultrasonic Spray Nozzle on Material Removal Rate

Journal of the Korean Society for Precision Engineering, 2022-09, Vol.39 (9), p.675-682

2022

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Investigation of Planarization Using Real Contact Area Measurement in CMP Process

Journal of the Korean Society for Precision Engineering, 2022-08, Vol.39 (8), p.547-555

2022

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Data Augmentation Methods for Improving the Performance of Machine Reading Comprehension

Chŏngbo Kwahakhoe nonmunji, 2021-12, Vol.48 (12), p.1298-1304

2021

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Identification of the Break-In Mechanism by Asperity Deformation of CMP Pad

Journal of the Korean Society for Precision Engineering, 2021-02, Vol.38 (2), p.87-95

2021

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Variation of Pad Temperature Distribution by Slurry Supply Conditions

Journal of the Korean Society for Precision Engineering, 2020-12, Vol.37 (12), p.873-880

2020

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Planarization Modeling Based on Contact Mode Between Pad Asperity and Oxide Pattern During CMP

Journal of the Korean Society for Precision Engineering, 2019-04, Vol.36 (4), p.363-372

2019

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Planarization Modeling for Device Pattern with Geometric Characteristics of Pad Asperity

Journal of the Korean Society for Precision Engineering, 2020-08, Vol.37 (8), p.567-577

2020

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Finite Element Analysis on Dynamic Viscoelasticity of CMP Polishing Pad

Journal of the Korean Society for Precision Engineering, 2019-02, Vol.36 (2), p.177-181

2019

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Concentration Effect of Reducing Agents on Green Synthesis of Gold Nanoparticles: Size, Morphology, and Growth Mechanism

Nanoscale research letters, 2016-12, Vol.11 (1), p.230-230, Article 230

2016

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A multi-level intrusion detection method for abnormal network behaviors

Journal of network and computer applications, 2016-02, Vol.62, p.9-17

2016

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INO80 Is Required for the Cell Cycle Control, Survival, and Differentiation of Mouse ESCs by Transcriptional Regulation

International journal of molecular sciences, 2022-12, Vol.23 (23), p.15402

2022

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A Charge-Domain Scalable-Weight In-Memory Computing Macro With Dual-SRAM Architecture for Precision-Scalable DNN Accelerators

IEEE transactions on circuits and systems. I, Regular papers, 2021-08, Vol.68 (8), p.3305-3316

2021

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RNA helicase DEAD-box-5 is involved in R-loop dynamics of preimplantation embryos

Animal Bioscience, 2024, 37(6), , pp.1021-1030

2024

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Platycodon saponins from Platycodi Radix (Platycodon grandiflorum) for the Green Synthesis of Gold and Silver Nanoparticles

Nanoscale research letters, 2018-01, Vol.13 (1), p.23-23, Article 23

2018

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Fabrication of nanoribbons by dielectrophoresis assisted cold welding of gold nanoparticles on mica substrate

Scientific reports, 2019-03, Vol.9 (1), p.3629-3629, Article 3629

2019

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Novel Probability Density Function of Pad Asperity by Wear Effect over Time in Chemical Mechanical Planarization

Modeling of step height reduction with temperature function in copper CMP

X-ray Diffraction Analysis of Damaged Layer During Polishing of Silicon Carbide

Analysis of Correlation between Pad Temperature and Asperity Angle in Chemical Mechanical Planarization

Effect of spray nozzle position on pad temperature distribution and wafer non-uniformity

Chemical mechanical planarization of advanced package substrate by controlling selectivity of copper to polymer

Deep ensemble learning for material removal rate prediction in chemical mechanical planarization with pad surface topography

Planarization profile modeling using pad bulk deformation and real contact area analysis of macro-scale device pattern

Reduction of the Maximum Step Height on a Package Substrate by the Optimization of Slurry Chemical Additives

Surface Activation by Electrolytically Ionized Slurry during Cu CMP

Effect of Slurry Film Thickness Variation according to Spray Range Using Ultrasonic Spray Nozzle on Material Removal Rate

Investigation of Planarization Using Real Contact Area Measurement in CMP Process

Data Augmentation Methods for Improving the Performance of Machine Reading Comprehension

Identification of the Break-In Mechanism by Asperity Deformation of CMP Pad

Variation of Pad Temperature Distribution by Slurry Supply Conditions

Planarization Modeling Based on Contact Mode Between Pad Asperity and Oxide Pattern During CMP

Planarization Modeling for Device Pattern with Geometric Characteristics of Pad Asperity

Finite Element Analysis on Dynamic Viscoelasticity of CMP Polishing Pad

Concentration Effect of Reducing Agents on Green Synthesis of Gold Nanoparticles: Size, Morphology, and Growth Mechanism

A multi-level intrusion detection method for abnormal network behaviors

INO80 Is Required for the Cell Cycle Control, Survival, and Differentiation of Mouse ESCs by Transcriptional Regulation

A Charge-Domain Scalable-Weight In-Memory Computing Macro With Dual-SRAM Architecture for Precision-Scalable DNN Accelerators

RNA helicase DEAD-box-5 is involved in R-loop dynamics of preimplantation embryos

Platycodon saponins from Platycodi Radix (Platycodon grandiflorum) for the Green Synthesis of Gold and Silver Nanoparticles

Fabrication of nanoribbons by dielectrophoresis assisted cold welding of gold nanoparticles on mica substrate

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