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The testing method of data transmission services of IEC 61850 based client

2009 Transmission & Distribution Conference & Exposition: Asia and Pacific, 2009, p.1-4

2009

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Mesa-type quantum cascade lasers fabricated by using inductively coupled plasma reactive ion etching

Electronics letters, 2019-05, Vol.55 (11), p.660-661

2019

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Fabrication of continuously porous SiC-Si3N4 composite using SiC powder by extrusion process

Journal of the European Ceramic Society, 2006, Vol.26 (13), p.2467-2473

2006

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Forksheet FETs for Advanced CMOS Scaling: Forksheet-Nanosheet Co-Integration and Dual Work Function Metal Gates at 17nm N-P Space

2021 Symposium on VLSI Technology, 2021, p.1-2

2021

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Interfacial strengths of organosilicate glasses deposited on silicon wafers

Materials chemistry and physics, 2008-03, Vol.108 (1), p.115-119

2008

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(E)-1-(3,4-Dihydroxyphenethyl)-3-Styrylurea Inhibits Proliferation of MCF-7 Cells through G₁ Cell Cycle Arrest and Mitochondria-Mediated Apoptosis

Molecules and Cells, 2010, 30(4), , pp.303-310

2010

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18F-fluorodeoxyglucose positron emission tomography and magnetic resonance imaging findings of primary intracranial histiocytic sarcoma in a dog

Journal of Veterinary Medical Science, 2009, Vol.71(10), pp.1397-1401

2009

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Epstein-Barr virus-infected Akata cells are sensitive to histone deacetylase inhibitor TSA-provoked apoptosis

BMB reports, 2005-11, Vol.38 (6), p.755-762

2005

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Reliability robustness of 65nm BEOL Cu damascene interconnects using porous CVD low-k dielectrics with k = 2.2

Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004, 2004, p.66-67

2004

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Comparison of Biofilm Formed on Stainless Steel and Copper Pipe Through the Each Process of Water Treatment Plant

The Korean Journal of Microbiology, 2013-12, Vol.49 (4), p.313-320

2013

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Impact Behavior of Hybrid-Fiber and Hybrid-Matrix Composites

Journal of reinforced plastics and composites, 1991-07, Vol.10 (4), p.356-378

1991

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A new criterion for composite material mixed mode fracture analysis

Engineering fracture mechanics, 1989, Vol.34 (3), p.749-769

1989

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An energy based mode III fracture criterion for composites

Engineering fracture mechanics, 1991, Vol.38 (6), p.353-360

1991

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Application of the [formula omitted] to mixed mode fracture analysis of orthotropic composites

Engineering fracture mechanics, 1990, Vol.36 (3), p.507-514

1990

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A comparative study of soft-switched CCM boost rectifiers and interleaved variable-frequency DCM boost rectifier

APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058), 2000, Vol.1, p.171-177 vol.1

2000

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An energy based fracture criterion for mode II crack in fiber composites

Engineering fracture mechanics, 1990, Vol.36 (1), p.49-59

1990

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Robust low-k film (k=2.1/spl sim/2.5) for 90/65 nm BEOL technology using bilayer film schemes

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729), 2004, p.181-183

2004

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Advanced 300 mm Cu/CVD LK (k=2.2) multilevel damascene integration for 90/65 nm generation BEOL interconnect technologies

2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407), 2003, p.105-106

2003

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Advanced metal barrier free Cu damascene interconnects with PECVD silicon carbide barriers for 90/65-nm BEOL technology

Digest. International Electron Devices Meeting, 2002, p.595-598

2002

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Advanced Cu/low-k (k=2.2) multilevel interconnect for 0.10/0.07 /spl mu/m generation

2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303), 2002, p.18-19

2002

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High performance 90/65nm BEOL technology with CVD porous low-k dielectrics (k/spl sim/2.5) and low-k etching stop (k/spl sim/3.0)

IEEE International Electron Devices Meeting 2003, 2003, p.35.3.1-35.3.4

2003

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A Fracture Criterion for Composites Using an Energy Approach

Advances in Fracture Research, 1989, p.4047-4053

1989

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Characterization of chemical-mechanical planarization processes

International Electron Devices and Materials Symposium, 1994, p.11-11

1994

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The testing method of data transmission services of IEC 61850 based client

Mesa-type quantum cascade lasers fabricated by using inductively coupled plasma reactive ion etching

Fabrication of continuously porous SiC-Si3N4 composite using SiC powder by extrusion process

Forksheet FETs for Advanced CMOS Scaling: Forksheet-Nanosheet Co-Integration and Dual Work Function Metal Gates at 17nm N-P Space

Interfacial strengths of organosilicate glasses deposited on silicon wafers

(E)-1-(3,4-Dihydroxyphenethyl)-3-Styrylurea Inhibits Proliferation of MCF-7 Cells through G₁ Cell Cycle Arrest and Mitochondria-Mediated Apoptosis

18F-fluorodeoxyglucose positron emission tomography and magnetic resonance imaging findings of primary intracranial histiocytic sarcoma in a dog

Epstein-Barr virus-infected Akata cells are sensitive to histone deacetylase inhibitor TSA-provoked apoptosis

Reliability robustness of 65nm BEOL Cu damascene interconnects using porous CVD low-k dielectrics with k = 2.2

Comparison of Biofilm Formed on Stainless Steel and Copper Pipe Through the Each Process of Water Treatment Plant

Impact Behavior of Hybrid-Fiber and Hybrid-Matrix Composites

A new criterion for composite material mixed mode fracture analysis

An energy based mode III fracture criterion for composites

Application of the [formula omitted] to mixed mode fracture analysis of orthotropic composites

A comparative study of soft-switched CCM boost rectifiers and interleaved variable-frequency DCM boost rectifier

An energy based fracture criterion for mode II crack in fiber composites

Robust low-k film (k=2.1/spl sim/2.5) for 90/65 nm BEOL technology using bilayer film schemes

Advanced 300 mm Cu/CVD LK (k=2.2) multilevel damascene integration for 90/65 nm generation BEOL interconnect technologies

Advanced metal barrier free Cu damascene interconnects with PECVD silicon carbide barriers for 90/65-nm BEOL technology

Advanced Cu/low-k (k=2.2) multilevel interconnect for 0.10/0.07 /spl mu/m generation

High performance 90/65nm BEOL technology with CVD porous low-k dielectrics (k/spl sim/2.5) and low-k etching stop (k/spl sim/3.0)

A Fracture Criterion for Composites Using an Energy Approach

Characterization of chemical-mechanical planarization processes

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