UB Paderborn / Katalog / Suche / in CDI

Power module electronics in HEV/EV applications: New trends in wide-bandgap semiconductor technologies and design aspects

Renewable & sustainable energy reviews, 2019-10, Vol.113, p.109264, Article 109264

2019

Volltextzugriff (PDF)

Wireless pad-free integrated circuit debugging by powering modulation and lock-in infrared sensing

Applied physics letters, 2013-02, Vol.102 (8)

2013

Volltextzugriff (PDF)

Hot spot analysis in integrated circuit substrates by laser mirage effect

Applied physics letters, 2011-04, Vol.98 (16), p.164104-164104-3

2011

Volltextzugriff (PDF)

Omalizumab updosing allows disease activity control in patients with refractory chronic spontaneous urticaria

British journal of dermatology (1951), 2018-07, Vol.179 (1), p.210-212

2018

Volltextzugriff (PDF)

Functional and Consumption Analysis of Integrated Circuits Supplied by Inductive Power Transfer by Powering Modulation and Lock-In Infrared Imaging

IEEE transactions on industrial electronics (1982), 2015-12, Vol.62 (12), p.7774-7785

2015

Volltextzugriff (PDF)

Behaviour of 1.2 kV SiC JBS diodes under repetitive high power stress

Microelectronics and reliability, 2008-08, Vol.48 (8), p.1444-1448

2008

Volltextzugriff (PDF)

Design methodologies for reliability of SSL LED boards

Microelectronics and reliability, 2013-08, Vol.53 (8), p.1076-1083

2013

Volltextzugriff (PDF)

Irradiance-based emissivity correction in infrared thermography for electronic applications

Review of scientific instruments, 2011-11, Vol.82 (11), p.114901-114901-9

2011

Volltextzugriff (PDF)

Small signal thermal analysis of local multibarrier behaviour in SiC Schottky diodes

Journal of physics. D, Applied physics, 2014-09, Vol.47 (38), p.385101-10

2014

Volltextzugriff (PDF)

Carrier Concentration Analysis in 1.2 kV SiC Schottky Diodes Under Current Crowding

IEEE electron device letters, 2022-06, Vol.43 (6), p.938-941

2022

Volltextzugriff (PDF)

P-GaN HEMTs Drain and Gate Current Analysis Under Short-Circuit

IEEE electron device letters, 2017-04, Vol.38 (4), p.505-508

2017

Volltextzugriff (PDF)

Demonstration of temperature compensated voltage reference integrated circuit designed with 4H-SiC MESFETs

2014 International Semiconductor Conference (CAS), 2014, p.233-236

2014

Volltextzugriff (PDF)

Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

IEEE transactions on power electronics, 2014-05, Vol.29 (5), p.2261-2271

2014

Volltextzugriff (PDF)

Physically based analysis of electrical frequency response of passive microelectronic circuits by heterodyne lock-in thermal means

Journal of physics. D, Applied physics, 2013-11, Vol.46 (44), p.445501-1-11

2013

Volltextzugriff (PDF)

Clinical and economic burden of community-onset multidrug-resistant infections requiring hospitalization

The Journal of infection, 2020-03, Vol.80 (3), p.271-278

2020

Volltextzugriff (PDF)

Thermal phase lag heterodyne infrared imaging for current tracking in radio frequency integrated circuits

Applied physics letters, 2017-02, Vol.110 (9)

2017

Volltextzugriff (PDF)

SiC Schottky Diode surge current analysis and application design using behavioral SPICE models

CAS 2012 (International Semiconductor Conference), 2012, Vol.2, p.359-362

2012

Volltextzugriff (PDF)

Thermal cycling analysis of high temperature die-attach materials

Microelectronics and reliability, 2012-09, Vol.52 (9-10), p.2314-2320

2012

Volltextzugriff (PDF)

Enhanced power cycling capability of SiC Schottky diodes using press pack contacts

Microelectronics and reliability, 2012-09, Vol.52 (9-10), p.2250-2255

2012

Volltextzugriff (PDF)

Study of heat sources interacting in integrated circuits by laser mirage effect

Applied physics letters, 2014-08, Vol.105 (8)

2014

Volltextzugriff (PDF)

Comparison of temperature limits for Trench silicon IGBT technologies for medium power applications

Microelectronics and reliability, 2014-09, Vol.54 (9-10), p.1839-1844

2014

Volltextzugriff (PDF)

Temperature effects on the ruggedness of SiC Schottky diodes under surge current

Microelectronics and reliability, 2014-09, Vol.54 (9-10), p.2207-2212

2014

Volltextzugriff (PDF)

Structural analysis of SiC Schottky diodes failure mechanism under current overload

Journal of physics. D, Applied physics, 2014-02, Vol.47 (5), p.55102

2014

Volltextzugriff (PDF)

Long-Term Reliability of Railway Power Inverters Cooled by Heat-Pipe-Based Systems

IEEE transactions on industrial electronics (1982), 2011-07, Vol.58 (7), p.2662-2672

2011

Volltextzugriff (PDF)

Demonstration of High Temperature Bandgap Voltage Reference Feasibility on SiC Material

Materials science forum, 2010-01, Vol.645-648, p.1131-1134

2010

Volltextzugriff (PDF)

Menü

Weitere Dienste

Einstellungen

Power module electronics in HEV/EV applications: New trends in wide-bandgap semiconductor technologies and design aspects

Wireless pad-free integrated circuit debugging by powering modulation and lock-in infrared sensing

Hot spot analysis in integrated circuit substrates by laser mirage effect

Omalizumab updosing allows disease activity control in patients with refractory chronic spontaneous urticaria

Functional and Consumption Analysis of Integrated Circuits Supplied by Inductive Power Transfer by Powering Modulation and Lock-In Infrared Imaging

Behaviour of 1.2 kV SiC JBS diodes under repetitive high power stress

Design methodologies for reliability of SSL LED boards

Irradiance-based emissivity correction in infrared thermography for electronic applications

Small signal thermal analysis of local multibarrier behaviour in SiC Schottky diodes

Carrier Concentration Analysis in 1.2 kV SiC Schottky Diodes Under Current Crowding

P-GaN HEMTs Drain and Gate Current Analysis Under Short-Circuit

Demonstration of temperature compensated voltage reference integrated circuit designed with 4H-SiC MESFETs

Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

Physically based analysis of electrical frequency response of passive microelectronic circuits by heterodyne lock-in thermal means

Clinical and economic burden of community-onset multidrug-resistant infections requiring hospitalization

Thermal phase lag heterodyne infrared imaging for current tracking in radio frequency integrated circuits

SiC Schottky Diode surge current analysis and application design using behavioral SPICE models

Thermal cycling analysis of high temperature die-attach materials

Enhanced power cycling capability of SiC Schottky diodes using press pack contacts

Study of heat sources interacting in integrated circuits by laser mirage effect

Comparison of temperature limits for Trench silicon IGBT technologies for medium power applications

Temperature effects on the ruggedness of SiC Schottky diodes under surge current

Structural analysis of SiC Schottky diodes failure mechanism under current overload

Long-Term Reliability of Railway Power Inverters Cooled by Heat-Pipe-Based Systems

Demonstration of High Temperature Bandgap Voltage Reference Feasibility on SiC Material

Suchergebnisse filtern