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Impact of the pre amorphization by Ge implantation on Ni0.9Pt0.1 silicide

Microelectronic engineering, 2022-02, Vol.254, p.111705, Article 111705

2022

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SOI pMOS drain leakage understanding based on TCAD and measurements

2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2023, p.65-68

2023

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Doped Channel SOI pMOS TCAD Description Including Floating Body Effects

2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2023, p.69-72

2023

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Through Silicon Capacitor co-integrated with TSVs on silicon interposer

Microelectronic engineering, 2014-05, Vol.120, p.121-126

2014

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Service Oriented, Holonic and Multi-agent Manufacturing Systems for Industry of the Future: Proceedings of SOHOMA 2021

1, 2022

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Copper pillar interconnect capability for mmwave applications in 3D integration technology

Microelectronic engineering, 2013-07, Vol.107, p.72-79

2013

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Nanoscale effect on the formation of the amorphous Ni silicide by rapid thermal annealing from crystalline and pre-amorphized silicon

Acta materialia, 2024-01, Vol.262, p.119430, Article 119430

2024

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Assessment of transistors based on GaN on silicon substrate in view of integration with silicon technology

Semiconductor science and technology, 2013-09, Vol.28 (9), p.94003-1-6

2013

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High-electron-mobility AlGaN∕GaN heterostructures grown on Si(001) by molecular-beam epitaxy

Applied physics letters, 2005-09, Vol.87 (13)

2005

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Electrical characterization of SOI pMOS device leakage

Solid-state electronics, 2023-10, Vol.208, p.108740, Article 108740

2023

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AlGaN/GaN HEMTs on a (001)-Oriented Silicon Substrate Based on 100-nm SiN Recessed Gate Technology for Microwave Power Amplification

IEEE transactions on electron devices, 2007-11, Vol.54 (11), p.2843-2848

2007

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Extracting edge conduction around threshold in mesa-isolated SOI MOSFETs

Solid-state electronics, 2023-11, Vol.209, p.108736, Article 108736

2023

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AlGaN/GaN HEMTs on (001) silicon substrates

Electronics letters, 2006-01, Vol.42 (2), p.117-118

2006

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Low-frequency Noise Performance of pMOS SOI Transistors for Analog Applications

2024 IEEE European Solid-State Electronics Research Conference (ESSERC), 2024, p.452-455

2024

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Cripping Assistive Tech Design: How the Current Disability Framework Limits Our Ability to Create Emancipatory Technology

Service Oriented, Holonic and Multi-Agent Manufacturing Systems for Industry of the Future, 2022, Vol.1034, p.377-388

2022

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Impact of the pre amorphization by Ge implantation on Ni$_{0.9}$Pt$_{0.1}$ silicide

Microelectronic engineering, 2022-02, Vol.254

2022

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SI4M: An Approach of Maturity Assessment Model in Industry 4.0 for Small and Medium Enterprises

Service Oriented, Holonic and Multi-Agent Manufacturing Systems for Industry of the Future, 2022, Vol.1034, p.291-302

2022

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Prediction of the evolution of defects induced by the heated implantation process: Contribution of kinetic Monte Carlo in a multi-scale modeling framework

Solid-state electronics, 2023-02, Vol.200, p.108521, Article 108521

2023

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Fault-Tolerance in Cyber-Physical Systems Using Holonic Multi-agent Systems

Service Oriented, Holonic and Multi-Agent Manufacturing Systems for Industry of the Future, 2022, Vol.1034, p.51-63

2022

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Trust Model for Digital Twin Based Recommendation System

Service Oriented, Holonic and Multi-Agent Manufacturing Systems for Industry of the Future, 2022, Vol.1034, p.145-159

2022

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3-Tier BSI CIS with 3D Sequential & Hybrid Bonding Enabling a1.4um pitch,106dB HDR Flicker Free Pixel

2022 International Electron Devices Meeting (IEDM), 2022, p.37.4.1-37.4.4

2022

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Aggregation Patterns in Holonic Manufacturing Systems

Service Oriented, Holonic and Multi-Agent Manufacturing Systems for Industry of the Future, 2022, Vol.1034, p.3-15

2022

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P-type Extended Drain MOSFET integration on thin SOI

2024 IEEE European Solid-State Electronics Research Conference (ESSERC), 2024, p.9-12

2024

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Designing Shoestring Solutions: An Approach for Designing Low-Cost Digital Solutions for Manufacturing

Service Oriented, Holonic and Multi-Agent Manufacturing Systems for Industry of the Future, 2022, Vol.1034, p.249-262

2022

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Towards the Integration of Digital Twins and Service-Oriented Architectures

Service Oriented, Holonic and Multi-Agent Manufacturing Systems for Industry of the Future, 2022, Vol.1034, p.131-143

2022

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Impact of the pre amorphization by Ge implantation on Ni0.9Pt0.1 silicide

SOI pMOS drain leakage understanding based on TCAD and measurements

Doped Channel SOI pMOS TCAD Description Including Floating Body Effects

Through Silicon Capacitor co-integrated with TSVs on silicon interposer

Service Oriented, Holonic and Multi-agent Manufacturing Systems for Industry of the Future: Proceedings of SOHOMA 2021

Copper pillar interconnect capability for mmwave applications in 3D integration technology

Nanoscale effect on the formation of the amorphous Ni silicide by rapid thermal annealing from crystalline and pre-amorphized silicon

Assessment of transistors based on GaN on silicon substrate in view of integration with silicon technology

High-electron-mobility AlGaN∕GaN heterostructures grown on Si(001) by molecular-beam epitaxy

Electrical characterization of SOI pMOS device leakage

AlGaN/GaN HEMTs on a (001)-Oriented Silicon Substrate Based on 100-nm SiN Recessed Gate Technology for Microwave Power Amplification

Extracting edge conduction around threshold in mesa-isolated SOI MOSFETs

AlGaN/GaN HEMTs on (001) silicon substrates

Low-frequency Noise Performance of pMOS SOI Transistors for Analog Applications

Cripping Assistive Tech Design: How the Current Disability Framework Limits Our Ability to Create Emancipatory Technology

Impact of the pre amorphization by Ge implantation on Ni$_{0.9}$Pt$_{0.1}$ silicide

SI4M: An Approach of Maturity Assessment Model in Industry 4.0 for Small and Medium Enterprises

Prediction of the evolution of defects induced by the heated implantation process: Contribution of kinetic Monte Carlo in a multi-scale modeling framework

Fault-Tolerance in Cyber-Physical Systems Using Holonic Multi-agent Systems

Trust Model for Digital Twin Based Recommendation System

3-Tier BSI CIS with 3D Sequential & Hybrid Bonding Enabling a1.4um pitch,106dB HDR Flicker Free Pixel

Aggregation Patterns in Holonic Manufacturing Systems

P-type Extended Drain MOSFET integration on thin SOI

Designing Shoestring Solutions: An Approach for Designing Low-Cost Digital Solutions for Manufacturing

Towards the Integration of Digital Twins and Service-Oriented Architectures

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