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High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates

Journal of materials science. Materials in electronics, 2018-02, Vol.29 (3), p.1785-1797

2018

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Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices

Acta materialia, 2017-05, Vol.129, p.41-51

2017

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Self-healing of cracks in Ag joining layer for die-attachment in power devices

Applied physics letters, 2016-08, Vol.109 (9)

2016

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Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles

Applied physics letters, 2019-04, Vol.114 (16)

2019

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Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design

Journal of electronic materials, 2017-03, Vol.46 (3), p.1576-1586

2017

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CoW metallization for high strength bonding to both sintered Ag joints and encapsulation resins

Journal of materials science. Materials in electronics, 2019-06, Vol.30 (12), p.11151-11163

2019

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Prominent interface structure and bonding material of power module for high temperature operation

2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD), 2017, p.491-494

2017

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Reliability Evaluation of SiC Power Module With Sintered Ag Die Attach and Stress-Relaxation Structure

IEEE transactions on components, packaging, and manufacturing technology (2011), 2019-04, Vol.9 (4), p.609-615

2019

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Effect of W content in Co-W-P metallization on both oxidation resistance and resin adhesion

Journal of materials science, 2020, Vol.55 (2), p.644-659

2020

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In situ TEM observation of sintered Ag die-attach layer with added tungsten carbide particles while heating to high temperature

Japanese Journal of Applied Physics, 2019-10, Vol.58 (10), p.100910

2019

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Effect of annealing Co-W-P metallization substrate onto its resin adhesion

Journal of materials science. Materials in electronics, 2019-07, Vol.30 (14), p.13247-13257

2019

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Dielectric Relaxation of Polymer/Carbon Dioxide Systems

Macromolecules, 2009-07, Vol.42 (13), p.4712-4718

2009

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Synthesis and Catalytic Performance of Organic-Inorganic Hybrid Mesoporous Material Having Basic Nanospace

Catalysis letters, 2010-12, Vol.140 (3-4), p.121-126

2010

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Effect of pre-annealing of Au metallization structure on the bonding performance with low temperature pressureless sintering Ag

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018, p.116-120

2018

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Metallization technology of SiC power module in high temperature operation

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018, p.371-374

2018

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Low-Stress Design for SiC Power Modules with Sintered Porous Ag Interconnection

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.2058-2062

2016

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First failure point of a SiC power module with sintered Ag die-attach on reliability tests

2017 International Conference on Electronics Packaging (ICEP), 2017, p.97-100

2017

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Effect of size and shape of Ag particles for mechanical properties of sintered Ag joints evaluated by micro-compression test

2017 International Conference on Electronics Packaging (ICEP), 2017, p.130-134

2017

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High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates

Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices

Self-healing of cracks in Ag joining layer for die-attachment in power devices

Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles

Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design

CoW metallization for high strength bonding to both sintered Ag joints and encapsulation resins

Prominent interface structure and bonding material of power module for high temperature operation

Reliability Evaluation of SiC Power Module With Sintered Ag Die Attach and Stress-Relaxation Structure

Effect of W content in Co-W-P metallization on both oxidation resistance and resin adhesion

In situ TEM observation of sintered Ag die-attach layer with added tungsten carbide particles while heating to high temperature

Effect of annealing Co-W-P metallization substrate onto its resin adhesion

Dielectric Relaxation of Polymer/Carbon Dioxide Systems

Synthesis and Catalytic Performance of Organic-Inorganic Hybrid Mesoporous Material Having Basic Nanospace

Effect of pre-annealing of Au metallization structure on the bonding performance with low temperature pressureless sintering Ag

Metallization technology of SiC power module in high temperature operation

Low-Stress Design for SiC Power Modules with Sintered Porous Ag Interconnection

First failure point of a SiC power module with sintered Ag die-attach on reliability tests

Effect of size and shape of Ag particles for mechanical properties of sintered Ag joints evaluated by micro-compression test

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