UB Paderborn / Katalog / Suche / in CDI

Molecularly derived mesoscale modeling of an epoxy/Cu interface: Interface roughness

Microelectronics and reliability, 2013-08, Vol.53 (8), p.1101-1110

Iwamoto, Nancy

2013

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Developing the stress–strain curve to failure using mesoscale models parameterized from molecular models

Microelectronics and reliability, 2012-07, Vol.52 (7), p.1291-1299

Iwamoto, Nancy

2012

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Modeling mechanical properties of an epoxy using particle dynamics, as parameterized through molecular modeling

Microelectronics and reliability, 2011-06, Vol.51 (6), p.1035-1045

Iwamoto, Nancy

2011

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Modeling mechanical properties of an epoxy using particle dynamics, as parameterized through molecular modeling : THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS (EUROSIME 2010)

Microelectronics and reliability, 2011, Vol.51 (6), p.1035-1045

IWAMOTO, Nancy

2011

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Molecularly derived mesoscale modeling of an epoxy/Cu interface: Interface roughness : THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS

Microelectronics and reliability, 2013, Vol.53 (8), p.1101-1110

IWAMOTO, Nancy

2013

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Water Effects in Polymers Through Molecular Dynamics

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.1659-1667

Iwamoto, Nancy

2018

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Multiscale perspectives of interface delamination in microelectronic packaging applications

Molecular simulation, 2011-07, Vol.37 (8), p.710-717

2011

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Perspectives of water effects in polymers through molecular dynamics

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018, p.1-13

Iwamoto, Nancy

2018

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Performance properties in thick film silicate dielectric layers using molecular modeling

Microelectronics and reliability, 2009-08, Vol.49 (8), p.877-883

2009

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Molecular Modeling for Reliability Issues

Reliability of Organic Compounds in Microelectronics and Optoelectronics, 2022, p.105-150

2022

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Molecularly derived mesoscale modeling of an epoxy/Cu interface (part III): Interface roughness

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2012, p.1/8-8/8

Iwamoto, Nancy

2012

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Developing the mesoscale stress-strain curve to failure

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2011, p.1/7-7/7

Iwamoto, Nancy

2011

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Mechanical properties of an epoxy modeled using particle dynamics, as parameterized through molecular modeling

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010, p.1-7

Iwamoto, Nancy

2010

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Molecularly derived mesoscale modeling of an epoxy/Cu interface (Part IV): The effect of Filler

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013, p.1-7

Iwamoto, N.

2013

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Studies of Mesoscale Models Parameterized by Molecular Models for Interface Failure in Epoxy Molding Compounds

International Symposium on Microelectronics, 2011-01, Vol.2011 (1), p.657-664

Iwamoto, Nancy

2011

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Using molecular modeling to uncover the origins of subtle solvation-based film defects

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, p.1-1

2014

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Aspects of scaling to mesoscale models derived from the molecular scale for understanding epoxy interfaces

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.1774-1780

Iwamoto, N.

2012

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Advances in Delamination Modeling of Metal/Polymer Systems: Atomistic Aspects

Nanopackaging, 2018, p.129-183

2018

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Understanding leakage current susceptibility in dielectrics using molecular modeling

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009, p.1-1

2009

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Wettability of organic ferroelectric material on metal substrate

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2012, p.1/5-5/5

2012

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Understanding modulus trends in ultra low K dielectric materials through the use of molecular modeling

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.1318-1322

2002

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Molecular Modeling of Analyte Adsorption on MEMS GC Stationary Phases

EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006, p.1-9

2006

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Performance properties in thick film silicate dielectric layers using molecular modeling

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008, p.1-6

2008

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METAL ACETYLACETONATE CHELATES: THEIR SYNTHESIS, CHARACTERIZATION AND USE AS CROSSLINKING SITES IN ELASTOMERIC SYSTEMS (STYRENE-ISOPRENE, TELECHELATES, POLYDIMETHYLSILOXANE)

IWAMOTO, NANCY ELLEN

1983

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Using Molecular Modeling to Understand Cleaner Efficiency for Barc ("Bottom Anti-Reflective Coating") After Plasma Etch in Dual Damascene Structures

2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007, 2007, p.1-6

2007

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Molecularly derived mesoscale modeling of an epoxy/Cu interface: Interface roughness

Developing the stress–strain curve to failure using mesoscale models parameterized from molecular models

Modeling mechanical properties of an epoxy using particle dynamics, as parameterized through molecular modeling

Modeling mechanical properties of an epoxy using particle dynamics, as parameterized through molecular modeling : THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS (EUROSIME 2010)

Molecularly derived mesoscale modeling of an epoxy/Cu interface: Interface roughness : THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS

Water Effects in Polymers Through Molecular Dynamics

Multiscale perspectives of interface delamination in microelectronic packaging applications

Perspectives of water effects in polymers through molecular dynamics

Performance properties in thick film silicate dielectric layers using molecular modeling

Molecular Modeling for Reliability Issues

Molecularly derived mesoscale modeling of an epoxy/Cu interface (part III): Interface roughness

Developing the mesoscale stress-strain curve to failure

Mechanical properties of an epoxy modeled using particle dynamics, as parameterized through molecular modeling

Molecularly derived mesoscale modeling of an epoxy/Cu interface (Part IV): The effect of Filler

Studies of Mesoscale Models Parameterized by Molecular Models for Interface Failure in Epoxy Molding Compounds

Using molecular modeling to uncover the origins of subtle solvation-based film defects

Aspects of scaling to mesoscale models derived from the molecular scale for understanding epoxy interfaces

Advances in Delamination Modeling of Metal/Polymer Systems: Atomistic Aspects

Understanding leakage current susceptibility in dielectrics using molecular modeling

Wettability of organic ferroelectric material on metal substrate

Understanding modulus trends in ultra low K dielectric materials through the use of molecular modeling

Molecular Modeling of Analyte Adsorption on MEMS GC Stationary Phases

Performance properties in thick film silicate dielectric layers using molecular modeling

METAL ACETYLACETONATE CHELATES: THEIR SYNTHESIS, CHARACTERIZATION AND USE AS CROSSLINKING SITES IN ELASTOMERIC SYSTEMS (STYRENE-ISOPRENE, TELECHELATES, POLYDIMETHYLSILOXANE)

Using Molecular Modeling to Understand Cleaner Efficiency for Barc ("Bottom Anti-Reflective Coating") After Plasma Etch in Dual Damascene Structures

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