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Yield Improvement in Chip to Wafer Hybrid Bonding

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.1982-1986

2022

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Matar, Nabil: An Arab Ambassador in the Mediterranean World: The Travels of Muhammad ibn 'Uthmān al-Miknāsī, 1779-1788, Nueva York, Routledge, 2015

Rey desnudo, 2015-12, Vol.4 (7), p.219-227

Gómez Castro, Daniel

2015

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Relation d’agence dans l’exploitation de transport des taxis et taxis-bus dans la ville de Kinshasa

Akofena, 2021-08, Vol.1 (4), p.509-522

Ismaël Daniel N’ZAU N’ZAILU

2021

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A Novel Method of CoW Bonding for High Density Ultra-Fine Pitch IC Stacking Application

International Journal of Mechanical Engineering and Robotics Research, 2016

2016

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Development of Chip to Wafer Assembly with CuSnAg Microbump on Solder on Pad Interposer using Thermocompression and Solder Reflow

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 2023, p.94-99

2023

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Process Development of Via Formation by Laser Drilling on Insulating Resin

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 2022, p.401-404

2022

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Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1522-1529

2016

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Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.394-399

2014

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Stealth Dicing Challenges for MEMS Wafer Applications

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.358-363

2017

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Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 2023, p.425-429

2023

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Chip-to-Wafer Hybrid Bonding for high performance 2.5D applications

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 2022, p.19-23

2022

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Development of 4 die stack module using Hybrid bonding approach

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.788-794

2023

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Dielectric Stack Optimization for Die-level Warpage Reduction for Chip-to-Wafer Hybrid Bonding

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.62-68

2024

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Multi-Chip Stacked Memory Module Development using Chip to Wafer (C2W) Hybrid Bonding for Heterogeneous Integration Applications

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.2024-2030

2024

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Process Development of micro-bump flip chip bonding with Non-Conductive Film

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018, p.532-536

2018

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Laser Drilling of Thru Mold Vias (TMVs) for FOWLP Application

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018, p.940-943

2018

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Active Device Performance after Fan-out Wafer-level Packaging Process

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018, p.495-499

2018

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Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.615-622

2017

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Development of chip on wafer bonding with non conductive film using gang bonder

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017, p.1-5

2017

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Study of C2W Bonding Using Cu Pillar with Side-Wall Plated Solder

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.1572-1577

2017

Volltextzugriff (PDF)

Ultra-fine pitch Cu-Cu bonding of 6μm bump pitch for 2.5D application

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016, p.102-106

2016

Volltextzugriff (PDF)

High-Throughput Thermal Compression Bonding of 20 um Pitch Cu Pillar with Gas Pressure Bonder for 3D IC Stacking

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.108-114

2016

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Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.400-404

2014

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Through mold interconnects for fan-out wafer level package

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016, p.51-56

2016

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Intuitive and inexpensive method to evaluate flip chip bonding parameters of micro bump with wafer-level underfill material using glass substrate

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.219-223

2013

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Yield Improvement in Chip to Wafer Hybrid Bonding

Matar, Nabil: An Arab Ambassador in the Mediterranean World: The Travels of Muhammad ibn 'Uthmān al-Miknāsī, 1779-1788, Nueva York, Routledge, 2015

Relation d’agence dans l’exploitation de transport des taxis et taxis-bus dans la ville de Kinshasa

A Novel Method of CoW Bonding for High Density Ultra-Fine Pitch IC Stacking Application

Development of Chip to Wafer Assembly with CuSnAg Microbump on Solder on Pad Interposer using Thermocompression and Solder Reflow

Process Development of Via Formation by Laser Drilling on Insulating Resin

Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications

Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer

Stealth Dicing Challenges for MEMS Wafer Applications

Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding

Chip-to-Wafer Hybrid Bonding for high performance 2.5D applications

Development of 4 die stack module using Hybrid bonding approach

Dielectric Stack Optimization for Die-level Warpage Reduction for Chip-to-Wafer Hybrid Bonding

Multi-Chip Stacked Memory Module Development using Chip to Wafer (C2W) Hybrid Bonding for Heterogeneous Integration Applications

Process Development of micro-bump flip chip bonding with Non-Conductive Film

Laser Drilling of Thru Mold Vias (TMVs) for FOWLP Application

Active Device Performance after Fan-out Wafer-level Packaging Process

Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package

Development of chip on wafer bonding with non conductive film using gang bonder

Study of C2W Bonding Using Cu Pillar with Side-Wall Plated Solder

Ultra-fine pitch Cu-Cu bonding of 6μm bump pitch for 2.5D application

High-Throughput Thermal Compression Bonding of 20 um Pitch Cu Pillar with Gas Pressure Bonder for 3D IC Stacking

Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking

Through mold interconnects for fan-out wafer level package

Intuitive and inexpensive method to evaluate flip chip bonding parameters of micro bump with wafer-level underfill material using glass substrate

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