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Structural and magnetic properties of size-controlled Fe–Ni nanoparticles synthesized by diffusing Fe atoms into preformed Ni nanoparticles

Journal of nanoparticle research : an interdisciplinary forum for nanoscale science and technology, 2021-04, Vol.23 (4), Article 107

2021

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Nanoparticle/solder hybrid joints for next-generation power semiconductor modules

Materials & design, 2017-06, Vol.124, p.203-210

2017

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A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding

Journal of materials chemistry, 2012-01, Vol.22 (48), p.25198-25206

2012

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Enhanced pressure-free bonding using mixture of Cu and NiO nanoparticles

Journal of alloys and compounds, 2015-04, Vol.629, p.118-123

2015

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Effect of Particle Size on the Magnetic Properties of Ni Nanoparticles Synthesized with Trioctylphosphine as the Capping Agent

Nanomaterials (Basel, Switzerland), 2016-09, Vol.6 (9), p.172

2016

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Syntheses of Au–Cu-rich AuAg(AgCl)Cu alloy and Ag–Cu-rich AuAgCu@Cu core–shell and AuAgCu alloy nanoparticles using a polyol method

CrystEngComm, 2012-01, Vol.14 (10), p.3623

2012

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Synthesis of Au@Ag@Cu trimetallic nanocrystals using three-step reduction

CrystEngComm, 2013-01, Vol.15 (7), p.1345

2013

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Improving Powder Magnetic Core Properties via Application of Thin, Insulating Silica-Nanosheet Layers on Iron Powder Particles

Nanomaterials (Basel, Switzerland), 2017-01, Vol.7 (1), p.1-1

2017

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Effects of Au fraction on the morphology and stability of Au–Ag–Cu trimetallic particles prepared using a polyol method

CrystEngComm, 2013-01, Vol.15 (35), p.7062-7070

2013

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Pressureless Bonding by Use of Cu and Sn Mixed Nanoparticles

Journal of electronic materials, 2014-12, Vol.43 (12), p.4413-4420

2014

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Enhancement of pressure-free bonding with Cu particles by the addition of Cu–Ni alloy nanoparticles

Journal of materials chemistry. C, Materials for optical and electronic devices, 2014-01, Vol.2 (18), p.3542-3548

2014

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Thermal treatment to enhance saturation magnetization of superparamagnetic Ni nanoparticles while maintaining low coercive force

Journal of nanoparticle research : an interdisciplinary forum for nanoscale science and technology, 2018-05, Vol.20 (5), p.1-14, Article 116

2018

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Behavior of thin copper oxide on silver as an analogue for copper nanoparticles

Journal of alloys and compounds, 2017-01, Vol.691, p.524-529

2017

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Effect of bismuth–tin alloy particle diameter on bonding strength of copper nanoparticles/bismuth–tin solder hybrid joints

Journal of materials science. Materials in electronics, 2018-05, Vol.29 (9), p.7161-7176

2018

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Silver Adhesive Layer for Enhanced Pressure-Free Bonding Using Copper Nanoparticles

Journal of electronic materials, 2017-02, Vol.46 (2), p.1279-1286

2017

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Composition-controlled synthesis of solid-solution Fe–Ni nanoalloys and their application in screen-printed magnetic films

Journal of nanoparticle research : an interdisciplinary forum for nanoscale science and technology, 2019-03, Vol.21 (3), p.1-7, Article 60

2019

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High-Strength Pressure-Free Bonding Using Cu and Ni-Sn Nanoparticles

Particle & particle systems characterization, 2014-06, Vol.31 (6), p.699-705

2014

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X-ray photoelectron spectroscopic study of the formation of Cu/Ni interface mediated by oxide phase

Journal of alloys and compounds, 2014-01, Vol.582, p.403-407

2014

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Pressureless Bonding by Use of Cu and Sn Mixed Nanoparticles : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES

Journal of electronic materials, 2014, Vol.43 (12), p.4413-4420

2014

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Electrochemical CO2 reduction over nanoparticles derived from an oxidized Cu–Ni intermetallic alloy

Chemical communications (Cambridge, England), 2020-12, Vol.56 (95), p.15008-15011

2020

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Pressure-Free Bonding of Metallic Plates with Ni Affinity Layers Using Cu Nanoparticles

Journal of electronic materials, 2014-03, Vol.43 (3), p.774-779

2014

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Nanodisturbances in deformed Gum Metal

Acta materialia, 2006-05, Vol.54 (9), p.2489-2499

2006

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Electrochemical CO 2 reduction over nanoparticles derived from an oxidized Cu–Ni intermetallic alloy

Chemical communications (Cambridge, England), 2020-12, Vol.56 (95), p.15008-15011

2020

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Behavior of vacancies near edge dislocations in Ni and α − Fe : Positron annihilation experiments and rate theory calculations

Physical review. B, Condensed matter and materials physics, 2007-03, Vol.75 (9), Article 094109

2007

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A new one-pot method for the synthesis of Cu nanoparticles for low temperature bondingElectronic supplementary information (ESI) available: Sizes of Cu plates bonded by the Cu nanoparticle paste and experiments to study a shear strength of bonded Cu plates (Fig. S1). Photographs of ethylene glycol: (a) Cu sulfate, (b) Cu hydroxide and (c) Cu carbonate solutions, respectively (Fig. S2). See DOI: 10.1039/c2jm34954j

2012-11

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Structural and magnetic properties of size-controlled Fe–Ni nanoparticles synthesized by diffusing Fe atoms into preformed Ni nanoparticles

Nanoparticle/solder hybrid joints for next-generation power semiconductor modules

A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding

Enhanced pressure-free bonding using mixture of Cu and NiO nanoparticles

Effect of Particle Size on the Magnetic Properties of Ni Nanoparticles Synthesized with Trioctylphosphine as the Capping Agent

Syntheses of Au–Cu-rich AuAg(AgCl)Cu alloy and Ag–Cu-rich AuAgCu@Cu core–shell and AuAgCu alloy nanoparticles using a polyol method

Synthesis of Au@Ag@Cu trimetallic nanocrystals using three-step reduction

Improving Powder Magnetic Core Properties via Application of Thin, Insulating Silica-Nanosheet Layers on Iron Powder Particles

Effects of Au fraction on the morphology and stability of Au–Ag–Cu trimetallic particles prepared using a polyol method

Pressureless Bonding by Use of Cu and Sn Mixed Nanoparticles

Enhancement of pressure-free bonding with Cu particles by the addition of Cu–Ni alloy nanoparticles

Thermal treatment to enhance saturation magnetization of superparamagnetic Ni nanoparticles while maintaining low coercive force

Behavior of thin copper oxide on silver as an analogue for copper nanoparticles

Effect of bismuth–tin alloy particle diameter on bonding strength of copper nanoparticles/bismuth–tin solder hybrid joints

Silver Adhesive Layer for Enhanced Pressure-Free Bonding Using Copper Nanoparticles

Composition-controlled synthesis of solid-solution Fe–Ni nanoalloys and their application in screen-printed magnetic films

High-Strength Pressure-Free Bonding Using Cu and Ni-Sn Nanoparticles

X-ray photoelectron spectroscopic study of the formation of Cu/Ni interface mediated by oxide phase

Pressureless Bonding by Use of Cu and Sn Mixed Nanoparticles : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES

Electrochemical CO2 reduction over nanoparticles derived from an oxidized Cu–Ni intermetallic alloy

Pressure-Free Bonding of Metallic Plates with Ni Affinity Layers Using Cu Nanoparticles

Nanodisturbances in deformed Gum Metal

Electrochemical CO 2 reduction over nanoparticles derived from an oxidized Cu–Ni intermetallic alloy

Behavior of vacancies near edge dislocations in Ni and α − Fe : Positron annihilation experiments and rate theory calculations

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