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Etching Mechanism of Si-rich SiOx Film by Atomic Hydrogen Annealing

Journal of Photopolymer Science and Technology, 2024/06/25, Vol.37(4), pp.415-422

2024

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Influences of Exothermic Reactive Layer and Metal Interlayer on Fracture Behavior of Reactively Bonded Solder Joints

Journal of engineering materials and technology, 2015-07, Vol.137 (3)

2015

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Importance of Bonding Atmosphere for Mechanical Reliability of Reactively Bonded Solder Joints

Journal of engineering materials and technology, 2016-01, Vol.138 (1)

2016

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Cathodoluminescence Spectroscopic Stress Analysis for Silicon Oxide Film and Its Damage Evaluation

Materials, 2020-10, Vol.13 (20), p.4490

2020

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Influence of 700 °C vacuum annealing on fracture behavior of micro/nanoscale focused ion beam fabricated silicon structures

Japanese Journal of Applied Physics, 2016-06, Vol.55 (6S1), p.6-06GL03

2016

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Comparison of mechanical characteristics of focused ion beam fabricated silicon nanowires

Japanese Journal of Applied Physics, 2017-06, Vol.56 (6S1), p.6

2017

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Focused Ion Beam Induced Surface Damage Effect on the Mechanical Properties of Silicon Nanowires

Journal of engineering materials and technology, 2013-10, Vol.135 (4)

2013

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Thermal Annealing Effect on Elastic-Plastic Behavior of Al-Si-Cu Structural Films Under Uniaxial and Biaxial Tension

Journal of microelectromechanical systems, 2013-12, Vol.22 (6), p.1414-1427

2013

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Influences of film composition and annealing on the mechanical and electrical properties of W–Mo thin films

Journal of materials science, 2012-03, Vol.47 (6), p.2725-2730

2012

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Influence of gallium ion beam acceleration voltage on the bend angle of amorphous silicon cantilevers

Japanese Journal of Applied Physics, 2016-06, Vol.55 (6S1), p.6-06GL02

2016

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Influences of pretreatment and hard baking on the mechanical reliability of SU-8 microstructures

Journal of micromechanics and microengineering, 2013-10, Vol.23 (10), p.105016-10

2013

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Thermomechanical tensile characterization of Ti–Ni shape memory alloy films for design of MEMS actuator

Sensors and actuators. A. Physical., 2007-09, Vol.139 (1), p.178-186

2007

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Self-propagating explosive Al/Ni flakes fabricated by dual-source sputtering to mesh substrate

Japanese Journal of Applied Physics, 2014-06, Vol.53 (6S), p.6-1-06JM01-5

2014

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Nano-Scale Tensile Testing and Sample Preparation Techniques for Silicon Nanowires

Japanese Journal of Applied Physics, 2013-11, Vol.52 (11), p.110118-110118-9

2013

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Quasistatic and dynamic mechanical properties of Al–Si–Cu structural films in uniaxial tension

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2012-05, Vol.30 (3), p.031804-031804-9

2012

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Tension–Torsion Combined Loading Test Equipment for a Minute Beam Specimen

Journal of engineering materials and technology, 2013-01, Vol.135 (1)

2013

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Crack-Less Wafer-Level Packaging Using Flash Heating Technique for Micro Devices

Materials science forum, 2012-01, Vol.706-709, p.1979-1983

2012

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Design and Development of a Biaxial Tensile Test Device for a Thin Film Specimen

Journal of engineering materials and technology, 2012-01, Vol.134 (1)

2012

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Effect of Cu content on the shape memory behavior of Ti–Ni–Cu alloy thin films prepared by triple-source dc magnetron sputtering

Thin solid films, 2010-08, Vol.518 (21), p.S26-S28

2010

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Al/Ni Self-Propagating Exothermic Film for MEMS Application

Materials science forum, 2010-01, Vol.638-642, p.2142-2147

2010

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Effect of Zr content on mechanical properties of Ti–Ni–Zr shape memory alloy films prepared by dc magnetron sputtering

Vacuum, 2008-10, Vol.83 (3), p.664-667

2008

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X-ray Absorption Studies on the Growth Process of Radio-Frequency-Magnetron-Sputtered Boron Nitride Films: Effects of Bias Voltage and Substrate Temperature

Japanese Journal of Applied Physics, 2013-04, Vol.52 (4), p.045602-045602-5

2013

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Shape memory behavior of Fe–Pd alloy thin films prepared by dc magnetron sputtering

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2003-01, Vol.339 (1), p.29-34

2003

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Uniaxial tensile and shear deformation tests of gold–tin eutectic solder film

Science and technology of advanced materials, 2007-01, Vol.8 (3), p.146-152

2007

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Raman Spectrum Curve Fitting for Estimating Surface Stress Distribution in Single-Crystal Silicon Microstructure

Japanese Journal of Applied Physics, 2009-04, Vol.48 (4S), p.4

2009

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Etching Mechanism of Si-rich SiOx Film by Atomic Hydrogen Annealing

Influences of Exothermic Reactive Layer and Metal Interlayer on Fracture Behavior of Reactively Bonded Solder Joints

Importance of Bonding Atmosphere for Mechanical Reliability of Reactively Bonded Solder Joints

Cathodoluminescence Spectroscopic Stress Analysis for Silicon Oxide Film and Its Damage Evaluation

Influence of 700 °C vacuum annealing on fracture behavior of micro/nanoscale focused ion beam fabricated silicon structures

Comparison of mechanical characteristics of focused ion beam fabricated silicon nanowires

Focused Ion Beam Induced Surface Damage Effect on the Mechanical Properties of Silicon Nanowires

Thermal Annealing Effect on Elastic-Plastic Behavior of Al-Si-Cu Structural Films Under Uniaxial and Biaxial Tension

Influences of film composition and annealing on the mechanical and electrical properties of W–Mo thin films

Influence of gallium ion beam acceleration voltage on the bend angle of amorphous silicon cantilevers

Influences of pretreatment and hard baking on the mechanical reliability of SU-8 microstructures

Thermomechanical tensile characterization of Ti–Ni shape memory alloy films for design of MEMS actuator

Self-propagating explosive Al/Ni flakes fabricated by dual-source sputtering to mesh substrate

Nano-Scale Tensile Testing and Sample Preparation Techniques for Silicon Nanowires

Quasistatic and dynamic mechanical properties of Al–Si–Cu structural films in uniaxial tension

Tension–Torsion Combined Loading Test Equipment for a Minute Beam Specimen

Crack-Less Wafer-Level Packaging Using Flash Heating Technique for Micro Devices

Design and Development of a Biaxial Tensile Test Device for a Thin Film Specimen

Effect of Cu content on the shape memory behavior of Ti–Ni–Cu alloy thin films prepared by triple-source dc magnetron sputtering

Al/Ni Self-Propagating Exothermic Film for MEMS Application

Effect of Zr content on mechanical properties of Ti–Ni–Zr shape memory alloy films prepared by dc magnetron sputtering

X-ray Absorption Studies on the Growth Process of Radio-Frequency-Magnetron-Sputtered Boron Nitride Films: Effects of Bias Voltage and Substrate Temperature

Shape memory behavior of Fe–Pd alloy thin films prepared by dc magnetron sputtering

Uniaxial tensile and shear deformation tests of gold–tin eutectic solder film

Raman Spectrum Curve Fitting for Estimating Surface Stress Distribution in Single-Crystal Silicon Microstructure

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