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Broadband Millimeter-Wave Dielectric Properties of Liquid Crystal Polymer Materials

IEEE transactions on components, packaging, and manufacturing technology (2011), 2022-01, Vol.12 (1), p.192-194

2022

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Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards

IEEE transactions on electromagnetic compatibility, 2006-05, Vol.48 (2), p.319-330

2006

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Methods to Characterize Radiation Patterns of WR5 Band Integrated Antennas in a Flip-Chip Enhanced QFN Package

2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2022, p.1-3

2022

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Slot Bow-Tie Antenna Integration in Flip-Chip and Embedded Die Enhanced QFN Package for WR8 and WR5 Frequency Bands

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.371-376

2022

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Slot Bow-Tie Antenna Integration in an Enhanced Flip-Chip QFN Package for WR8 and WR5 Band Applications

2021 IEEE MTT-S International Microwave and RF Conference (IMARC), 2021, p.1-4

2021

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A Novel Approach to Measure and Characterize Radiation Patterns of Antenna-in-Package

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.498-503

2023

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Novel circuit model for three-dimensional geometries with multilayer dielectrics

IEEE transactions on microwave theory and techniques, 2006-04, Vol.54 (4), p.1331-1339

2006

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Asymmetric waveguides vertical couplers for polarization-independent coupling and polarization-mode splitting

Journal of lightwave technology, 2005-04, Vol.23 (4), p.1818-1827

2005

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Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives

Microelectronics and reliability, 2005-07, Vol.45 (7), p.1215-1221

2005

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Concise method for the design of arrayed waveguide gratings using silica-based sol-gel materials

Optical engineering, 2005-12, Vol.44 (12), p.128003

Ngo, Nam Quoc

2005

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Awareness of computer vision syndrome and related factors among information technology professionals

International journal of research in medical sciences, 2020-11, Vol.8 (12), p.4336

2020

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Under bump metallurgy study on copper/low-k dielectrics for fine pitch flip chip packaging

Journal of electronic materials, 2004-10, Vol.33 (10), p.1144-1155

2004

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Addressing packaging challenges

IEEE circuits and devices magazine, 2002-07, Vol.18 (4), p.40-49

2002

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Modeling of simultaneous switching noise in high speed systems

IEEE transactions on advanced packaging, 2001-05, Vol.24 (2), p.132-142

2001

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Wire bonding process impact on low-k dielectric material in damascene copper integrated circuits

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.873-880

2002

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Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs

IEEE transactions on advanced packaging, 2005-05, Vol.28 (2), p.298-309

2005

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A scaling technique for partial element equivalent circuit analysis using SPICE

IEEE microwave and wireless components letters, 2004-05, Vol.14 (5), p.216-218

2004

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Integrated Process-Aging Modeling Methodology for Flip Chip on Flex Interconnections With Nonconductive Adhesives

IEEE transactions on advanced packaging, 2008-11, Vol.31 (4), p.882-889

2008

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Thermal design of heat spreader and analysis of thermal interface materials (TIM) for multi-chip package

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.1119-1123

2002

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Flipchip bump integrity with copper/ultra low-k dielectrics for fine pitch flipchip packaging

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1636-1641 Vol.2

2004

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Design and development of optoelectronic mixed signal system-on-package (SOP)

IEEE transactions on advanced packaging, 2004-05, Vol.27 (2), p.278-285

2004

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Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package: System-On-Package (SOP)

IEEE transactions on advanced packaging, 2004-05, Vol.27 (2), p.413-425

2004

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Coupling of simultaneous switching noise to interconnecting lines in high-speed systems

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.568-574 Vol.1

2004

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Board Level Reliability Enhancement for A Double-bump Wafer Level Chip Scale Package

Journal of microelectronics and electronic packaging, 2004-04, Vol.1 (2), p.64-71

2004

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Application of no-flow underfill for a reliable high performance Flip Chip Flex BGA

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.425-431

2002

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Broadband Millimeter-Wave Dielectric Properties of Liquid Crystal Polymer Materials

Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards

Methods to Characterize Radiation Patterns of WR5 Band Integrated Antennas in a Flip-Chip Enhanced QFN Package

Slot Bow-Tie Antenna Integration in Flip-Chip and Embedded Die Enhanced QFN Package for WR8 and WR5 Frequency Bands

Slot Bow-Tie Antenna Integration in an Enhanced Flip-Chip QFN Package for WR8 and WR5 Band Applications

A Novel Approach to Measure and Characterize Radiation Patterns of Antenna-in-Package

Novel circuit model for three-dimensional geometries with multilayer dielectrics

Asymmetric waveguides vertical couplers for polarization-independent coupling and polarization-mode splitting

Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives

Concise method for the design of arrayed waveguide gratings using silica-based sol-gel materials

Awareness of computer vision syndrome and related factors among information technology professionals

Under bump metallurgy study on copper/low-k dielectrics for fine pitch flip chip packaging

Addressing packaging challenges

Modeling of simultaneous switching noise in high speed systems

Wire bonding process impact on low-k dielectric material in damascene copper integrated circuits

Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs

A scaling technique for partial element equivalent circuit analysis using SPICE

Integrated Process-Aging Modeling Methodology for Flip Chip on Flex Interconnections With Nonconductive Adhesives

Thermal design of heat spreader and analysis of thermal interface materials (TIM) for multi-chip package

Flipchip bump integrity with copper/ultra low-k dielectrics for fine pitch flipchip packaging

Design and development of optoelectronic mixed signal system-on-package (SOP)

Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package: System-On-Package (SOP)

Coupling of simultaneous switching noise to interconnecting lines in high-speed systems

Board Level Reliability Enhancement for A Double-bump Wafer Level Chip Scale Package

Application of no-flow underfill for a reliable high performance Flip Chip Flex BGA

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