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Effect of Multi-walled Carbon Nanotube and Polyethylene Glycol Addition in Nanofluid Quench Medium for Steel Heat Treatment Application

International Journal of Technology, 2024-02, Vol.15 (2), p.364

2024

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Heteroepitaxial growth of In0.30Ga0.70As high-electron mobility transistor on 200 mm silicon substrate using metamorphic graded buffer

AIP advances, 2016-08, Vol.6 (8), p.085106-085106-6

2016

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Closed‐Loop Multi‐Objective Optimization for Cu–Sb–S Photo‐Electrocatalytic Materials’ Discovery

Advanced materials (Weinheim), 2024-01, Vol.36 (2), p.e2304269-n/a

2024

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Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics

Microelectronics and reliability, 2013-09, Vol.53 (9-11), p.1581-1586

2013

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Impact of deposition conditions on the crystallization kinetics of amorphous GeTe films

Journal of materials science, 2016-02, Vol.51 (4), p.1864-1872

2016

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MOCVD growth of GaN on SEMI-spec 200 mm Si

Semiconductor science and technology, 2017-04, Vol.32 (6), p.65001

2017

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Preventing phase separation in MOCVD-grown InAlAs compositionally graded buffer on silicon substrate using InGaAs interlayers

Journal of crystal growth, 2017-11, Vol.478, p.64-70

2017

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Control wafer bow of InGaP on 200 mm Si by strain engineering

Semiconductor science and technology, 2017-11, Vol.32 (12), p.125013

2017

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Machine learning-assisted optimization of multi-metal hydroxide electrocatalysts for overall water splitting

Materials horizons, 2023-10, Vol.1 (11), p.522-531

2023

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Towards a greener electrosynthesis: pairing machine learning and 3D printing for rapid optimisation of anodic trifluoromethylation

RSC sustainability, 2024-02, Vol.2 (2), p.536-545

2024

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Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

Acta materialia, 2012, Vol.60 (2), p.578-587

2012

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MOCVD Growth of High Quality InGaAs HEMT Layers on Large Scale Si Wafers for Heterogeneous Integration With Si CMOS

IEEE transactions on semiconductor manufacturing, 2017-11, Vol.30 (4), p.456-461

2017

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Modeling of Electromigration Induced Contact Resistance Reduction of Cu–Cu Bonded Interface

Journal of the Electrochemical Society, 2011, Vol.158 (4), p.H405

2011

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Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications

Journal of electronic materials, 2009-02, Vol.38 (2), p.365-371

2009

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Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates

Journal of electronic materials, 2013-08, Vol.42 (8), p.2667-2676

2013

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Improved mechanical and thermomechanical properties of alumina substrate via iron doping

Scripta materialia, 2013-06, Vol.68 (11), p.869-872

2013

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Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits

Microelectronic engineering, 2013-06, Vol.106, p.149-154

2013

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An object-oriented framework to enable workflow evolution across materials acceleration platforms

Matter, 2022-10, Vol.5 (10), p.3124-3134

2022

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Direct MOCVD epitaxy of GaAsP on SiGe virtual substrate without growth of SiGe

Journal of crystal growth, 2016-05, Vol.441, p.78-83

2016

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Direct bandgap photoluminescence from n-type indirect GaInP alloys

Photonics research (Washington, DC), 2017-06, Vol.5 (3), p.239-244

2017

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Germanium-on-insulator virtual substrate for InGaP epitaxy

Materials science in semiconductor processing, 2017-02, Vol.58, p.15-21

2017

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Germanium-on-insulator virtual substrate for InGaP epitaxy

Materials science in semiconductor processing, 2017-11, Vol.70, p.17-23

2017

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Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.27-30

2014

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Heteroepitaxial growth of In{sub 0.30}Ga{sub 0.70}As high-electron mobility transistor on 200 mm silicon substrate using metamorphic graded buffer

AIP advances, 2016-08, Vol.6 (8)

2016

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Modeling of Electromigration Induced Contact Resistance Reduction of Cu-Cu Bonded Interface

ECS transactions, 2010, Vol.33 (12), p.23-34

2010

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Effect of Multi-walled Carbon Nanotube and Polyethylene Glycol Addition in Nanofluid Quench Medium for Steel Heat Treatment Application

Heteroepitaxial growth of In0.30Ga0.70As high-electron mobility transistor on 200 mm silicon substrate using metamorphic graded buffer

Closed‐Loop Multi‐Objective Optimization for Cu–Sb–S Photo‐Electrocatalytic Materials’ Discovery

Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics

Impact of deposition conditions on the crystallization kinetics of amorphous GeTe films

MOCVD growth of GaN on SEMI-spec 200 mm Si

Preventing phase separation in MOCVD-grown InAlAs compositionally graded buffer on silicon substrate using InGaAs interlayers

Control wafer bow of InGaP on 200 mm Si by strain engineering

Machine learning-assisted optimization of multi-metal hydroxide electrocatalysts for overall water splitting

Towards a greener electrosynthesis: pairing machine learning and 3D printing for rapid optimisation of anodic trifluoromethylation

Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

MOCVD Growth of High Quality InGaAs HEMT Layers on Large Scale Si Wafers for Heterogeneous Integration With Si CMOS

Modeling of Electromigration Induced Contact Resistance Reduction of Cu–Cu Bonded Interface

Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications

Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates

Improved mechanical and thermomechanical properties of alumina substrate via iron doping

Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits

An object-oriented framework to enable workflow evolution across materials acceleration platforms

Direct MOCVD epitaxy of GaAsP on SiGe virtual substrate without growth of SiGe

Direct bandgap photoluminescence from n-type indirect GaInP alloys

Germanium-on-insulator virtual substrate for InGaP epitaxy

Germanium-on-insulator virtual substrate for InGaP epitaxy

Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate

Heteroepitaxial growth of In{sub 0.30}Ga{sub 0.70}As high-electron mobility transistor on 200 mm silicon substrate using metamorphic graded buffer

Modeling of Electromigration Induced Contact Resistance Reduction of Cu-Cu Bonded Interface

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