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Effect of Benzotriazole on Oxidation Behavior in Pure Copper

Materials transactions, 2024-03, Vol.65 (3), p.318-322, Article MT-D2023011

2024

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Grain growth in ultrafine grain sized copper during cyclic deformation

Journal of alloys and compounds, 2014-12, Vol.615, p.S587-S589

2014

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Physical background of significant increase in mechanical properties and fatigue strength of groove-rolled Cu-Ni-Si alloy with discontinuous precipitates

Journal of alloys and compounds, 2023-06, Vol.947, p.169569, Article 169569

2023

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Fatigue-induced damage and crack growth of Cu processed by ECAP

Modern physics letters. B, Condensed matter physics, statistical physics, applied physics, 2015-03, Vol.29 (6n07), p.1540028

2015

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Effect of Sintering Temperature on Electrical Characteristics of Screen-Printed Ag Nanopaste on FR4 Substrate

Journal of nanoscience and nanotechnology, 2011-07, Vol.11 (7), p.5915-5920

2011

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Strengthening Effect of Decreased Dislocation Density After Annealing in Pure Aluminum or Copper

Metals and Materials International, 2024, 30(3), , pp.607-617

2024

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Optimization of conductivity and strength in Cu-Ni-Si alloys by suppressing discontinuous precipitation

Metals and Materials International, 2016, 22(6), , pp.1049-1054

2016

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Increasing toughness by promoting discontinuous precipitation in Cu-Ni-Si alloys

Philosophical magazine letters, 2016-05, Vol.96 (5), p.196-203

2016

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Discontinuous precipitation at the deformation band in copper alloy

Metals and materials international, 2018-01, Vol.24 (1), p.23-27

2018

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All-Wet Metallization of Chemically Modified Polydimethylsiloxane with Self-Assembled Monolayers

Journal of nanoscience and nanotechnology, 2016-11, Vol.16 (11), p.11256-11261

2016

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Electrochemical Migration Characteristics of Screen-Printed Silver Patterns on FR-4 Substrate

Journal of nanoscience and nanotechnology, 2012-04, Vol.12 (4), p.3219-3223

2012

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Evaluation of the Flexibility of Silver Circuits Screen-Printed on Polyimide with an Environmental Reliability Test

Journal of nanoscience and nanotechnology, 2011-07, Vol.11 (7), p.5806-5811

2011

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Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test

Journal of materials science. Materials in electronics, 2012-08, Vol.23 (8), p.1515-1520

2012

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Relationship between shear plane of the final pressing and fatigue crack growth behaviour of round-bar specimens of CU processed by ECAP

International journal of computational methods and experimental measurements, 2017-11, Vol.6 (4), p.691-702

2017

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Enhancing bonding strength between Cu and Cu2O through crystallographic orientation variation

Journal of alloys and compounds, 2024-10, Vol.1003, p.175672, Article 175672

2024

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Microstructural characterization of cold-drawn Cu–Ni–Si alloy having high strength and high conductivity

Journal of alloys and compounds, 2020-08, Vol.832, p.155059, Article 155059

2020

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Effect of inclusion on strength and conductivity of Cu-Ni-Si alloys with discontinuous precipitation

Journal of alloys and compounds, 2020-11, Vol.843, p.156006, Article 156006

2020

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Co and Ti effect on hot workability of phosphor bronze

Journal of alloys and compounds, 2022-05, Vol.903, p.163778, Article 163778

2022

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Enhanced strength of Cu-Ni-Si alloy via heterogeneous nucleation at grain boundaries during homogenization

Materials characterization, 2024-09, Vol.215, p.114198, Article 114198

2024

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Enhancement of strength and electrical conductivity for hypo-eutectic Cu-12Ag alloy

Journal of alloys and compounds, 2023-01, Vol.931, p.167506, Article 167506

2023

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Properties of nanocrystalline CuAg foil prepared via electrodeposition

Journal of alloys and compounds, 2021-11, Vol.881, p.160522, Article 160522

2021

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Effect of grain substructure refinement on tensile mechanical behavior of L21-strengthened Al-Cr-Fe-Ni-Ti-Mo high-entropy alloy

Scripta materialia, 2022-10, Vol.219, p.114889, Article 114889

2022

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Simple optimization for strength and conductivity of Cu-Ni-Si alloy with discontinuous precipitation

Materials characterization, 2022-02, Vol.184, p.111605, Article 111605

2022

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The effect of bimodal structure with nanofibers and normal precipitates on the mechanical and electrical properties of Cu Ni Si alloy

Materials characterization, 2020-12, Vol.170, p.110642, Article 110642

2020

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Antibacterial effect of surface-modified Zr50Cu50 metallic glass

Journal of alloys and compounds, 2022-11, Vol.920, p.166025, Article 166025

2022

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Effect of Benzotriazole on Oxidation Behavior in Pure Copper

Grain growth in ultrafine grain sized copper during cyclic deformation

Physical background of significant increase in mechanical properties and fatigue strength of groove-rolled Cu-Ni-Si alloy with discontinuous precipitates

Fatigue-induced damage and crack growth of Cu processed by ECAP

Effect of Sintering Temperature on Electrical Characteristics of Screen-Printed Ag Nanopaste on FR4 Substrate

Strengthening Effect of Decreased Dislocation Density After Annealing in Pure Aluminum or Copper

Optimization of conductivity and strength in Cu-Ni-Si alloys by suppressing discontinuous precipitation

Increasing toughness by promoting discontinuous precipitation in Cu-Ni-Si alloys

Discontinuous precipitation at the deformation band in copper alloy

All-Wet Metallization of Chemically Modified Polydimethylsiloxane with Self-Assembled Monolayers

Electrochemical Migration Characteristics of Screen-Printed Silver Patterns on FR-4 Substrate

Evaluation of the Flexibility of Silver Circuits Screen-Printed on Polyimide with an Environmental Reliability Test

Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test

Relationship between shear plane of the final pressing and fatigue crack growth behaviour of round-bar specimens of CU processed by ECAP

Enhancing bonding strength between Cu and Cu2O through crystallographic orientation variation

Microstructural characterization of cold-drawn Cu–Ni–Si alloy having high strength and high conductivity

Effect of inclusion on strength and conductivity of Cu-Ni-Si alloys with discontinuous precipitation

Co and Ti effect on hot workability of phosphor bronze

Enhanced strength of Cu-Ni-Si alloy via heterogeneous nucleation at grain boundaries during homogenization

Enhancement of strength and electrical conductivity for hypo-eutectic Cu-12Ag alloy

Properties of nanocrystalline CuAg foil prepared via electrodeposition

Effect of grain substructure refinement on tensile mechanical behavior of L21-strengthened Al-Cr-Fe-Ni-Ti-Mo high-entropy alloy

Simple optimization for strength and conductivity of Cu-Ni-Si alloy with discontinuous precipitation

The effect of bimodal structure with nanofibers and normal precipitates on the mechanical and electrical properties of Cu Ni Si alloy

Antibacterial effect of surface-modified Zr50Cu50 metallic glass

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