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IEEE transactions on biomedical circuits and systems, 2019-12, Vol.13 (6), p.1362-1371
2019
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Journal of physics. D, Applied physics, 2022-01, Vol.55 (1), p.14001
2022
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IEEE transactions on electron devices, 2017-05, Vol.64 (5), p.2072-2079
2017
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-04, Vol.8 (4), p.562-569
2018
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IEEE solid-state circuits letters, 2021, Vol.4, p.133-136
2021
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-04, Vol.8 (4), p.546-553
2018
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Electronics (Basel), 2018-10, Vol.7 (10), p.254
2018
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2021 IEEE International Symposium on Circuits and Systems (ISCAS), 2021, p.1-5
2021
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IEEE transactions on electromagnetic compatibility, 2016-10, Vol.58 (5), p.1629-1641
2016
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International journal of antennas and propagation, 2015-01, Vol.2015, p.1-11
2015
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2023 International Conference on Advanced Technologies for Communications (ATC), 2023, p.61-66
2023
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International journal of circuit theory and applications, 2024-04
2024
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2019 26th IEEE International Conference on Electronics, Circuits and Systems (ICECS), 2019, p.887-890
2019
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2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2016, p.107-109
2016
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2021 IEEE Custom Integrated Circuits Conference (CICC), 2021, p.1-2
2021
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2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2018, p.1-3
2018
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2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2016, p.123-125
2016
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2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015, p.209-212
2015
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2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2017, p.244-246
2017
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2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2017, p.148-150
2017
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2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2015, p.92-96
2015
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2016 URSI Asia-Pacific Radio Science Conference (URSI AP-RASC), 2016, p.915-918
2016
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2019 International Conference on Electronics, Information, and Communication (ICEIC), 2019, p.1-4
2019
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), 2019, p.266-269
2019
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2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2018, p.1-3
2018
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