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Relative Contributions of Packaging Elements to the Thermal Hysteresis of a MEMS Pressure Sensor

Sensors (Basel, Switzerland), 2020-03, Vol.20 (6), p.1727

2020

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Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate

Thin solid films, 2012-07, Vol.520 (19), p.6095-6099

2012

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Oxidation protection of copper surfaces using self-assembled monolayers of octadecanethiol

Applied surface science, 2005-10, Vol.252 (2), p.400-411

2005

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Damp‐heat induced degradation in photovoltaic modules manufactured with passivated emitter and rear contact solar cells

Progress in photovoltaics, 2022-09, Vol.30 (9), p.1061-1071

2022

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The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives

ACS applied materials & interfaces, 2024-01, Vol.16 (1), p.1846-1860

2024

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Three dimensional printed electronic devices realised by selective laser melting of copper/high-density-polyethylene powder mixtures

Journal of materials processing technology, 2018-04, Vol.254, p.310-324

2018

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Characterization of metal‐polymer interaction forces by AFM for insert molding applications

Polymer engineering and science, 2020-12, Vol.60 (12), p.3036-3045

2020

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Ultrasound assisted dispersal of a copper nanopowder for electroless copper activation

Ultrasonics sonochemistry, 2016-03, Vol.29, p.428-438

2016

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Laser sintering and patterning of gallium-doped zinc oxide/indium-tin oxide nanoparticle films with tailorable electrical and optical properties

Materials & design, 2020-09, Vol.194, p.108865, Article 108865

2020

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Structure and Mechanism of Photooxidation of Self-assembled Monolayers of Alkylthiols on Silver Studied by XPS and Static SIMS

The journal of physical chemistry. B, 1998-01, Vol.102 (1), p.174-184

1998

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The Evolution of Pd∕Sn Catalytic Surfaces in Electroless Copper Deposition

Journal of the Electrochemical Society, 2011, Vol.158 (3), p.D172

2011

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Fabrication of Polymer Waveguides by Laser Ablation Using a 355 nm Wavelength Nd:YAG Laser

Journal of lightwave technology, 2011-12, Vol.29 (23), p.3566-3576

2011

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CO2 laser micromachining of optical waveguides for interconnection on circuit boards

Optics and lasers in engineering, 2012-12, Vol.50 (12), p.1752-1756

2012

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Influence of Adsorbate Ordering on Rates of UV Photooxidation of Self-Assembled Monolayers

Journal of physical chemistry (1952), 1996-04, Vol.100 (16), p.6657-6662

1996

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Packaging of Microfluidic Devices for Fluid Interconnection Using Thermoplastics

Journal of microelectromechanical systems, 2009-04, Vol.18 (2), p.354-362

2009

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A novel flip-chip interconnection process for integrated circuits

Circuit world, 2012-01, Vol.38 (4), p.214-218

2012

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Functionalization of Hydroxyl and Carboxylic Acid Terminated Self-Assembled Monolayers

Langmuir, 1997-05, Vol.13 (10), p.2740-2748

1997

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Integrated in-plane mirror and multimode waveguide fabrication using 248 nm excimer laser ablation for optical interconnects on PCBs

Circuit world, 2012-01, Vol.38 (2), p.59-63

2012

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Investigation of the Adhesion of Electroless Copper to Glass Substrates

MRS proceedings, 2008, Vol.1113 (1), Article 1113-F03-16

2008

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Challenges in the manufacture of glass substrates for electrical and optical interconnect

Circuit world, 2007-01, Vol.33 (1), p.22-30

2007

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Integrated optical and electronic interconnect printed circuit board manufacturing

Circuit world, 2008-05, Vol.34 (2), p.21-26

2008

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Desorption of Butanethiol from Au(111) during Storage in Ultrahigh Vacuum: Effects on Surface Coverage and Stability toward Displacement by Solution-Phase Thiols

Langmuir, 1997-05, Vol.13 (11), p.3055-3058

1997

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Thermal and thermo-mechanical modelling of polymer overmoulded electronics

Microelectronics international, 2007-01, Vol.24 (3), p.66-75

2007

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Surface coatings for fluxless soldering of copper

Circuit world, 2003-03, Vol.29 (1), p.19-23

2003

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Relative Contributions of Packaging Elements to the Thermal Hysteresis of a MEMS Pressure Sensor

Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate

Oxidation protection of copper surfaces using self-assembled monolayers of octadecanethiol

Damp‐heat induced degradation in photovoltaic modules manufactured with passivated emitter and rear contact solar cells

The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives

Three dimensional printed electronic devices realised by selective laser melting of copper/high-density-polyethylene powder mixtures

Characterization of metal‐polymer interaction forces by AFM for insert molding applications

Ultrasound assisted dispersal of a copper nanopowder for electroless copper activation

Laser sintering and patterning of gallium-doped zinc oxide/indium-tin oxide nanoparticle films with tailorable electrical and optical properties

Structure and Mechanism of Photooxidation of Self-assembled Monolayers of Alkylthiols on Silver Studied by XPS and Static SIMS

The Evolution of Pd∕Sn Catalytic Surfaces in Electroless Copper Deposition

Fabrication of Polymer Waveguides by Laser Ablation Using a 355 nm Wavelength Nd:YAG Laser

CO2 laser micromachining of optical waveguides for interconnection on circuit boards

Influence of Adsorbate Ordering on Rates of UV Photooxidation of Self-Assembled Monolayers

Packaging of Microfluidic Devices for Fluid Interconnection Using Thermoplastics

A novel flip-chip interconnection process for integrated circuits

Functionalization of Hydroxyl and Carboxylic Acid Terminated Self-Assembled Monolayers

Integrated in-plane mirror and multimode waveguide fabrication using 248 nm excimer laser ablation for optical interconnects on PCBs

Investigation of the Adhesion of Electroless Copper to Glass Substrates

Integrated optical and electronic interconnect PCB manufacturing research

Challenges in the manufacture of glass substrates for electrical and optical interconnect

Integrated optical and electronic interconnect printed circuit board manufacturing

Desorption of Butanethiol from Au(111) during Storage in Ultrahigh Vacuum: Effects on Surface Coverage and Stability toward Displacement by Solution-Phase Thiols

Thermal and thermo-mechanical modelling of polymer overmoulded electronics

Surface coatings for fluxless soldering of copper

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