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Acta materialia, 2006-06, Vol.54 (11), p.2907-2922
2006
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Journal of microelectromechanical systems, 2009-04, Vol.18 (2), p.354-362
2009
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IEEE transactions on components and packaging technologies, 2006-09, Vol.29 (3), p.512-521
2006
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Ceramics international, 2016-12, Vol.42 (16), p.18296-18302
2016
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Applied materials today, 2020-12, Vol.21, p.100835, Article 100835
2020
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IEEE transactions on components and packaging technologies, 2008-09, Vol.31 (3), p.574-585
2008
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IEEE transactions on components and packaging technologies, 2002-03, Vol.25 (1), p.98-105
2002
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IEEE transactions on components and packaging technologies, 2002-03, Vol.25 (1), p.87-97
2002
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Acta materialia, 2007, Vol.55 (2), p.737-752
2007
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IEEE transactions on components and packaging technologies, 2006-12, Vol.29 (4), p.869-876
2006
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Acta materialia, 2008-11, Vol.56 (19), p.5668-5676
2008
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Soldering & surface mount technology, 1999-04, Vol.11 (1), p.8-12
1999
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 2019, p.111-115
2019
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2007 9th Electronics Packaging Technology Conference, 2007, p.43-46
2007
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52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.138-145
2002
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Surface science, 1997-02, Vol.372 (1), p.117-131
1997
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Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146), 2000, p.191-199
2000
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Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms, 1995-05, Vol.97 (1-4), p.329-332
1995
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Soldering & surface mount technology, 1999-04, Vol.11 (1), p.8-12
1999
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Thin solid films, 1995-01, Vol.255 (1), p.128-131
1995
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2008 2nd Electronics System-Integration Technology Conference, 2008, p.1267-1272
2008
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1992
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Surface science, 1994-04, Vol.307, p.101-106
1994
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Surface science, 1993-05, Vol.287, p.1000-1003
1993
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Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms, 1995-05, Vol.97 (1-4), p.326-328
1995
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- Ieee Transactions On Components And Packaging Technologies
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