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A Detailed Failure Analysis Examination of the Effect of Thermal Cycling on Cu TSV Reliability

IEEE transactions on electron devices, 2014-01, Vol.61 (1), p.15-22

2014

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Synchrotron-based measurement of the impact of thermal cycling on the evolution of stresses in Cu through-silicon vias

Journal of applied physics, 2014-06, Vol.115 (24)

2014

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Nondestructive Measurement of the Residual Stresses in Copper Through-Silicon Vias Using Synchrotron-Based Microbeam X-Ray Diffraction

IEEE transactions on electron devices, 2014-07, Vol.61 (7), p.2473-2479

2014

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Accelerated Stress Test Assessment of Through-Silicon Via Using RF Signals

IEEE transactions on electron devices, 2013-06, Vol.60 (6), p.2015-2021

2013

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Challenges in thin wafer handling and processing

ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference, 2013, p.62-65

2013

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On the technology and ecosystem of 3D / TSV manufacturing

2011 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, 2011, p.1-6

2011

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Metrology needs for through-silicon via fabrication

Journal of micro/nanolithography, MEMS, and MOEMS, 2014-01, Vol.13 (1), p.11206

2014

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TSV reveal etch for 3D integration

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International, 2012, p.1-4

2012

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Backside TSV protrusion induced by thermal shock and thermal cycling

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.1407-1413

2013

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Direct Cu plating of high aspect ratio through silicon vias (TSVs) with Ru seed on 300 mm wafer

IEEE International Interconnect Technology Conference, 2014, p.143-146

2014

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X-ray micro-beam diffraction measurement of the effect of thermal cycling on stress in Cu TSV: A comparative study

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.1648-1651

2014

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Use of RF-based technique as a metrology tool for TSV reliability analysis

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.186-191

2013

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X-ray micro-beam diffraction determination of full stress tensors in Cu TSVs

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.648-652

2013

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Thermo-mechanical simulations of a copper-to-copper direct bonded 3D TSV chip package interaction test vehicle

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.2228-2234

2013

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Temperature-dependent thermal stress determination for through-silicon-vias (TSVs) by combining bending beam technique with finite element analysis

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.1475-1480

2011

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SHORT LOOP ELECTRICAL AND RELIABILITY LEARNING FOR THROUGH SILICON VIA (TSV)MID-WAFER FRONT-SIDE PROCESSES

International Symposium on Microelectronics, 2014-10, Vol.2014 (1), p.794-803

2014

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Cost Analysis of TSV Process and Scaling Options

International Symposium on Microelectronics, 2014-10, Vol.2014 (1), p.1-7

2014

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Metrology Needs for 2.5D/3D Interconnects

Handbook of 3D Integration, 2014, p.393-430

2014

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Understanding and Controlling Cu Protrusions in 3D TSV Processing

International Symposium on Microelectronics, 2012-01, Vol.2012 (1), p.23-30

2012

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Development of visual extension material for a striga control programme in Northern Ghana through action research

European journal of agricultural education and extension, 1997-06, Vol.4 (1), p.1-15

1997

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Probeless voltage contrast using a focused ion beam for opens and shorts defect isolation of ultralarge scale integration technologies

Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 1997-07, Vol.15 (4), p.916-920

1997

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Pirfenidone in patients with progressive fibrotic interstitial lung diseases other than idiopathic pulmonary fibrosis (RELIEF): a double-blind, randomised, placebo-controlled, phase 2b trial

The lancet respiratory medicine, 2021-05, Vol.9 (5), p.476-486

2021

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Prognosis and longitudinal changes of physical activity in idiopathic pulmonary fibrosis

BMC pulmonary medicine, 2017-07, Vol.17 (1), p.104-104, Article 104

2017

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Clinical Correlates of Reduced Physical Activity in Idiopathic Pulmonary Fibrosis

Respiration, 2016-01, Vol.91 (6), p.497-502

2016

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A loop region of BAFF controls B cell survival and regulates recognition by different inhibitors

Nature communications, 2018-03, Vol.9 (1), p.1199-15, Article 1199

2018

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A Detailed Failure Analysis Examination of the Effect of Thermal Cycling on Cu TSV Reliability

Synchrotron-based measurement of the impact of thermal cycling on the evolution of stresses in Cu through-silicon vias

Nondestructive Measurement of the Residual Stresses in Copper Through-Silicon Vias Using Synchrotron-Based Microbeam X-Ray Diffraction

Accelerated Stress Test Assessment of Through-Silicon Via Using RF Signals

Challenges in thin wafer handling and processing

On the technology and ecosystem of 3D / TSV manufacturing

Metrology needs for through-silicon via fabrication

TSV reveal etch for 3D integration

Backside TSV protrusion induced by thermal shock and thermal cycling

Direct Cu plating of high aspect ratio through silicon vias (TSVs) with Ru seed on 300 mm wafer

X-ray micro-beam diffraction measurement of the effect of thermal cycling on stress in Cu TSV: A comparative study

Use of RF-based technique as a metrology tool for TSV reliability analysis

X-ray micro-beam diffraction determination of full stress tensors in Cu TSVs

Thermo-mechanical simulations of a copper-to-copper direct bonded 3D TSV chip package interaction test vehicle

Temperature-dependent thermal stress determination for through-silicon-vias (TSVs) by combining bending beam technique with finite element analysis

SHORT LOOP ELECTRICAL AND RELIABILITY LEARNING FOR THROUGH SILICON VIA (TSV)MID-WAFER FRONT-SIDE PROCESSES

Cost Analysis of TSV Process and Scaling Options

Metrology Needs for 2.5D/3D Interconnects

Understanding and Controlling Cu Protrusions in 3D TSV Processing

Development of visual extension material for a striga control programme in Northern Ghana through action research

Probeless voltage contrast using a focused ion beam for opens and shorts defect isolation of ultralarge scale integration technologies

Pirfenidone in patients with progressive fibrotic interstitial lung diseases other than idiopathic pulmonary fibrosis (RELIEF): a double-blind, randomised, placebo-controlled, phase 2b trial

Prognosis and longitudinal changes of physical activity in idiopathic pulmonary fibrosis

Clinical Correlates of Reduced Physical Activity in Idiopathic Pulmonary Fibrosis

A loop region of BAFF controls B cell survival and regulates recognition by different inhibitors

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