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Nanotribological Properties of Graphite Intercalation Compounds: AFM Studies

Scanning, 2017-01, Vol.2017 (2017), p.1-11

2017

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A Review of Advanced Thermal Management Solutions and the Implications for Integration in High-Voltage Packages

IEEE journal of emerging and selected topics in power electronics, 2020-03, Vol.8 (1), p.256-271

2020

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Insulation and Switching Performance Optimization for Partial-Discharge-Free Laminated Busbar in More-Electric Aircraft Applications

IEEE transactions on power electronics, 2022-06, Vol.37 (6), p.6831-6843

2022

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Photoinduced Formation of Electrically Conductive Thin Palladium Nanowires on DNA Scaffolds

Langmuir, 2009-09, Vol.25 (17), p.10146-10152

2009

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Tribochemistry as an Alternative Synthesis Pathway

Lubricants, 2020-09, Vol.8 (9), p.87

2020

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Synthesis of nano-size paraffin/silica-based encapsulated phase change materials of high encapsulation ratio via sol–gel method

Journal of materials science, 2023-05, Vol.58 (18), p.7673-7689

2023

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Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance

IEEE journal of emerging and selected topics in power electronics, 2021-08, Vol.9 (4), p.3904-3915

2021

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Effect of Stress Interaction on Multi-Stress Accelerated Life Test Plan: Assessment Based on Particle Swarm Optimization

Sustainability, 2023-02, Vol.15 (4), p.3451

2023

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A Partial Discharge Inception Voltage Modeling Approach

IEEE open journal of power electronics, 2023-01, Vol.4, p.1-13

2023

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PowerSynth-Guided Reliability Optimization of Multi-Chip Power Module

2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 2021, p.1516-1523

2021

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Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints

Journal of electronic packaging, 2025-03, Vol.147 (1)

2025

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Mechanical stress state consideration for enhanced electromigration life prediction in aluminum wire bonds

Microelectronics and reliability, 2023-10, Vol.149, p.115185, Article 115185

2023

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Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

Journal of electronic packaging, 2024-12, Vol.146 (4)

2024

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Reliability evaluation of a novel metal oxide-aluminum glycerol film capacitor using nonlinear degradation modeling with dependency considerations

Quality engineering, 2024-10, Vol.36 (4), p.680-692

2024

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Transient Liquid Phase Bond Acceleration Using Copper Nanowires

Journal of electronic packaging, 2024-07, p.1-26

2024

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Photochemical formation of electrically conductive silver nanowires on polymer scaffolds

Journal of colloid and interface science, 2010-04, Vol.344 (2), p.334-342

2010

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Synthesis of silica-encapsulated myristic acid phase-change-assisted nanocapsules for thermal management applications

Emergent materials (Online), 2024-08, Vol.7 (4), p.1429-1443

2024

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Optimization of Structurally Enhanced Solder Transient Liquid Phase Bonding

2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024, p.1-5

2024

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Methodology to evaluate the thermal performance of the encapsulated phase change materials based nanofluid coolant

2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024, p.1-4

2024

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Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Journal of electronic packaging, 2023-06, Vol.145 (2)

2023

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Induction heating response of iron oxide nanoparticles in varyingly viscous mediums with prediction of brownian heating contribution

Nanoscale and microscale thermophysical engineering, 2020-10, Vol.24 (3-4), p.123-137

2020

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Synthesis and thermal performance of nano-sized paraffin-based titania encapsulated PCMs via sol–gel method

Journal of thermal analysis and calorimetry, 2023-11, Vol.148 (21), p.11629-11640

2023

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Synthesis of ePCMs for thermal management of electronics

2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, p.1-5

2023

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Formation of electrically conductive palladium nanowires on polymer scaffolds by photochemical approach

Colloids and surfaces. A, Physicochemical and engineering aspects, 2010-05, Vol.360 (1), p.129-136

2010

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Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation

Journal of electronic packaging, 2024-12, Vol.146 (4)

2024

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Nanotribological Properties of Graphite Intercalation Compounds: AFM Studies

A Review of Advanced Thermal Management Solutions and the Implications for Integration in High-Voltage Packages

Insulation and Switching Performance Optimization for Partial-Discharge-Free Laminated Busbar in More-Electric Aircraft Applications

Photoinduced Formation of Electrically Conductive Thin Palladium Nanowires on DNA Scaffolds

Tribochemistry as an Alternative Synthesis Pathway

Synthesis of nano-size paraffin/silica-based encapsulated phase change materials of high encapsulation ratio via sol–gel method

Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance

Effect of Stress Interaction on Multi-Stress Accelerated Life Test Plan: Assessment Based on Particle Swarm Optimization

A Partial Discharge Inception Voltage Modeling Approach

PowerSynth-Guided Reliability Optimization of Multi-Chip Power Module

Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints

Mechanical stress state consideration for enhanced electromigration life prediction in aluminum wire bonds

Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

Reliability evaluation of a novel metal oxide-aluminum glycerol film capacitor using nonlinear degradation modeling with dependency considerations

Transient Liquid Phase Bond Acceleration Using Copper Nanowires

Photochemical formation of electrically conductive silver nanowires on polymer scaffolds

Synthesis of silica-encapsulated myristic acid phase-change-assisted nanocapsules for thermal management applications

Optimization of Structurally Enhanced Solder Transient Liquid Phase Bonding

Methodology to evaluate the thermal performance of the encapsulated phase change materials based nanofluid coolant

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Induction heating response of iron oxide nanoparticles in varyingly viscous mediums with prediction of brownian heating contribution

Synthesis and thermal performance of nano-sized paraffin-based titania encapsulated PCMs via sol–gel method

Synthesis of ePCMs for thermal management of electronics

Formation of electrically conductive palladium nanowires on polymer scaffolds by photochemical approach

Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation

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