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Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodeposition

Applied surface science, 2010-02, Vol.256 (8), p.2400-2404

2010

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Redeposition mechanism on silicon oxide layers during selective etching process in 3D NAND manufacture

Journal of Industrial and Engineering Chemistry, 2023, 119(0), , pp.218-225

2023

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Effects of W contents on the solid-state interfacial reactions of Sn/Co-W

Journal of materials science, 2022, Vol.57 (2), p.1403-1415

2022

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Inhibiting effects of the Ni barrier layer on the growth of porous Cu3Sn in 10-μm microbumps

Journal of materials science. Materials in electronics, 2021-07, Vol.32 (13), p.17655-17661

2021

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Growth behavior of tin whisker on SnAg microbump under compressive stress

Scripta materialia, 2018-04, Vol.147, p.114-118

2018

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Effect of Sn surface diffusion on growth behaviors of intermetallic compounds in cu/Ni/SnAg microbumps

Materials characterization, 2020-01, Vol.159, p.110030, Article 110030

2020

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Low-temperature insertion bonding using electroless Cu-Co-P micro-cones array with controllable morphology

Electronic Materials Letters, 2021, 17(6), , pp.459-470

2021

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Self-Healing of Kirkendall Voids and IMC Growth in the Interfacial Reaction of Novel Ni/Cu bi-layer Barrier and Solder

Electronic materials letters, 2024, Vol.20 (5), p.509-516

2024

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The Evolution of Microstructure and Resistance in Electroplated Copper Films by Linear Integrated Laser Scanning Annealing

Electronic Materials Letters, 2021, 17(2), , pp.207-214

2021

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Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing

Electronic Materials Letters, 2020, 16(4), , pp.355-362

2020

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Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

Electronic materials letters, 2022, Vol.18 (1), p.27-35

2022

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Effects of Sn grain size on intermetallic compounds formation in 5 µm diameter Cu/Sn pillar bumps

Journal of materials science. Materials in electronics, 2018-11, Vol.29 (22), p.19484-19490

2018

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Formation Mechanism of Novel Sidewall Intermetallic Compounds in Micron Level Sn/Ni/Cu Bumps

Electronic Materials Letters, 2019, 15(5), , pp.562-571

2019

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Growth behavior of tin whisker and hillock on Cu/Ni/SnAg micro-bumps under high temperature and humidity storage

Materials letters. X, 2021-03, Vol.9, p.100060, Article 100060

2021

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Study on the behaviors of Cu filling in special through-silicon-vias by the simulation of electric field distribution

Microelectronic engineering, 2014-03, Vol.116, p.1-5

2014

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Exceptional electrocatalytic oxygen evolution efficiency and stability from electrodeposited NiFe alloy on Ni foam

Electrochimica acta, 2019-03, Vol.299, p.567-574

2019

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3D hierarchical nanostructured Ni–Co alloy electrodes on porous nickel for hydrogen evolution reaction

International journal of hydrogen energy, 2019-11, Vol.44 (57), p.29946-29955

2019

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Wetting process of electrolyte in high density Cu/Sn micro-bumps electrodepositing

Applied surface science, 2011-02, Vol.257 (8), p.3723-3727

2011

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Preparation of nanocrystals hydroxyapatite/TiO2 compound by hydrothermal treatment

Applied catalysis. B, Environmental, 2006-03, Vol.63 (1-2), p.41-44

2006

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Controlled corrosion behaviors of copper in oxidizer solutions for chemical mechanical polishing: Influence of the decomposition products

Corrosion science, 2024-09, Vol.238, p.112352, Article 112352

2024

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First-principles insight into the pH-dependency of the corrosion inhibition ability of benzotriazole and 1,2,4-triazole for copper in chemical mechanical polishing slurry

Corrosion science, 2024-05, Vol.232, p.112002, Article 112002

2024

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Diffusion barrier performances of thin Mo, Mo-N and Mo/Mo-N films between Cu and Si

Thin solid films, 2005-04, Vol.476 (1), p.142-147

2005

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High-adhesive superhydrophobic 3D nanostructured silver films applied as sensitive, long-lived, reproducible and recyclable SERS substrates

Nanoscale, 2014-08, Vol.6 (16), p.9720-9726

2014

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Study on the Adhesion Between Epoxy Molding Compound and Nanocone-Arrayed Pd Preplated Leadframes

Journal of electronic materials, 2007-12, Vol.36 (12), p.1594-1598

2007

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Growth behavior and formation mechanism of porous Cu3Sn in Cu/Sn solder system

Materials characterization, 2021-08, Vol.178, p.111271, Article 111271

2021

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Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodeposition

Redeposition mechanism on silicon oxide layers during selective etching process in 3D NAND manufacture

Effects of W contents on the solid-state interfacial reactions of Sn/Co-W

Inhibiting effects of the Ni barrier layer on the growth of porous Cu3Sn in 10-μm microbumps

Growth behavior of tin whisker on SnAg microbump under compressive stress

Effect of Sn surface diffusion on growth behaviors of intermetallic compounds in cu/Ni/SnAg microbumps

Low-temperature insertion bonding using electroless Cu-Co-P micro-cones array with controllable morphology

Self-Healing of Kirkendall Voids and IMC Growth in the Interfacial Reaction of Novel Ni/Cu bi-layer Barrier and Solder

The Evolution of Microstructure and Resistance in Electroplated Copper Films by Linear Integrated Laser Scanning Annealing

Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing

Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

Effects of Sn grain size on intermetallic compounds formation in 5 µm diameter Cu/Sn pillar bumps

Formation Mechanism of Novel Sidewall Intermetallic Compounds in Micron Level Sn/Ni/Cu Bumps

Growth behavior of tin whisker and hillock on Cu/Ni/SnAg micro-bumps under high temperature and humidity storage

Study on the behaviors of Cu filling in special through-silicon-vias by the simulation of electric field distribution

Exceptional electrocatalytic oxygen evolution efficiency and stability from electrodeposited NiFe alloy on Ni foam

3D hierarchical nanostructured Ni–Co alloy electrodes on porous nickel for hydrogen evolution reaction

Wetting process of electrolyte in high density Cu/Sn micro-bumps electrodepositing

Preparation of nanocrystals hydroxyapatite/TiO2 compound by hydrothermal treatment

Controlled corrosion behaviors of copper in oxidizer solutions for chemical mechanical polishing: Influence of the decomposition products

First-principles insight into the pH-dependency of the corrosion inhibition ability of benzotriazole and 1,2,4-triazole for copper in chemical mechanical polishing slurry

Diffusion barrier performances of thin Mo, Mo-N and Mo/Mo-N films between Cu and Si

High-adhesive superhydrophobic 3D nanostructured silver films applied as sensitive, long-lived, reproducible and recyclable SERS substrates

Study on the Adhesion Between Epoxy Molding Compound and Nanocone-Arrayed Pd Preplated Leadframes

Growth behavior and formation mechanism of porous Cu3Sn in Cu/Sn solder system

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