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Highly stretchable, electrically conductive textiles fabricated from silver nanowires and cupro fabrics using a simple dipping-drying method

Nano research, 2015-05, Vol.8 (5), p.1604-1614

2015

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Surface wettability, surface free energy, and surface adhesion of microwave plasma-treated Pinus yunnanensis wood

Wood science and technology, 2016-03, Vol.50 (2), p.285-296

2016

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Novel flexible electrically conductive adhesives from functional epoxy, flexibilizers, micro-silver flakes and nano-silver spheres for electronic packaging

Polymer international, 2013-11, Vol.62 (11), p.1644-1651

2013

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Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics

RSC advances, 2014-01, Vol.4 (31), p.15914-15922

2014

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Reliability of flexible electrically conductive adhesives

Polymers for advanced technologies, 2013-01, Vol.24 (1), p.114-117

2013

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High performance electrically conductive adhesives from functional epoxy, micron silver flakes, micron silver spheres and acidified single wall carbon nanotube for electronic package

International journal of adhesion and adhesives, 2013-07, Vol.44, p.220-225

2013

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Using Vinyl Acetate, N‐Hydroxymethyl Acrylamide, and Montmorillonite Intercalated by a Dioctadecyl Dimethyl Ammonium Bromide Surfactant to Prepare Exfoliated Nanocomposite through In Situ Polymerization

Advances in polymer technology, 2017-06, Vol.36 (2), p.211-219

2017

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Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging

International journal of adhesion and adhesives, 2013-07, Vol.44, p.232-236

2013

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Using Ozawa method to study the curing kinetics of electrically conductive adhesives

Journal of thermal analysis and calorimetry, 2014-09, Vol.117 (3), p.1365-1373

2014

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Development of a novel polyvinyl acetate type emulsion curing agent for urea formaldehyde resin

Wood science and technology, 2013, Vol.47 (1), p.105-119

2013

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Novel Fast-Curing Electrically Conductive Adhesives from a Functional Epoxy and Micro Silver Flakes: Preparation, Characterization, and Humid-Thermal Aging

The Journal of adhesion, 2013-09, Vol.89 (9), p.714-726

2013

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High performance heat curing copper-silver powders filled electrically conductive adhesives

Electronic materials letters, 2015-03, Vol.11 (2), p.315-322

2015

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Preparation and characterization of exfoliated nanocomposite of polyvinyl acetate and organic montmorillonite

Advances in polymer technology, 2012-06, Vol.31 (2), p.130-140

2012

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Formulation and Characterization of Electrically Conductive Adhesives for Electronic Packaging

The Journal of adhesion, 2013-01, Vol.89 (1), p.19-36

2013

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Using nano hexagonal boron nitride particles and nano cubic silicon carbide particles to improve the thermal conductivity of electrically conductive adhesives

Electronic Materials Letters, 2013, 9(1), , pp.1-5

2013

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Using a functional epoxy, micron silver flakes, nano silver spheres, and treated single-wall carbon nanotubes to prepare high performance electrically conductive adhesives

Electronic Materials Letters, 2013, 9(3), , pp.299-307

2013

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Using polyurethane, ethylene-vinyl acetate hotmelt, and nano hexagonal boron nitride particles to electrospin high surface adhesion polymer fibers

Electronic Materials Letters, 2014, 10(1), , pp.183-189

2014

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Using the Ozawa method to study the thermally initiated curing kinetics of vinyl ester resin

RSC advances, 2015-01, Vol.5 (4), p.2677-2683

2015

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Pyrolysis properties of exfoliated nanocomposite synthesized by vinyl acetate and organic montmorillonite through different processes

Journal of thermoplastic composite materials, 2013-03, Vol.26 (2), p.156-175

2013

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Structure of intercalated organic montmorillonite and its pyrolysis properties analyzed using the Agrawal integral equation

Science and engineering of composite materials, 2016-07, Vol.23 (4), p.413-421

2016

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Synthesis and Characterization of PVAc-MMT-DOAB Exfoliated Nanocomposites: Reducing Polymerization Time and Water in the Synthesis

Advances in polymer technology, 2013-06, Vol.32 (2), p.np-n/a

2013

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Using the Friedman method to study the thermal degradation kinetics of photonically cured electrically conductive adhesives

Journal of thermal analysis and calorimetry, 2015, Vol.119 (1), p.425-433

2015

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Rheological kinetics of thermo-sensitive supramolecular assemblies from poly(N-isopropyl acrylamide) and adenine-functionalized poly(ethylene oxide) stabilized by complementary multiple hydrogen bonds

The Korea-Australia Rheology Journal, 2014, 26(2), , pp.185-189

2014

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Dynamic Mechanical and Thermal Kinetics of Polyvinyl Acetate Type Emulsions from Vinyl Acetate, N-hydroxymethyl Acrylamide, and Montmorillonite

Advances in polymer technology, 2014-03, Vol.33 (1), p.np-n/a

2014

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Highly stretchable, electrically conductive textiles fabricated from silver nanowires and cupro fabrics using a simple dipping-drying method

Surface wettability, surface free energy, and surface adhesion of microwave plasma-treated Pinus yunnanensis wood

Novel flexible electrically conductive adhesives from functional epoxy, flexibilizers, micro-silver flakes and nano-silver spheres for electronic packaging

Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics

Reliability of flexible electrically conductive adhesives

High performance electrically conductive adhesives from functional epoxy, micron silver flakes, micron silver spheres and acidified single wall carbon nanotube for electronic package

Using Vinyl Acetate, N‐Hydroxymethyl Acrylamide, and Montmorillonite Intercalated by a Dioctadecyl Dimethyl Ammonium Bromide Surfactant to Prepare Exfoliated Nanocomposite through In Situ Polymerization

Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging

Using Ozawa method to study the curing kinetics of electrically conductive adhesives

Development of a novel polyvinyl acetate type emulsion curing agent for urea formaldehyde resin

Novel Fast-Curing Electrically Conductive Adhesives from a Functional Epoxy and Micro Silver Flakes: Preparation, Characterization, and Humid-Thermal Aging

High performance heat curing copper-silver powders filled electrically conductive adhesives

Preparation and characterization of exfoliated nanocomposite of polyvinyl acetate and organic montmorillonite

Formulation and Characterization of Electrically Conductive Adhesives for Electronic Packaging

Using nano hexagonal boron nitride particles and nano cubic silicon carbide particles to improve the thermal conductivity of electrically conductive adhesives

Using a functional epoxy, micron silver flakes, nano silver spheres, and treated single-wall carbon nanotubes to prepare high performance electrically conductive adhesives

Using polyurethane, ethylene-vinyl acetate hotmelt, and nano hexagonal boron nitride particles to electrospin high surface adhesion polymer fibers

Using the Ozawa method to study the thermally initiated curing kinetics of vinyl ester resin

Pyrolysis properties of exfoliated nanocomposite synthesized by vinyl acetate and organic montmorillonite through different processes

Structure of intercalated organic montmorillonite and its pyrolysis properties analyzed using the Agrawal integral equation

Synthesis and Characterization of PVAc-MMT-DOAB Exfoliated Nanocomposites: Reducing Polymerization Time and Water in the Synthesis

Using the Friedman method to study the thermal degradation kinetics of photonically cured electrically conductive adhesives

Rheological kinetics of thermo-sensitive supramolecular assemblies from poly(N-isopropyl acrylamide) and adenine-functionalized poly(ethylene oxide) stabilized by complementary multiple hydrogen bonds

Dynamic Mechanical and Thermal Kinetics of Polyvinyl Acetate Type Emulsions from Vinyl Acetate, N-hydroxymethyl Acrylamide, and Montmorillonite

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