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Process optimization for directed energy deposition of SS316L components

International journal of advanced manufacturing technology, 2020-11, Vol.111 (5-6), p.1387-1400

2020

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Adaptive process control of the changeover point for injection molding process

Journal of low frequency noise, vibration, and active control, 2021-03, Vol.40 (1), p.383-394

2021

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Cutting force validation and volumetric errors compensation of thin workpieces with sensory tool holder

International journal of advanced manufacturing technology, 2020-05, Vol.108 (1-2), p.299-312

2020

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Study of an Online Monitoring Adaptive System for an Injection Molding Process Based on a Nozzle Pressure Curve

Polymers, 2021-02, Vol.13 (4), p.555

2021

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Study of a Compression-Molding Process for Ultraviolet Light-Emitting Diode Exposure Systems via Finite-Element Analysis

Sensors (Basel, Switzerland), 2017-06, Vol.17 (6), p.1392

2017

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Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-03, Vol.3 (3), p.452-458

2013

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Study of Exposure Uniformity of UV LED Exposure System for Wafer-Level Camera Lenses

Applied sciences, 2019-10, Vol.9 (19), p.4110

2019

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Epoxy Molding Compound Filler Clogging Simulation During Integrated Circuit Encapsulation Process

IEEE transactions on components, packaging, and manufacturing technology (2011), 2022-01, Vol.12 (1), p.174-184

2022

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Consideration of different heating lengths of needles with induction heating and resistance system: A novel design of needle module for thermal ablation

Bioelectromagnetics, 2017-04, Vol.38 (3), p.220-226

2017

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Injection Molding Process Control of Servo–Hydraulic System

Applied sciences, 2020-01, Vol.10 (1), p.71

2020

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Temperature prediction for system in package assembly during the reflow soldering process

International journal of heat and mass transfer, 2016-07, Vol.98, p.1-9

2016

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Study on Induction Heating Coil for Uniform Mold Cavity Surface Heating

Advances in mechanical engineering, 2014-01, Vol.6, p.349078

2014

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Observation of fiber orientation in injection molded long-fiber reinforced composites

AIP Conference Proceedings, 2019, Vol.2065 (1)

2019

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Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill

Journal of electronic materials, 2017-08, Vol.46 (8), p.5094-5106

2017

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Modeling of Viscoelastic Behavior of an Epoxy Molding Compound During and After Curing

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-11, Vol.1 (11), p.1755-1760

2011

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Finite element analysis of multi-level interconnection under cyclic thermomechanical loads

Microsystem technologies : sensors, actuators, systems integration, 2018-02, Vol.24 (2), p.1003-1016

2018

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Volume Shrinkage Characterization of Underfill Materials

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-01, Vol.1 (1), p.76-82

2011

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New magnetic tweezers for investigation of the mechanical properties of single DNA molecules

Nanotechnology, 2006-03, Vol.17 (5), p.1217-1224

2006

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Shape and Thermal Effects of Metal Films on Stress-Induced Bending of Micromachined Bilayer Cantilever

Japanese Journal of Applied Physics, 2005-05, Vol.44 (5R), p.3180

2005

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Development of an external-type microinjection molding module for thermoplastic polymer

Journal of materials processing technology, 2007-04, Vol.184 (1), p.163-172

2007

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Integrated microfluidic system for electrochemical sensing of urinary proteins

Biomedical microdevices, 2009-02, Vol.11 (1), p.201-211

2009

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Effects of defrosting period on mold adhesion force of epoxy molding compound

Asia-Pacific journal of chemical engineering, 2009-03, Vol.4 (2), p.161-168

2009

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Microfluidic pH-sensing chips integrated with pneumatic fluid-control devices

Biosensors & bioelectronics, 2006-02, Vol.21 (8), p.1468-1475

2006

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Control of Hot Runner Type Micro Injection Molding Module

IECON 2007 - 33rd Annual Conference of the IEEE Industrial Electronics Society, 2007, p.2928-2933

2007

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Three-Dimensional Optical Focusing Systems Utilizing Stress-Induced Bending of Concave Micromirrors

Japanese Journal of Applied Physics, 2005-10, Vol.44 (10R), p.7571

2005

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Process optimization for directed energy deposition of SS316L components

Adaptive process control of the changeover point for injection molding process

Cutting force validation and volumetric errors compensation of thin workpieces with sensory tool holder

Study of an Online Monitoring Adaptive System for an Injection Molding Process Based on a Nozzle Pressure Curve

Study of a Compression-Molding Process for Ultraviolet Light-Emitting Diode Exposure Systems via Finite-Element Analysis

Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process

Study of Exposure Uniformity of UV LED Exposure System for Wafer-Level Camera Lenses

Epoxy Molding Compound Filler Clogging Simulation During Integrated Circuit Encapsulation Process

Consideration of different heating lengths of needles with induction heating and resistance system: A novel design of needle module for thermal ablation

Injection Molding Process Control of Servo–Hydraulic System

Temperature prediction for system in package assembly during the reflow soldering process

Study on Induction Heating Coil for Uniform Mold Cavity Surface Heating

Observation of fiber orientation in injection molded long-fiber reinforced composites

Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill

Modeling of Viscoelastic Behavior of an Epoxy Molding Compound During and After Curing

Finite element analysis of multi-level interconnection under cyclic thermomechanical loads

Volume Shrinkage Characterization of Underfill Materials

New magnetic tweezers for investigation of the mechanical properties of single DNA molecules

Shape and Thermal Effects of Metal Films on Stress-Induced Bending of Micromachined Bilayer Cantilever

Development of an external-type microinjection molding module for thermoplastic polymer

Integrated microfluidic system for electrochemical sensing of urinary proteins

Effects of defrosting period on mold adhesion force of epoxy molding compound

Microfluidic pH-sensing chips integrated with pneumatic fluid-control devices

Control of Hot Runner Type Micro Injection Molding Module

Three-Dimensional Optical Focusing Systems Utilizing Stress-Induced Bending of Concave Micromirrors

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