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Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints

Materials characterization, 2020-05, Vol.163, p.110287, Article 110287

2020

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Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2019-01, Vol.50 (1), p.480-492

2019

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Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging

Journal of alloys and compounds, 2014-01, Vol.582, p.341-347

2014

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Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux

Journal of manufacturing processes, 2021-02, Vol.62, p.291-301

2021

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Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2016-09, Vol.673, p.167-177

2016

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Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Journal of alloys and compounds, 2015-03, Vol.625, p.241-250

2015

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The geography of intercity technological proximity: evidence from China

International Journal of Urban Sciences, 2023-07, Vol.27 (3), p.355-370

2023

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Effects of rare earth Er additions on microstructure development and mechanical properties of die-cast ADC12 aluminum alloy

Journal of alloys and compounds, 2012-10, Vol.538, p.21-27

2012

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Effects of ultrasonic treatment on mechanical properties and microstructure evolution of the Cu/SAC305 solder joints

Journal of manufacturing processes, 2021-04, Vol.64, p.648-654

2021

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Form-stable phase change materials enhanced photothermic conversion and thermal conductivity by Ag-expanded graphite

Journal of energy storage, 2022-08, Vol.52, p.105060, Article 105060

2022

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Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux

Journal of materials science. Materials in electronics, 2021-10, Vol.32 (19), p.24507-24523

2021

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Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

Materials, 2018-01, Vol.11 (1), p.84

2018

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Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging

Microelectronics and reliability, 2014-08, Vol.54 (8), p.1575-1582

2014

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Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: A recent review

Journal of advanced joining processes, 2022-11, Vol.6, p.100125, Article 100125

2022

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Microstructure evolution and mechanical properties of Sn0.7Cu0.7Bi lead-free solders produced by directional solidification

Journal of alloys and compounds, 2013-07, Vol.566, p.239-245

2013

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Mechanical performance of aligned electrospun polyimide nanofiber belt at high temperature

Materials letters, 2015-02, Vol.140, p.12-15

2015

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Microstructure and tensile properties of Sn–1Cu lead-free solder alloy produced by directional solidification

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2012-10, Vol.556, p.816-823

2012

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Intracranial hemorrhage risk factors of deep brain stimulation for Parkinson’s disease: a 2-year follow-up study

Journal of international medical research, 2020-05, Vol.48 (5), p.300060519856747-300060519856747

2020

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Growth behavior of IMCs layer of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu substrates during aging

Journal of materials science. Materials in electronics, 2019-01, Vol.30 (2), p.1519-1530

2019

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Investigations on elastic properties and electronic structures of α-CoSn3 doped with Ni via first-principles calculations and nano-indentation measurements

Results in physics, 2019-12, Vol.15, p.102607, Article 102607

2019

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Novel learning framework for optimal multi-object video trajectory tracking

Virtual Reality & Intelligent Hardware, 2023-10, Vol.5 (5), p.422-438

2023

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MXene-decorated bio-based porous carbon composite phase change material for superior solar-thermal energy storage and thermal management of electronic components

Journal of materials research and technology, 2023-11, Vol.27, p.1857-1873

2023

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Social Media Support and Funding Assistance for Psychological Injuries in Social Work

Frontiers in public health, 2022-05, Vol.10, p.796769-796769

2022

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Interfacial reaction and growth behavior of IMCs layer between Sn–58Bi solders and a Cu substrate

Journal of materials science. Materials in electronics, 2013-06, Vol.24 (6), p.2027-2034

2013

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Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn–30Sn–2Cu high temperature lead-free solder alloy

Journal of materials science. Materials in electronics, 2020-10, Vol.31 (19), p.16437-16447

2020

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Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints

Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints

Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging

Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux

Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

The geography of intercity technological proximity: evidence from China

Effects of rare earth Er additions on microstructure development and mechanical properties of die-cast ADC12 aluminum alloy

Effects of ultrasonic treatment on mechanical properties and microstructure evolution of the Cu/SAC305 solder joints

Form-stable phase change materials enhanced photothermic conversion and thermal conductivity by Ag-expanded graphite

Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux

Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging

Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: A recent review

Microstructure evolution and mechanical properties of Sn0.7Cu0.7Bi lead-free solders produced by directional solidification

Mechanical performance of aligned electrospun polyimide nanofiber belt at high temperature

Microstructure and tensile properties of Sn–1Cu lead-free solder alloy produced by directional solidification

Intracranial hemorrhage risk factors of deep brain stimulation for Parkinson’s disease: a 2-year follow-up study

Growth behavior of IMCs layer of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu substrates during aging

Investigations on elastic properties and electronic structures of α-CoSn3 doped with Ni via first-principles calculations and nano-indentation measurements

Novel learning framework for optimal multi-object video trajectory tracking

MXene-decorated bio-based porous carbon composite phase change material for superior solar-thermal energy storage and thermal management of electronic components

Social Media Support and Funding Assistance for Psychological Injuries in Social Work

Interfacial reaction and growth behavior of IMCs layer between Sn–58Bi solders and a Cu substrate

Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn–30Sn–2Cu high temperature lead-free solder alloy

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