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Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)

Microelectronics and reliability, 2021-12, Vol.127, p.114412, Article 114412

2021

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Thermodynamics for regular black holes as intermediate thermodynamic states and quasinormal frequencies

Journal of cosmology and astroparticle physics, 2024-03, Vol.2024 (3), p.53

2024

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A regular black hole as the final state of evolution of a singular black hole

The European physical journal. C, Particles and fields, 2023-11, Vol.83 (11), p.1047-25, Article 1047

2023

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Wrinkled 2D Materials: A Versatile Platform for Low‐Threshold Stretchable Random Lasers

Advanced materials (Weinheim), 2017-11, Vol.29 (43), p.n/a

2017

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Low Temperature Copper-Copper Bonding of Non-Planarized Copper Pillar With Passivation

IEEE electron device letters, 2020-08, Vol.41 (8), p.1229-1232

2020

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Low-Temperature (70°C) Cu-to-Cu Direct Bonding by Capping Metal Layers

IEEE electron device letters, 2021-10, Vol.42 (10), p.1524-1527

2021

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Symptomatogenic zone and network of oroalimentary automatisms in mesial temporal lobe epilepsy

Epilepsia (Copenhagen), 2019-06, Vol.60 (6), p.1150-1159

2019

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Investigation of Metal Interconnect for Wafer-Level and Sealable Miniaturized MEMS Encapsulation

IEEE transactions on electron devices, 2021-11, Vol.68 (11), p.5779-5783

2021

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Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through-Silicon Via

IEEE transactions on electron devices, 2021-07, Vol.68 (7), p.3520-3525

2021

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Interactive Color‐Changing Electronic Skin Based on Flexible and Piezoelectrically Tunable Quantum Dots Light‐Emitting Diodes

Advanced optical materials, 2020-04, Vol.8 (7), p.n/a

2020

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Motor cortex stimulation: a systematic literature-based analysis of effectiveness and case series experience

BMC neurology, 2019-03, Vol.19 (1), p.48-48, Article 48

2019

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Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation

IEEE journal of the Electron Devices Society, 2021, Vol.9, p.868-875

2021

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Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications

IEEE journal of the Electron Devices Society, 2024, Vol.12, p.96-103

2024

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Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D Integration

IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-01, Vol.11 (1), p.36-42

2021

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Single-Crystal Islands (SCI) for Monolithic 3-D and Back-End-of-Line FinFET Circuits

IEEE transactions on electron devices, 2021-10, Vol.68 (10), p.5257-5262

2021

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Ultrathin Glass-Based Wafer-Level Integration for Miniaturized Hermetic MEMS Application

IEEE transactions on components, packaging, and manufacturing technology (2011), 2023-01, Vol.13 (1), p.120-126

2023

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Investigation of Low-Temperature Cu-Cu Direct Bonding With Pt Passivation Layer in 3-D Integration

IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-04, Vol.11 (4), p.573-578

2021

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Associated factors with stimulation induced seizures and the relevance with surgical outcomes

Clinical neurology and neurosurgery, 2023-09, Vol.232, p.107865, Article 107865

2023

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Stretchable and Broadband Cavity‐Free Lasers Based on All 2D Metamaterials

Advanced optical materials, 2020-04, Vol.8 (7), p.n/a

2020

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Multimodality Image Post-processing in Detection of Extratemporal MRI-Negative Cortical Dysplasia

Frontiers in neurology, 2018-06, Vol.9, p.450-450

2018

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Seizure and cognitive outcomes of posterior quadrantic disconnection: a series of 12 pediatric patients

British journal of neurosurgery, 2020-12, Vol.34 (6), p.677-682

2020

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Clinical Value of Machine Learning in the Automated Detection of Focal Cortical Dysplasia Using Quantitative Multimodal Surface-Based Features

Frontiers in neuroscience, 2019-01, Vol.12, p.1008-1008

2019

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Long-term seizure outcome with the surgically remediable syndrome of frontal lobe epilepsy associated with superior frontal sulcus-related dysplasia

Frontiers in neurology, 2023-03, Vol.14, p.1096712-1096712

2023

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An Arbitrary Color Light Emitter

Advanced materials (Weinheim), 2017-01, Vol.29 (3), p.np-n/a

2017

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TCAM-GNN: A TCAM-Based Data Processing Strategy for GNN Over Sparse Graphs

IEEE transactions on emerging topics in computing, 2024-07, Vol.12 (3), p.891-904

2024

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Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)

Thermodynamics for regular black holes as intermediate thermodynamic states and quasinormal frequencies

A regular black hole as the final state of evolution of a singular black hole

Wrinkled 2D Materials: A Versatile Platform for Low‐Threshold Stretchable Random Lasers

Low Temperature Copper-Copper Bonding of Non-Planarized Copper Pillar With Passivation

Low-Temperature (70°C) Cu-to-Cu Direct Bonding by Capping Metal Layers

Symptomatogenic zone and network of oroalimentary automatisms in mesial temporal lobe epilepsy

Investigation of Metal Interconnect for Wafer-Level and Sealable Miniaturized MEMS Encapsulation

Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through-Silicon Via

Interactive Color‐Changing Electronic Skin Based on Flexible and Piezoelectrically Tunable Quantum Dots Light‐Emitting Diodes

Motor cortex stimulation: a systematic literature-based analysis of effectiveness and case series experience

Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation

Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications

Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D Integration

Single-Crystal Islands (SCI) for Monolithic 3-D and Back-End-of-Line FinFET Circuits

Ultrathin Glass-Based Wafer-Level Integration for Miniaturized Hermetic MEMS Application

Investigation of Low-Temperature Cu-Cu Direct Bonding With Pt Passivation Layer in 3-D Integration

Associated factors with stimulation induced seizures and the relevance with surgical outcomes

Stretchable and Broadband Cavity‐Free Lasers Based on All 2D Metamaterials

Multimodality Image Post-processing in Detection of Extratemporal MRI-Negative Cortical Dysplasia

Seizure and cognitive outcomes of posterior quadrantic disconnection: a series of 12 pediatric patients

Clinical Value of Machine Learning in the Automated Detection of Focal Cortical Dysplasia Using Quantitative Multimodal Surface-Based Features

Long-term seizure outcome with the surgically remediable syndrome of frontal lobe epilepsy associated with superior frontal sulcus-related dysplasia

An Arbitrary Color Light Emitter

TCAM-GNN: A TCAM-Based Data Processing Strategy for GNN Over Sparse Graphs

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