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Application of AI in Multilevel Pain Assessment Using Facial Images: Systematic Review and Meta-Analysis

Journal of medical Internet research, 2024-04, Vol.26 (9), p.e51250-e51250

2024

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Correction: Application of AI in Multilevel Pain Assessment Using Facial Images: Systematic Review and Meta-Analysis

Journal of medical Internet research, 2024-04, Vol.26, p.e59628-e59628

2024

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Super-hydrophilicity to super-hydrophobicity transition of a surface with Ni micro–nano cones array

Applied surface science, 2012-12, Vol.263, p.821-824

2012

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Electrodeposited Palladium Coating on Co Micro-Nano Cones Array for Low-Temperature Solid-State Bonding

Electronic Materials Letters, 2024, 20(3), , pp.326-336

2024

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Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodeposition

Applied surface science, 2010-02, Vol.256 (8), p.2400-2404

2010

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A facile process for preparing superhydrophobic nickel films with stearic acid

Surface & coatings technology, 2013-09, Vol.231, p.88-92

2013

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Mitigation and Mechanism of Tin Whisker on Micro-bumps by Hard and Soft Underfills

Electronic materials letters, 2022-11, Vol.18 (6), p.547-558

2022

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Effect of Co-W and Co-Fe-W Diffusion Barriers on the Reliability of the Solder/Cu Interface during Reflow Conditions

Electronic materials letters, 2024, Vol.20 (5), p.517-524

2024

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Effects of W contents on the solid-state interfacial reactions of Sn/Co-W

Journal of materials science, 2022, Vol.57 (2), p.1403-1415

2022

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Inhibiting effects of the Ni barrier layer on the growth of porous Cu3Sn in 10-μm microbumps

Journal of materials science. Materials in electronics, 2021-07, Vol.32 (13), p.17655-17661

2021

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Study on the properties of Sn–9Zn– xCr lead-free solder

Journal of alloys and compounds, 2008-07, Vol.460 (1), p.478-484

2008

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Electrodeposited nanostructured cobalt film and its dual modulation of both superhydrophobic property and adhesiveness

Applied surface science, 2015-01, Vol.324, p.319-323

2015

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Study on melt properties, microstructure, tensile properties of low Ag content Sn–Ag–Zn Lead-free solders

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2012-10, Vol.556, p.885-890

2012

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Facile synthesis of petal-like nanocrystalline Co3O4 film using direct high-temperature oxidation

Journal of materials science, 2019-05, Vol.54 (10), p.7922-7930

2019

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Effect of Sn surface diffusion on growth behaviors of intermetallic compounds in cu/Ni/SnAg microbumps

Materials characterization, 2020-01, Vol.159, p.110030, Article 110030

2020

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Low-temperature insertion bonding using electroless Cu-Co-P micro-cones array with controllable morphology

Electronic Materials Letters, 2021, 17(6), , pp.459-470

2021

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Preparation and characterization of a titanium-substituted hydroxyapatite photocatalyst

Journal of molecular catalysis. A, Chemical, 2007-04, Vol.267 (1), p.79-85

2007

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Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing

Electronic Materials Letters, 2020, 16(4), , pp.355-362

2020

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Superhydrophobic nickel films fabricated by electro and electroless deposition

Applied surface science, 2012-02, Vol.258 (8), p.3643-3646

2012

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Effects of Sn grain size on intermetallic compounds formation in 5 µm diameter Cu/Sn pillar bumps

Journal of materials science. Materials in electronics, 2018-11, Vol.29 (22), p.19484-19490

2018

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Low-temperature solid state bonding method based on surface Cu–Ni alloying microcones

Applied surface science, 2013-03, Vol.268, p.368-372

2013

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Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation

Microelectronics and reliability, 2012-06, Vol.52 (6), p.1157-1164

2012

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Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution

Journal of electronic materials, 2011-07, Vol.40 (7), p.1556-1562

2011

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Structural control of a cobalt nanocone array grown by directional electrodeposition

CrystEngComm, 2010-01, Vol.12 (1), p.2799-282

2010

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Depressing effect of 0.1 wt.% Cr addition into Sn–9Zn solder alloy on the intermetallic growth with Cu substrate during isothermal aging

Materials characterization, 2010-03, Vol.61 (3), p.355-361

2010

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Application of AI in Multilevel Pain Assessment Using Facial Images: Systematic Review and Meta-Analysis

Correction: Application of AI in Multilevel Pain Assessment Using Facial Images: Systematic Review and Meta-Analysis

Super-hydrophilicity to super-hydrophobicity transition of a surface with Ni micro–nano cones array

Electrodeposited Palladium Coating on Co Micro-Nano Cones Array for Low-Temperature Solid-State Bonding

Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodeposition

A facile process for preparing superhydrophobic nickel films with stearic acid

Mitigation and Mechanism of Tin Whisker on Micro-bumps by Hard and Soft Underfills

Effect of Co-W and Co-Fe-W Diffusion Barriers on the Reliability of the Solder/Cu Interface during Reflow Conditions

Effects of W contents on the solid-state interfacial reactions of Sn/Co-W

Inhibiting effects of the Ni barrier layer on the growth of porous Cu3Sn in 10-μm microbumps

Study on the properties of Sn–9Zn– xCr lead-free solder

Electrodeposited nanostructured cobalt film and its dual modulation of both superhydrophobic property and adhesiveness

Study on melt properties, microstructure, tensile properties of low Ag content Sn–Ag–Zn Lead-free solders

Facile synthesis of petal-like nanocrystalline Co3O4 film using direct high-temperature oxidation

Effect of Sn surface diffusion on growth behaviors of intermetallic compounds in cu/Ni/SnAg microbumps

Low-temperature insertion bonding using electroless Cu-Co-P micro-cones array with controllable morphology

Preparation and characterization of a titanium-substituted hydroxyapatite photocatalyst

Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing

Superhydrophobic nickel films fabricated by electro and electroless deposition

Effects of Sn grain size on intermetallic compounds formation in 5 µm diameter Cu/Sn pillar bumps

Low-temperature solid state bonding method based on surface Cu–Ni alloying microcones

Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation

Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution

Structural control of a cobalt nanocone array grown by directional electrodeposition

Depressing effect of 0.1 wt.% Cr addition into Sn–9Zn solder alloy on the intermetallic growth with Cu substrate during isothermal aging

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